| Literature DB >> 29068404 |
An-Na Choi1, Ji-Hye Lee2, Sung-Ae Son3, Kyoung-Hwa Jung4, Yong Hoon Kwon5, Jeong-Kil Park6.
Abstract
The effects of dentin wetness on the bond strength and adhesive interface morphology of universal adhesives have been investigated using micro-tensile bond strength (μTBS) testing and confocal laser scanning microscopy (CLSM). Seventy-two human third molars were wet ground to expose flat dentin surfaces. They were divided into three groups according to the air-drying time of the dentin surfaces: 0 (without air drying), 5, and 10 s. The dentin surfaces were then treated with three universal adhesives: G-Premio Bond, Single Bond Universal, and All-Bond Universal in self-etch or etch-and-rinse mode. After composite build up, a μTBS test was performed. One additional tooth was prepared for each group by staining the adhesives with 0.01 wt % of Rhodamine B fluorescent dye for CLSM analysis. The data were analyzed statistically using ANOVA and Tukey's post hoc tests (α = 0.05). Two-way ANOVA showed significant differences among the adhesive systems and dentin moisture conditions. An interaction effect was also observed (p < 0.05). One-way ANOVA showed that All-Bond Universal was the only material influenced by the wetness of the dentin surfaces. Wetness of the dentin surface is a factor influencing the micro-tensile bond strength of universal adhesives.Entities:
Keywords: adhesive resins; bonding; confocal laser scanning microscopy; dentin; micro-tensile strength
Year: 2017 PMID: 29068404 PMCID: PMC5706171 DOI: 10.3390/ma10111224
Source DB: PubMed Journal: Materials (Basel) ISSN: 1996-1944 Impact factor: 3.623
Microtensile bond strength values (MPa) means and standard deviation for all experimental groups.
| GPB | 33.2 ± 3.3 a | 35.2 ± 4.5 a | 34.1 ± 2.4 a | 0.868 |
| SBU | 31.8 ± 3.9 a | 35.4 ± 4.9 a | 32.1 ± 4.0 a | 0.105 |
| ABU | 32.0 ± 3.1 a | 31.8 ± 2.6 a | 23.4 ± 2.2 b | <0.001 |
| GPB | 32.8 ± 4.3 a | 32.4 ± 2.6 a | 33.4 ± 1.9 a | 0.760 |
| SBU | 29.0 ± 3.6 a | 31.1 ± 4.9 a | 28.2 ± 2.8 a | 0.226 |
| ABU | 17.4 ± 2.6 a | 22.7 ± 5.5 b | 22.8 ± 2.5 b | 0.003 |
GBU: G-Premio bond; SBU: Single bond universal; ABU: All-bond universal. Different superscript lowercase letters indicate significant differences between rows (p < 0.05); i.e., excluding the premature failure samples and those broken within dentine or with glue covering the binding site.
Figure 1Micro-tensile bond strength (μTBS) means obtained in etch-and-rinse mode. GPB: G-Premio Bond; SBU: Single Bond Universal; ABU: All Bond Universal.
Figure 2μTBS means obtained in self-etch mode. GPB: G-Premio Bond; SBU: Single Bond Universal; ABU: All Bond Universal.
Figure 3Distribution of the failure modes (%) in etch-and rinse mode. GB0: 0 s group for G-Premio Bond; GB5: 5 s group for G-Premio Bond; GB10: 10 s group for G-Premio Bond; SB0: 0 s group for Single Bond Universal; SB5: 5 s group for Single Bond Universal; SB10: 10 s group for Single Bond Universal; AB0: 0 s group for All Bond Universal; AB5: 5 s group for All Bond Universal; AB10: 10 s group for All Bond Universal. PF: premature failure; M: mixed failure; C: cohesive failure; A: adhesive failure.
Figure 4Distribution of the failure mode (%) in self-etch mode. GB0: 0 s group for G-Premio Bond; GB5: 5 s group for G-Premio Bond; GB10: 10 s group for G-Premio Bond; SB0: 0 s group for Single Bond Universal; SB5: 5 s group for Single Bond Universal; SB10: 10 s group for Single Bond Universal; AB0: 0 s group for All Bond Universal; AB5: 5 s group for All Bond Universal; AB10: 10 s group for All Bond Universal. PF: premature failure; M: mixed failure; C: cohesive failure; A: adhesive failure.
Figure 5Confocal laser scanning microscopy (CLSM) images of the universal adhesives interfaces in etch-and-rinse mode. (A–C) correspond respectively to GB0, GB5, and GB10; (D–F) correspond respectively to SB0, SB5, and SB10; (G–I) correspond respectively to AB0, AB5, and AB10.
Figure 6CLSM images of the universal adhesives interfaces in self-etch mode. (A–C) correspond to GB0, GB5, and GB10, respectively; (D–F) correspond to SB0, SB5, and SB10, respectively; (G–I) correspond to AB0, AB5, and AB10, respectively.
Adhesive composition and application procedure (information supplied in the safety data sheets and material instructions).
| Material | pH | Composition | Application Mode | |
|---|---|---|---|---|
| Self-Etch | Etch-and-Rinse | |||
| G-Premio Bond (GPB) GC Corp. Tokyo, Japan P | 1.5 | 10-MDP, phosphoric acid ester monomer, dimethacrylate, 4-MET, MEPS, acetone, silicon dioxide, initiators | 1. The only difference is the dentin drying time: 0, 5, and 10 s | 1. Apply etchant for 15 s |
| Single-bond Universal (SBU) 3M ESPE Seefeld, Germany | 2.7 | 10-MDP, phosphoric acid ester monomer, HEMA, silane, dimethacrylate, Vitrebond copolymer, filler, ethanol, water, initiators, silane | 1. The only difference is the dentin drying time: 0, 5, and 10 s | 1. Apply etchant for 15 s |
| All-Bond Universal (ABU) Bisco Schaumburg, USA | 3.2 | 10-MDP, phosphoric acid ester monomer, Bis-GMA, HEMA, ethanol, water, initiators | 1. The only difference is the dentin drying time: 0, 5, and 10 s | 1. Apply etchant for 15 s |
Bis-GMA: bisphenol glycidyl methacrylate; HEMA: 2-hydroxyethyl methacrylate; MDP: methacryloyloxydecyl dihydrogen phosphate; 4-MET: 4 methacryloxyethyltrimellitate anhydride; MEPS: Methacryloyloxyalkyl thiophosphate.