Electrical Isolation Performance of Microgasket Technology for Implant Packaging.

High-channel-count neural interfaces are typically packaged by being permanently bonded to their packaged electronics followed by encapsulation. Such interfaces are often intimately integrated into neural tissue, their removal to replace the battery or upgrade electronics is not undesirable. Gaskets are widely used to provide liquid/electrical isolation and to seal the connection between two or more mating parts. Pressure-driven microgaskets are well established in the field of microfluidics. Although rematable microgaskets for fluidic interconnects exist, the use of microgaskets for electrical isolation have not been demonstrated. Our approach is to electrically isolate 2-D arrays of contact pads using a compressible silicone microgasket. Electrochemical impedance spectroscopy (EIS) was used to quantify the electrical isolation of the microgasket on contact pads, which were formed in a polyimide flex circuit, as a function of frequency after being soaked in saline. Experiments have shown that the compressed sub-millimeter PDMSe microgasket can provide excellent isolation (i.e., >30 MΩ at 1 KHz) that is comparable to the other more conventional packaging methods, such as encapsulation in polydimethylsiloxane elastomer (PDMSe) or parylene-C. Our microgasket-based approach should be scalable to high channel counts and high channel densities enabling much smaller and higher-performance neural implants.