Literature DB >> 31362277

Electrical connectors for neural implants: design, state of the art and future challenges of an underestimated component.

Julia Koch1, Martin Schuettler, Cristian Pasluosta, Thomas Stieglitz.   

Abstract

Technological advances in electrically active implantable devices have increased the complexity of hardware design. In particular, the increasing number of stimulation and recording channels requires innovative approaches for connectors that interface electrodes with the implant circuitry.
OBJECTIVE: This work aims to provide a common theoretical ground for implantable connector development with a focus on neural applications. APPROACH: Aspects and experiences from several disciplines are compiled from an engineering perspective to discuss the state of the art of connector solutions. Whenever available, we also present general design guidelines. MAIN
RESULTS: Degradation mechanisms, material stability and design rules in terms of biocompatibility and biostability are introduced. Considering contact physics, we address the design and characterization of the contact zone and review contaminants, wear and contact degradation. For high-channel counts and body-like environments, insulation can be even more crucial than the electrical connection itself. Therefore, we also introduce the requirements for electrical insulation to prevent signal loss and distortion and discuss its impact on the practical implementation. SIGNIFICANCE: A final review is dedicated to the state of the art connector concepts, their mechanical setup, electrical performance and the interface to other implant components. We conclude with an outlook for possible approaches for the future generations of implants.

Year:  2019        PMID: 31362277     DOI: 10.1088/1741-2552/ab36df

Source DB:  PubMed          Journal:  J Neural Eng        ISSN: 1741-2552            Impact factor:   5.379


  7 in total

1.  Microgaskets for High-Channel-Density Reconnectable Implantable Packaging.

Authors:  Paritosh Rustogi; Jack W Judy
Journal:  J Microelectromech Syst       Date:  2022-03-22       Impact factor: 2.829

2.  Electrical Isolation Performance of Microgasket Technology for Implant Packaging.

Authors:  Paritosh Rustogi; Jack W Judy
Journal:  Electron Compon Technol Conf       Date:  2020-08-05

3.  Responsive manipulation of neural circuit pathology by fully implantable, front-end multiplexed embedded neuroelectronics.

Authors:  Zifang Zhao; Claudia Cea; Jennifer N Gelinas; Dion Khodagholy
Journal:  Proc Natl Acad Sci U S A       Date:  2021-05-18       Impact factor: 11.205

4.  MRI-Compatible and Conformal Electrocorticography Grids for Translational Research.

Authors:  Florian Fallegger; Giuseppe Schiavone; Elvira Pirondini; Fabien B Wagner; Nicolas Vachicouras; Ludovic Serex; Gregory Zegarek; Adrien May; Paul Constanthin; Marie Palma; Mehrdad Khoshnevis; Dirk Van Roost; Blaise Yvert; Grégoire Courtine; Karl Schaller; Jocelyne Bloch; Stéphanie P Lacour
Journal:  Adv Sci (Weinh)       Date:  2021-03-08       Impact factor: 16.806

5.  Ambipolar inverters based on cofacial vertical organic electrochemical transistor pairs for biosignal amplification.

Authors:  Reem B Rashid; Weiyuan Du; Sophie Griggs; Iuliana P Maria; Iain McCulloch; Jonathan Rivnay
Journal:  Sci Adv       Date:  2021-09-08       Impact factor: 14.136

Review 6.  Poly(3,4-ethylenedioxythiophene)-Based Neural Interfaces for Recording and Stimulation: Fundamental Aspects and In Vivo Applications.

Authors:  Michele Bianchi; Anna De Salvo; Maria Asplund; Stefano Carli; Michele Di Lauro; Andreas Schulze-Bonhage; Thomas Stieglitz; Luciano Fadiga; Fabio Biscarini
Journal:  Adv Sci (Weinh)       Date:  2022-02-21       Impact factor: 17.521

Review 7.  Towards the clinical translation of optogenetic skeletal muscle stimulation.

Authors:  Lili A Gundelach; Marc A Hüser; Dirk Beutner; Patrick Ruther; Tobias Bruegmann
Journal:  Pflugers Arch       Date:  2020-05-15       Impact factor: 3.657

  7 in total

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