Literature DB >> 35663544

Microgaskets for High-Channel-Density Reconnectable Implantable Packaging.

Paritosh Rustogi1, Jack W Judy2.   

Abstract

Demands for implantable bioelectronic devices to increase the number of channels for greater functional capacity and resolution, shrink implant size to minimize tissue response and patient burden, and support battery changes and electronics upgrades for long-term operational viability, cannot be met with existing implant-connector technology. In this paper we describe our novel approach to develop a rematable high-channel-density implant-connector technology, with a focus on the design, fabrication, and characterization of its microgasket. The microgaskets made of polydimethylsiloxane elastomer (PDMSe) have achieved much better electrical isolation for neural stimulation (~5 MΩ at 10 kHz) compared with conventional implant connectors (50 kΩ at 10 kHz), despite a 200-fold increase in channel density (conventional: ~0.0644 ch/mm2, microgasket: ~12.8 ch/mm2). The microgaskets also achieved high electrical isolation for neural recording (i.e., ~35 MΩ at 1 kHz) at the same high channel density. When mechanically compressed the microscale vias in the PDMSe microgaskets deform laterally, which could damage or enhance gasket-traversing conductive spring elements in each microscale via depending on their design. We have demonstrated that by lowering the height-to-width aspect ratio of the gasket vias, they can maintain their shape under clamping pressures high enough to achieve high isolation.

Entities:  

Keywords:  Channel Isolation; Implantable Connectors; Microgaskets; Neural interfaces

Year:  2022        PMID: 35663544      PMCID: PMC9162095          DOI: 10.1109/jmems.2022.3159487

Source DB:  PubMed          Journal:  J Microelectromech Syst        ISSN: 1057-7157            Impact factor:   2.829


  10 in total

Review 1.  Implantable biomedical microsystems for neural prostheses.

Authors:  Thomas Stieglitz; Martin Schuettler; Klaus Peter Koch
Journal:  IEEE Eng Med Biol Mag       Date:  2005 Sep-Oct

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Authors:  James D Weiland; Wentai Liu; Mark S Humayun
Journal:  Annu Rev Biomed Eng       Date:  2005       Impact factor: 9.590

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Authors:  Christopher R Butson; Cameron C McIntyre
Journal:  Brain Stimul       Date:  2008-01       Impact factor: 8.955

4.  Electrical connectors for neural implants: design, state of the art and future challenges of an underestimated component.

Authors:  Julia Koch; Martin Schuettler; Cristian Pasluosta; Thomas Stieglitz
Journal:  J Neural Eng       Date:  2019-10-29       Impact factor: 5.379

5.  Speech discrimination in deaf subjects with cochlear implants.

Authors:  D K Eddington
Journal:  J Acoust Soc Am       Date:  1980-09       Impact factor: 1.840

6.  3D printed high density, reversible, chip-to-chip microfluidic interconnects.

Authors:  Hua Gong; Adam T Woolley; Gregory P Nordin
Journal:  Lab Chip       Date:  2018-02-13       Impact factor: 6.799

7.  Electrical Isolation Performance of Microgasket Technology for Implant Packaging.

Authors:  Paritosh Rustogi; Jack W Judy
Journal:  Electron Compon Technol Conf       Date:  2020-08-05

8.  in vitro Reactive-Accelerated-Aging (RAA) Assessment of Tissue-Engineered Electronic Nerve Interfaces (TEENI).

Authors:  Cary A Kuliasha; Jack W Judy
Journal:  Annu Int Conf IEEE Eng Med Biol Soc       Date:  2018-07

9.  In Vitro Reactive-Accelerated-Aging Assessment of Anisotropic Conductive Adhesive and Back-End Packaging for Electronic Neural Interfaces.

Authors:  Cary A Kuliasha; Jack W Judy
Journal:  Annu Int Conf IEEE Eng Med Biol Soc       Date:  2019-07

Review 10.  Future developments in brain-machine interface research.

Authors:  Mikhail A Lebedev; Andrew J Tate; Timothy L Hanson; Zheng Li; Joseph E O'Doherty; Jesse A Winans; Peter J Ifft; Katie Z Zhuang; Nathan A Fitzsimmons; David A Schwarz; Andrew M Fuller; Je Hi An; Miguel A L Nicolelis
Journal:  Clinics (Sao Paulo)       Date:  2011       Impact factor: 2.365

  10 in total

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