| Literature DB >> 31662709 |
Xiaoxiang He1, Jingyao Sun1, Jian Zhuang1, Hong Xu1, Ying Liu2, Daming Wu1,2.
Abstract
Microneedle (MN) delivery system has been greatly developed to deliver drugs into the skin painlessly, noninvasively, and safety. In the past several decades, various types of MNs have been developed by the newer producing techniques. Briefly, as for the morphologically, MNs can be classified into solid, coated, dissolved, and hollow MN, based on the transdermal drug delivery methods of "poke and patch," "coat and poke," "poke and release," and "poke and flow," respectively. Microneedles also have other characteristics based on the materials and structures. In addition, various manufacturing techniques have been well-developed based on the materials. In this review, the materials, structures, morphologies, and fabricating methods of MNs are summarized. A separate part of the review is used to illustrate the application of MNs to deliver vaccine, insulin, lidocaine, aspirin, and other drugs. Finally, the review ends up with a perspective on the challenges in research and development of MNs, envisioning the future development of MNs as the next generation of drug delivery system.Entities:
Keywords: drug delivery methods; fabricating methods; materials; microneedle; structures; transdermal drug delivery
Year: 2019 PMID: 31662709 PMCID: PMC6794664 DOI: 10.1177/1559325819878585
Source DB: PubMed Journal: Dose Response ISSN: 1559-3258 Impact factor: 2.658
Figure 1.Diagrams showing various microneedle drug delivery approaches. (A) Solid microneedles, for skin pretreatment to create microchannels, followed by the application of transdermal patch; (B) coated microneedles, for deposition of drug formulations into the skin, followed by removal of microneedles; (C) dissolving microneedles, incorporated into the substrate of microneedles, remaining in the skin and dissolving over time to release the drugs; and (D) hollow microneedles, for inserted into the skin and continuous infusion of drug through the created microchannels.
Figure 2.Illustration of coating approaches used to coat microneedles: (A) dip-coating, (B) gas-jet drying, (C) spray coating, and (D) electrohydrodynamic atomization–based process, and (E) ink-jet printing. (Images reprinted with permission from Haj-Ahmad et al.[9])
Figure 3.(A) Out-of-plane and (B) in-plane microneedles.
Overview of Microneedle Arrays Manufactured by Various Methods Based on Materials.
| Method/Material | Microneedles Type | Structure | References |
|---|---|---|---|
| Inorganic materials | |||
| Wet-etching/silicon | Solid MN | Out-of-plane |
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| Wet-etching/silicon | Solid MN | Out-of-plane |
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| Wet-etching/silicon | Solid MN | Out-of-plane |
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| Wet-etching/silicon | Hollow MN | Out-of-plane |
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| Dry-etching/silicon | Solid MN | In-plane |
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| Dry-etching/silicon | Hollow MN | Out-of-plane |
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| Dry-etching/silicon | Solid MN | Out-of-plane |
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| Reactive ion etching/silicon | Solid MN | Out-of-plane |
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| Deep reactive ion etching/silicon | Hollow MN | Out-of-plane |
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| Deep reactive ion etching/silicon | Solid MN | In-plane |
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| Deep reactive ion etching/silicon | Solid MN | Out-of-plane |
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| Deep reactive ion etching/silicon | Hollow MN | Out-of-plane |
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| Electrochemical micromachining/silicon | Hollow MN | Out-of-plane |
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| Micromolding/ceramic | Solid MN | Out-of-plane |
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| Micromolding/bioceramic | Solid MN | Out-of-plane |
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| Micromolding/bioceramic | Solid MN | Out-of-plane |
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| Micromolding/bioceramic | Solid MN | Out-of-plane |
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| Two photon polymerization micromolding and pulsed laser deposition/ceramic | Solid MN | Out-of-plane |
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| Metal MNs | |||
| Micromolding/Ti | Solid MN | Out-of-plane |
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| Wire-electrode cutting and wet-etching/Ti | Solid MN | Out-of-plane |
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| Dry-etching/Ti | Solid MN | In-plane |
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| Sputter deposition/Ti | Hollow MN | Out-of-plane |
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| Laser cutting/Ti | Solid MN | In-plane |
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| Laser cutting/SS | Solid MN | Out-of-plane |
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| Laser cutting/SS | Solid MN | Out-of-plane |
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| Laser cutting/SS | Solid MN | In-plane |
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| Laser cutting/SS | Solid MN | In-plane |
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| Laser cutting/SS | Coated MN | In-plane |
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| EDM and femtosecond laser machining/SS | Hollow MN | Out-of-plane |
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| EDM/SS | Solid MN | Out-of-plane |
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| Mechanical dicing and electrochemical corrosion/SS | Solid MN | Out-of-plane |
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| Micromilling/SS | Solid MN | Out-of-plane |
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| Electroplating/Ni | Solid MN | Out-of-plane |
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| Electrodeposition/Ni | Hollow MN | Out-of-plane |
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| Electrodeposition/Ni | Hollow MN | Out-of-plane |
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| Polymeric MNs | |||
| Hot embossing/PLLA | Coated MN | Out-of-plane |
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| Hot embossing/PMMA | Solid MN | Out-of-plane |
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| Hot embossing/PLA | Coated MN/dissolving MN | Out-of-plane |
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| Hot embossing/PLGA | Dissolving MN | Out-of-plane |
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| Hot embossing/PCL | Dissolving MN | Out-of-plane |
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| Injection/PMMA | Solid MN | Out-of-plane |
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| Injection/PGA | Dissolving MN | Out-of-plane |
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| Injection/nylon-6 | Solid MN | Out-of-plane |
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| Injection/liquid crystal polymer | Coated MN | Out-of-plane |
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| Injection/polycarbonate | Hollow MN | Out-of-plane |
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| Micromolding/PLA | Dissolving MN | Out-of-plane |
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| Micromolding/PGA, PLA, PLGA | Dissolving MN | Out-of-plane |
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| Micromolding/PCL | Dissolving MN | Out-of-plane |
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| Micromolding/PVA | Dissolving MN | Out-of-plane |
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| Casting/mixture of PVA and PVP | Dissolving MN | Out-of-plane |
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| Casting/mixture of PVA, dextran, and CMC | Dissolving MN | Out-of-plane |
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| Casting/mixture of CMC and AP | Dissolving MN | Out-of-plane |
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| Casting/PGA | Dissolving MN | Out-of-plane |
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| Photolithography/PEGDA | Solid MN | Out-of-plane |
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| Photolithography/PEGDA | Solid MN | Out-of-plane |
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| Photolithography/PEGDA | Solid MN | Out-of-plane |
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| Heat imprint lithography/PLA | Dissolving MN | Out-of-plane |
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| Laser writing/SU-8 | Hollow MN | Out-of-plane |
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| 3-Dimensional printing/PLA | Dissolving MN | Out-of-plane |
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Abbreviations: AP, amylopectin; CMC, carboxymethyl cellulose; EDM, electric discharge machining; MNs, microneedles; PEGDA, polyethylene glycol diacrylate; PCL, polycaprolactone; PGA, polyglycolic acid; PLA, polylactic acid; PLGA, polylactic-co-glycolic acid; PLLA, poly (l-lactide); PMMA, polymethyl methacrylate; PVA, polyvinyl alcohol; PVP, polyvinylpyrrolidone; SS, stainless steel.
Figure 4.Micromolding process to fabricate BCMN-G. BCMN-G indicates bioceramic microneedle with gelatin substrate. (Images reprinted with permission from Cai et al.[76])
Figure 5.(A) Description of functional polyplexes released from MNs coated with pH-responsive PMA after applied on the skin. (B) Illustration of delivery of polyplexes with surface mannose moieties to intradermal resident APCs after releasing from MNs. APC indicates antigen-presenting cells; MNs microneedles; PMA, polyelectrolyte multilayer assembly. (Images reprinted with permission from Kim et al.[158])
Figure 6.The schematic illustration of the microneedles used for delivery of insulin. (Images reprinted with permission from Ling and Chen.[168])