| Literature DB >> 31193309 |
Tianyuan Su1, Fapeng Liu1, Yizhao Chang1, Qi Guo1, Junshu Wang1, Qian Wang1,2, Qingsheng Qi1,3.
Abstract
DNA double-strand breaks (DSBs) are one of the most lethal forms of DNA damage that is not efficiently repaired in prokaryotes. Certain microorganisms can handle chromosomal DSBs using the error-prone non-homologous end joining (NHEJ) system and ultimately cause genome mutagenesis. Here, we demonstrated that Enterobacteria phage T4 DNA ligase alone is capable of mediating in vivo chromosome DSBs repair in Escherichia coli. The ligation efficiency of DSBs with T4 DNA ligase is one order of magnitude higher than the NHEJ system from Mycobacterium tuberculosis. This process introduces chromosome DNA excision with different sizes, which can be manipulated by regulating the activity of host-exonuclease RecBCD. The DNA deletion length reduced either by inactivating recB or expressing the RecBCD inhibitor Gam protein from λ phage. Furthermore, we also found single nucleotide substitutions at the DNA junction, suggesting that T4 DNA ligase, as a single component non-homologous end joining system, has great potential in genome mutagenesis, genome reduction and genome editing.Entities:
Keywords: CRISPR-Cas9; DNA double-strand breaks; Non-homologous end joining; T4 DNA ligase
Year: 2019 PMID: 31193309 PMCID: PMC6525309 DOI: 10.1016/j.synbio.2019.04.001
Source DB: PubMed Journal: Synth Syst Biotechnol ISSN: 2405-805X
Fig. 1T4 DNA ligase mediates DSBs repair in vivo. (A) Circularization of HindIII-digested linear plasmid in E. coli MG1655/pUCLR4 (VC), MG1655/pUCLR4-T4 (T4) and MG1655/pUCLR4-Ku-ligD (Ku-LigD) strains. Colonies formed on the chloramphenicol agar plates. (B) The end-joining efficiency of linear pACYCDuet-1 plasmids with either sticky ends or blunt-ends using T4 DNA ligase or Ku-LigD(Mt). Equal amount of linear pACYCDuet-1 plasmids with either sticky ends (digested with EcoRI, HindIII and EcoRN) or blunt-ends (digested with HpaI) were electroporated into E. coli MG1655/pUCLR4 (VC), MG1655/pUCLR4-T4 (T4) and MG1655/pUCLR4-Ku-ligD (Ku-LigD) strains. The resulting transformants were plated on agar plates containing chloramphenicol. The end-joining efficiency was calculated as the ratio of colony-forming units per nanogram of transformed linear DNA versus colony-forming units per nanogram of circular DNA.
Fig. 2T4 DNA ligase mediates DSBs repair introduced by CRISPR-Cas9. (A) Repair of DSBs introduced by CRISPR-Cas9 at lacZ gene locus in E. coli MG1655/pUCLR4 (VC), MG1655/pUCLR4-Ku-ligD (Ku-LigD) and MG1655/pUCLR4-T4 (T4) strains. Colonies formed on the X-gal agar plates. (B). The number of CFUs formed on the X-gal plates. Data shown are representative of three replicates and standard deviations were presented as error bars.
Fig. 3Distribution of deletion lengths introduced at the junction sites with T4 DNA ligase mediated DSBs repair (sample size: 50 colonies).
Sequences of the DSBs junction repaired by T4 DNA ligase.
Fig. 4The activity of host-exonuclease RecBCD interposes T4 DNA ligase mediated DSBs repair. A. Repair efficiency of DSBs introduced by CRISPR-Cas9 at lacZ gene locus in E. coli overexpressing T4 DNA ligase, E. coli ΔrecB overexpressing T4 DNA ligase and E. coli overexpressing both T4 DNA ligase and Gam protein. Statistical of the number of CFUs on the agar plates supplemented with X-Gal and IPTG. Data shown are representative of three replicates and standard deviations were presented as error bars. B. Distribution of DNA deletion lengths introduced during DSBs repair in wild type E. coli overexpressing T4 DNA ligase, E. coli ΔrecB overexpressing T4 DNA ligase and wild type E. coli overexpressing both T4 DNA ligase and Gam protein (sample size: 50 colonies).