| Literature DB >> 30370156 |
Abstract
This article aims to provide a systematic review of the exposure assessment methods used to assign wafer fabrication (fab) workers in epidemiologic cohort studies of mortality from all causes and various cancers. Epidemiologic and exposure-assessment studies of silicon wafer fab operations in the semiconductor industry were collected through an extensive literature review of articles reported until 2017. The studies found various outcomes possibly linked to fab operations, but a clear association with the chemicals in the process was not found, possibly because of exposure assessment methodology. No study used a tiered assessment approach to identify similar exposure groups that incorporated manufacturing era, facility, fab environment, operation, job and level of exposure to individual hazardous agents. Further epidemiologic studies of fab workers are warranted with more refined exposure assessment methods incorporating both operation and job title and hazardous agents to examine the associations with cancer risk or mortality.Entities:
Keywords: Chemical; Epidemiologic study; Fab operation; Retrospective exposure assessment; Semiconductor industry
Year: 2018 PMID: 30370156 PMCID: PMC6129997 DOI: 10.1016/j.shaw.2018.05.005
Source DB: PubMed Journal: Saf Health Work ISSN: 2093-7911
Work history information sources and exposure surrogates used in epidemiologic studies of wafer fab workers.
| Authors | Country (name of plant) | Number of plants | Information sources on work history and work-related exposures | Exposure surrogates used to classify study participants |
|---|---|---|---|---|
| Sorahan et al (1985) | UK | 1 | Company personnel records | Year from first employment |
| Sorahan et al (1992) | UK | 1 | Company personnel records | Employment status, employment duration |
| McElvenny et al (2003) | UK | 1 (Scottish) | Four sources within company (personnel/payroll/pension/occupational health) | Employment duration (<10/≥ 10 years), start year of employment (<and ≥1982), and plant work area (fab or nonfab areas) |
| Beall et al (2005) | US (IBM) | 3 (East Fishkill/Burlington/San Jose | IBM's electronic personnel file (position/hire date and end date/location code/division name/department code/department name/job code/job title) | Facility/years since first record of employment/years worked/manufacturing era/type of process/potential exposure including work other than offices (yes/no)/work group |
| Nichols and Sorahan (2005) | UK | 1 | Company personnel records | Year of hire/period from 1st employment/duration of employment |
| Bender et al (2007) | US (IBM) | 2 (East Fishkill/San Jose | Company electronic personal files (position/hire and end date/location code/division name/department code/department name/job code/job title) | Facility/years since first record of employment and years worked/manufacturing era/type of process/potential exposure including work other than offices (yes/no) |
| Boice Jr et al (2010) | US | 2 large companies located in 10 cities in five states | Company electronic work history information for job and exposure classification | Occupation (fab/nonfab)/duration of employment as job title/occupation and manufacturing eras |
| Darnton et al (2010) | UK | 1 National Semiconductor UK Ltd. at Greenock | Company historical documents, interviews with long-serving employees and questionnaire | Occupation (fab/nonfab)/duration of employment)/qualitative exposure assessment: carcinogens, radiation, group of chemicals, and shift work (yes/no)/start year of employment (<and ≥1982) |
| Lee et al (2011) | Republic of Korea | 5 companies and 8 factories | No description of the methods used to collect work history data or information and to classify fab workers | Hire date (<1991, 1992–1997, 1998–2003 and ≥ 2004)/job title/duration of employment |
fab, fabrication.
Facility developed, manufactured, and packaged storage product devices such as hard disk drives, network servers, magnetic tape drivers, and micro drives.
Exposure metrics used to classify wafer fabrication workers in epidemiologic cancer risk studies.
| Authors | Facility | Manufacturing era | Fab/nonfab | Operation | Job | A group of agents or matrix | Specific agent including carcinogen |
|---|---|---|---|---|---|---|---|
| Sorahan et al (1985) | One wafer fab facility | 1970–1982 | N/A | N/A | N/A | N/A | N/A |
| Sorahan et al (1992) | One wafer fab facility | 1982–1989 (7 years of follow-up) | N/A | N/A | N/A | N/A | N/A |
| Nichols and Sorahan (2005) | One wafer fab facility | 1970–2002 (13 years of follow-up) | N/A | N/A | N/A | N/A | N/A |
| McElvenny et al (2003) | One wafer fab facility | Fab/nonfab area | N/A | N/A | N/A | N/A | N/A |
| Beall et al (2005) | Wafer fab manufacture, masking and packaging (East Fishkill and Burlington | 1983/1984–1999 | Classified by facility | N/A | N/A | N/A | N/A |
| Hard disk drives, network servers, and micro drives (San Jose) | 1965–1972/1973–1989/1990–1999 | Fab | N/A | N/A | N/A | N/A | |
| Bender et al (2007) | Wafer fab, masking and packaging (East Fishkill and Burlington) | Early/middle/late (no specific date) | Fab | N/A | Operators & Equipment service technician/Engineers, supervisors & managers | N/A | N/A |
| Boice Jr et al (2010) | Hard disk drives, network servers, and micro drives (San Jose | Early/middle/late (no specific date) | Nonfab | Office/nonoffice | Professional or office workers; back-end workers and other workers | N/A | N/A |
| Darnton et al (2010) | One wafer fab facility | N/A | Fab | N/A | N/A | Solvent, acid, toxic gases | Antimony trioxide, arsenic & its compounds, carbon tetrachloride, chromic acid, sulfuric acid, etc |
| Lee et al (2011) | 9 wafer fab facilities and 2 fab packaging facilities | N/A | Classified by job | N/A | Classified by facility (operator, service engineer, process engineer, supervisor, utility | N/A | N/A |
fab, fabrication.
“N/A” indicates that exposure surrogates were not analyzed in the classification of study participants.
Same character (A, B, C) indicates the same study cohort group.
No classification of type of fab (wafer fab and chip packaging).
East Fishkill & Burlington: masking, clean rooms, test/probe/dicing/slicing/die removal/wire bonding, process equipment maintenance, research and development, other manufacturing; San Jose: head fabrication, test/dice/slice, assembly, facilities/laboratories, research & development, other manufacturing.