Wei-Sheng Chen1, Sheng-Hsiung Yang1, Wei-Cheng Tseng2, Wilson Wei-Sheng Chen2, Yuan-Chang Lu2. 1. Institute of Lighting and Energy Photonics, College of Photonics, National Chiao Tung University, No. 301, Gaofa 3rd Road, Guiren District, Tainan 71150, Taiwan, ROC. 2. Opulence Optronics Co., Ltd., 3F, No. 1, Zhanye 1st Road, East District, Hsinchu 30091, Taiwan, ROC.
Abstract
Nickel oxide (NiOx) has been extensively investigated as the hole injection layer (HIL) for many optoelectronic devices because of its excellent hole mobility, high environmental stability, and low-cost fabrication. In this research, a NiOx thin film and nanoporous layers (NPLs) have been utilized as the HIL for the fabrication of quantum dot light-emitting diodes (QLEDs). The obtained NiOx NPLs have spongelike nanostructures that possess a larger surface area to enhance carrier injection and to lower the turn-on voltage as compared with the NiOx thin film. The energy levels of NiOx were slightly downshifted by incorporating the nanoporous structure. The amount of Ni2O3 species is higher than that of NiO in the NiOx NPL, confirming its good hole transport ability. The best QLED was achieved with a 30 nm thick NiOx NPL, exhibiting a maximum brightness of 68 646 cd m-2, a current efficiency of 7.60 cd A-1, and a low turn-on voltage of 3.4 V. More balanced carrier transport from the NiOx NPL and ZnO NPs/polyethylenimine ethoxylated (PEIE) is responsible for the improved device performance.
Nickel oxide (NiOx) has been extensively investigated as the hole injection layer (HIL) for many optoelectronic devices because of its excellent hole mobility, high environmental stability, and low-cost fabrication. In this research, a NiOx thin film and nanoporous layers (NPLs) have been utilized as the HIL for the fabrication of quantum dot light-emitting diodes (QLEDs). The obtained NiOx NPLs have spongelike nanostructures that possess a larger surface area to enhance carrier injection and to lower the turn-on voltage as compared with the NiOx thin film. The energy levels of NiOx were slightly downshifted by incorporating the nanoporous structure. The amount of Ni2O3 species is higher than that of NiO in the NiOxNPL, confirming its good hole transport ability. The best QLED was achieved with a 30 nm thick NiOxNPL, exhibiting a maximum brightness of 68 646 cd m-2, a current efficiency of 7.60 cd A-1, and a low turn-on voltage of 3.4 V. More balanced carrier transport from the NiOxNPL and ZnO NPs/polyethylenimine ethoxylated (PEIE) is responsible for the improved device performance.
Since
the first quantum dot (QD)-based light-emitting diodes (QLEDs)
reported by Alivisatos and co-workers,[1] many scientists have launched a great deal of research to pursue
high brightness and efficiency of QLEDs. Colloidal cadmium selenide
(CdSe) QDs have attracted enormous research interest because of their
excellent properties, such as high photoluminescence (PL) quantum
efficiency, narrow spectral bandwidth, high color purity, ease of
color tuning without changing the composition, and low-cost solution
processability.[2−8]The existing QLED structure has the configuration of anode/hole
injection layer (HIL)/hole transporting layer (HTL)/CdSe QDs/electron
transporting layer (ETL)/electron injection layer (EIL)/cathode, which
is similar to that of general organic light-emitting diodes. In common
QLED devices, zinc oxide (ZnO) is the most promising ETL for QLEDs
as it has high electron mobility and high transmittance in the visible
range.[9,10] ZnO thin films are commonly prepared by
the sol–gel method,[11,12] followed by high-temperature
calcination over 400 °C to promote crystallinity and high carrier
mobility.[13] It is generally considered
that a high calcination temperature is unfavorable for low-cost manufacturing
and is incompatible with flexible substrates. To avoid this problem,
Meulenkamp proposed a low-temperature synthesis of ZnO nanoparticles
(NPs) with a diameter ranging from 2 to 7 nm,[14] which were homogeneously dispersed in alcoholic solvents and required
only 150 °C to remove the solvent to form smooth ZnO thin films
after spin coating. For the HIL, poly(3,4-ethylenedioxythiophene):poly(4-styrenesulfonate)
(PEDOT:PSS) is extensively used in QLEDs owing to its high conductivity,[4] suitable energy level for hole injection,[6] and electron-blocking ability.[15] To enhance hole transport from the HIL to the CdSe emissive
layer, an HTL is usually inserted. Three semiconducting polymers have
been reported as the HTL in QLED fabrication, namely, poly(N-vinylcarbazole) (PVK), poly[N-(4-butylphenyl)-N′,N″-diphenylamine] (poly-TPD),
and poly(9,9-dioctylfluorene-co-N-(4-butylphenyl)diphenylamine) (TFB).[4,16,17]Although QD materials and related QLEDs have
been developed with
high brightness and efficiency,[18,19] there are still two
major problems to overcome. One is imbalanced electron–hole
transport and the other is insufficient device lifetime. As mentioned
above, ZnO is the most commonly used ETL in QLEDs. Compared with ZnO,
the hole transport materials utilized in QLEDs, including PEDOT:PSS,
poly-TPD, and TFB, have much lower hole mobility that restricts device
performance.[10] For obtaining high brightness
and efficiency of QLEDs, several approaches have been proposed to
improve charge balance. Zinc magnesium oxide (ZnMgO) NPs have been
prepared by doping Mg2+ in ZnO NPs to decelerate the electron
mobility, which effectively solves the drawback of charge carrier
imbalance.[10,20] The optimized QLED based on the
ZnMgO ETL showed a 3.67-fold enhancement of current efficiency from
3.74 to 13.73 cd A–1 and a 3.67-fold increase in
external quantum efficiency (EQE) from 2.58 to 9.46%. The second approach
is to insert an electron-blocking layer (EBL) between the CdSe emissive
layer and the ZnO ETL. The EBL can not only effectively prohibit excessive
electron injection into the CdSe QDs but also prevent the reverse
transfer of electrons from CdSe QDs to the ETL, thereby preserving
superior emissive efficiency. Dai et al. demonstrated high-performance
QLEDs by inserting an insulating poly(methyl methacrylate) layer between
the QD layer and the ZnO ETL to optimize charge balance in the device
with the highest EQE of 20.5% and an average EQE of 18.7% from 27
devices.[21] Jin et al. introduced a poly(p-phenylene benzobisoxazole) layer between the CdSe QDs
and ZnO layer to block the excess electron injection, achieving a
maximum EQE of 16.7% and an average EQE > 14%.[22] Another approach is to increase the hole transport ability
of the HTL to achieve electron–hole charge balance in QLEDs.
Our group blended a wetting and dispersing additive BYK-P105 into
PEDOT:PSS to improve the hole mobility. The best QLED achieved a very
high brightness of 139 909 cd m–2 and a current
efficiency of 27.2 cd A–1, with a low turn-on voltage
of 3.8 V.[23]As mentioned in the previous
paragraph, the device lifetime is
not sufficient for commercialization because of the usage of PEDOT:PSS,
which is often used as the hole transport layer in typical QLEDs.
PEDOT:PSS is widely known for its acidic and hydrophilic nature that
could accelerate the deterioration of device performance and reduce
the device lifetime.[4,24] To solve this issue, a series
of solution-processed p-type metal oxides with high carrier mobility
and superior stability, such as nickel oxide (NiOx), vanadium
oxide (VOx), tungsten oxide (WOx), and molybdenum
oxide (MoOx), have been investigated as alternatives to
PEDOT:PSS and have been introduced as the HIL for QLEDs.[25−28] Among the above metal oxide materials, NiOx is most favored
because of its superior electron-blocking ability compared with the
others.[25,29] Zhang et al. utilized NiO nanocrystals (NCs)
as the HIL for fabricating QLEDs with the configuration of indium
tin oxide (ITO)/NiO/TFB/CdSe QDs/ZnO NCs/Al.[24] The NiO NCs were prepared from their precursor nickel acetylacetone
in tert-butanol in an autoclave at 200 °C for
24 h, with their valence band (VB) and conduction band (CB) at −6.17
and −2.45 eV, respectively. The best QLED showed a peak luminance
of up to 25 580 cd m–2 and a current efficiency
of 5.38 cd A–1. Sun et al. utilized a UV–ozone-enhanced
NiOx HIL for QLEDs with the structure of ITO/NiOx/PVK/CdSe QDs/ZnMgO NPs/Al.[4] The low-temperature-annealed
NiOx film was subjected to UV–ozone treatment for
20 min to enhance its conductivity. The optimized device showed a
maximum current efficiency and a peak EQE of 45.8 cd A–1 and 10.9%, respectively. Moreover, a 3.2-fold enhancement of the
device lifetime was attained by replacing the organic PEDOT:PSS with
inorganic NiOx. Cao et al. demonstrated high-efficiency
and stable QLEDs consisting of a solution-processed Cu-doped NiO HIL.[25] A maximum luminance of 61 030 cd m–2 and a current efficiency of 45.7 cd A–1 were obtained from the optimized device, with an almost 4-fold operation
lifetime enhancement compared with the PEDOT:PSS-based QLED.In this research, green QLEDs with the configuration of ITO/NiOx/CdSe QDs/ZnO NPs/polyethylenimine ethoxylated (PEIE)/LiF/Al
were fabricated and evaluated. As described above, the utilization
of PEDOT:PSS may lead to corrosion of the ITO electrode and reduced
device stability. We selected NiOx as the HIL to avoid
the above drawbacks. Moreover, different types of nanostructured NiOx layer, including nanoporous layers (NPLs) and a thin film,
were prepared for comparison. From literature survey, we realized
that NiOx NPLs have not been utilized as the HIL in QLEDs.
Nanoporous materials can facilitate greater charge transfer due to
the increased surface area. By combining two inorganic metal oxidesNiOx and ZnO with high hole/electron mobility, balanced
electron–hole transport and augmented device performance of
QLEDs are easier to achieve. The best QLED based on a NiOxNPL as the HIL and PEIE as an interfacial layer achieved a high
brightness of 68 646 cd m–2 and a current
efficiency of 7.6 cd A–1, with a low turn-on voltage
of 3.4 V. Our results open up new opportunities for the selection
of carrier transport layers and fabrication of QLEDs for future commercialization.
Results and Discussion
The top-view and cross-sectional
scanning election microscopy (SEM)
images of NiOx NPLs from different concentrations (0.075,
0.0875, and 0.1 M) of NiSO4 aqueous solutions are shown
in Figure . It is
seen that these NiOx NPLs have spongelike nanostructures
and staggered networks, indicative of a large surface area. Moreover,
the NiOxNPL from the 0.075 M NiSO4 solution
possesses the smallest pore size, while the one from the 0.1 M precursor
solution has the largest pore size. In other words, the pore size
of NiOx becomes larger gradually as the concentration of
NiSO4 precursor solution increases. The thicknesses of
different NiOx NPLs are determined to be 30, 70, and 100
nm, respectively, grown from 0.075, 0.0875, and 0.1 M NiSO4 solutions. The morphology and roughness of the NiOx thin
film and NPLs with different thicknesses were investigated by atomic
force microscopy (AFM). The corresponding topographic images and average
roughness (Ra) of samples are displayed
in Figure S1 in the Supporting Information.
The NiOx thin film showed a quite smooth surface with a
relatively low Ra value of 2.0 nm. On
the other hand, the porous topologies of the NiOx NPLs
from AFM experiments are in accordance with SEM observation. The Ra values of 30, 70, and 100 nm thick NiOx NPLs are measured to be 7.59, 9.38, and 17.9 nm, respectively.
It is clearly seen that the surface roughness of the NiOx NPLs becomes higher with increasing NPL thickness.
Figure 1
Top-view and cross-sectional
SEM images of NiOx NPLs
with different thicknesses of (a, b) 30, (c, d) 70, and (e, f) 100
nm.
Top-view and cross-sectional
SEM images of NiOx NPLs
with different thicknesses of (a, b) 30, (c, d) 70, and (e, f) 100
nm.The X-ray diffraction (XRD) patterns
of the resulting NiOx thin film and 30 nm thick NPL are
shown in Figure .
The XRD peaks are enlarged to clearly observe
diffraction signals of NiOx. Both samples exhibit intense
peaks at 2θ = 37.2, 43.3, and 62.9°, corresponding to the
(111), (200), and (220) planes,[31] indicative
of a cubic crystal structure.[32] These diffraction
peaks are well matched with our previous report, which demonstrated
the utilization NiOx HTL for fabricating inverted perovskite
solar cells with high efficiency and stability. Besides, we notice
that the peak intensity of the NiOxNPL is similar with
that of the NiOx thin film. To date, the prepared NiOxNPL and thin film have shown similar crystalline structure
and crystallinity.
Figure 2
XRD patterns of the NiOx thin film and 30 nm
thick NPL
on the ITO substrate.
XRD patterns of the NiOx thin film and 30 nm
thick NPL
on the ITO substrate.The transmission spectra
of the NiOx thin film and NPLs
with different thicknesses of 30, 70, and 100 nm are displayed in Figure a. It is seen that
all samples possess moderate transmittance higher than 65% from 350
to 490 nm, and they show even higher transmittance of up to 90% from
490 to 780 nm, which is beneficial for light-emitting application.
The absorption spectra of the resulting NiOx thin film
and NPLs are shown in Figure b. All samples preserve similar absorption behavior and show
the absorption edge at ca. 350 nm, corresponding to an optical band
gap of 3.51 eV. Besides, a small absorption band is located at 420
nm, which could be explained by crystalline defects that lead to the
electronic transition from the oxygen vacancies to the VB of the metal
oxide.[33] The different nanostructures of
NiOx do not affect its optical properties.
Figure 3
(a) Transmission and
(b) absorption spectra of the NiOx thin film and NPLs with
different thicknesses of 30, 70, and 100
nm.
(a) Transmission and
(b) absorption spectra of the NiOx thin film and NPLs with
different thicknesses of 30, 70, and 100
nm.To investigate the energy levels
of the NiOx thin film
and 30 nm thick NiOxNPL, ultraviolet photoelectron spectroscopy
(UPS) measurements were carried out, and the corresponding UPS spectra
are depicted in Figure . The work function (φ) was evaluated by subtracting the secondary
electron cutoff position from the incident He I photon energy (hν = 21.22 eV).[34] Hence,
the Fermi levels (EF) of the NiOx thin film and 30 nm thick NiOxNPL are determined to
be −4.83 and −4.69 eV, respectively. The valence band
level (EVB) can be deduced from the equation EVB = EF – EFermi edge, where EFermi edge represents the Fermi edge level.[35] The conduction band level (ECB) can be calculated with the equation ECB = EVB + Eg.[36] The EVB values of the NiOx thin film and 30 nm thick
NiOxNPL are −5.13 and −5.21 eV, respectively.
In addition, the ECB values of the NiOx thin film and 30 nm thick NiOxNPL are −1.62
and −1.70 eV, respectively. The above results indicate that
the change in nanostructure of NiOx does not significantly
alter its energy levels.
Figure 4
UPS spectra of the NiOx thin film
and 30 nm thick NPL
in the (a) secondary electron cutoff and (b) Fermi edge region.
UPS spectra of the NiOx thin film
and 30 nm thick NPL
in the (a) secondary electron cutoff and (b) Fermi edge region.The hole transport ability of nonstoichiometric
NiOx arises from interstitial oxygen and Ni vacancies in
the crystalline
structure. X-ray photoelectron spectroscopy (XPS) measurements were
carried out for identification of the Ni3+/Ni2+ ratio. Figure a,b
reveals the Ni 2p3/2 band of the NiOx thin film
and NiOxNPL, respectively. The multicomponent band can
be deconvoluted into four different states at 853.9 (Ni2+), 855.8 (Ni3+), 861.1 (Ni2+ satellite), and
864.2 eV (Ni3+ satellite), which are consistent with a
previous report.[31] The Ni3+/Ni2+ ratios are calculated to be 1.14 and 1.27 for the NiOx thin film and NiOxNPL, respectively. It can be
seen that the amount of Ni2O3 species is higher
than stoichiometric NiO in the NiOxNPL, confirming that
the NiOxNPL possesses higher hole mobility. The increased
Ni3+ concentration indicates enhanced hole transport ability. Figure c,d shows the O 1s
spectra of the NiOx thin film and NiOxNPL and
are fitted with two states at around 529.2 (O2– from
NiO) and 531.1 eV (O2– from Ni2O3).[30]
Figure 5
XPS spectra of Ni 2p3/2 signals of (a) the thin film
and (b) 30 nm thick NPL and O 1s signals of (c) the thin film and
(d) 30 nm thick NPL.
XPS spectra of Ni 2p3/2 signals of (a) the thin film
and (b) 30 nm thick NPL and O 1s signals of (c) the thin film and
(d) 30 nm thick NPL.The graphical illustration
of the QLED based on the NiOxNPL is shown in Figure a, which is constructed
with the configuration of ITO/NiOxNPL/PVK/CdSe QDs/ZnO
NPs/PEIE/LiF/Al. A QLED based on a 40
nm thick NiOx thin film was also fabricated and evaluated
for comparison. The energy-level diagram of the whole device is illustrated
in Figure b. In our
devices, we chose NiOx as the hole injection material since
its VB is close to the work function of ITO. The VB and CB of the
NiOx thin film and NiOxNPL were deduced from
the above-mentioned UPS experiments. Next, PVK was adopted as the
HTL between NiOx and CdSe QDs for stepwise hole transportation
from NiOx to the emissive layer. The highest-occupied molecular
orbital (HOMO) and lowest-unoccupied molecular orbital (LUMO) of PVK
were reported to be −5.8 and −2.2 eV, respectively.[21,37] In addition to the hole transport ability, PVK also shows good electron-blocking
ability because of the high-lying LUMO level. As for the ETL, the
CB of PEIE-modified ZnO is −2.9 eV,[38] while LiF/Al is evaporated as the electrode with a work function
of −2.8 eV.[39] Hence, a small energy
barrier between ZnO/PEIE and LiF/Al electrode was achieved for electron
injection and transportation. The cross-sectional SEM image of the
whole device is shown in Figure c. In this device, the 30 nm thick NiOxNPL
was used as the HIL. The thicknesses of the NiOxNPL/PVK,
CdSe QDs, ZnO/PEIE, and LiF/Al are estimated to be 40, 35, 25, and
100 nm, respectively. The top-view SEM image of NiOx/PVK is provided
as Figure S1 in the Supporting Information.
The porous structure of NiOx can be clearly seen since PVK penetrated
into pores.
Figure 6
Illustrations of (a) the device architecture, (b) energy-level
diagram, and (c) cross-sectional SEM image of the QLED.
Illustrations of (a) the device architecture, (b) energy-level
diagram, and (c) cross-sectional SEM image of the QLED.The brightness–voltage and current efficiency–current
density characteristics of all QLEDs are shown in Figure a,b, respectively. All device
performances from the four QLEDs based on the NiOx thin
film and NiOx NPLs with different thicknesses of 30, 70,
and 100 nm are summarized in Table . The maximum brightness (Lmax) and current efficiency (CEmax) of the QLED based on
the NiOx thin film were measured to be 22 614 cd
m–2 and 13.1 cd A–1, respectively,
with a high turn-on voltage (Von) of 8.0
V. Using the 30 nm thick NiOxNPL as the HIL, the Lmax was significantly augmented to 68 646
cd m–2 and Von was reduced
to 3.4 V, with a CEmax of 7.6 cd A–1.
The Lmax and CEmax of the QLEDs
based on 100 and 70 nm thick NPLs were substantially reduced to 615–10,928
cd m–2 and 0.07–1.32 cd A–1, respectively. It is seen that the device performance became lower
when the thickness of the NiOxNPL was increased. The reason
for this phenomenon is explained as follows. The thicknesses of the
upper layers PVK and CdSe QDs are relatively thinner than that of
the NiOxNPL. With the thinnest NiOxNPL of
∼30 nm utilized as the HIL, a flat and sandwiched device structure
was built; the QLED with the lowest Von was observed, as revealed in Figure a. When the thickness of the NiOxNPL became
thicker up to 70 nm or even 100 nm, the deposited PVK and CdSe QDs
could not cover the whole surface of the NiOxNPL and flakes
of NiOx penetrated through the PVK and CdSe layers to the
top surface. Therefore, the device efficiency based on the 70 or 100
nm thick NiOxNPL was reduced. Besides, we observed that
QLEDs using NiOx NPLs as the HIL have a smaller Von than the one based on the NiOx thin film. This is understandable since nanoporous structures possess
more surface area to enhance carrier injection and generation of light.[40,41]Figure c reveals
the snapshot of the QLED based on the 30 nm thick NiOxNPL
driven at 10 V and its electroluminescence spectrum centered at 532
nm, exhibiting a bright green emission. To the best of our knowledge,
NiOx NPLs were utilized for the first time as the HIL to
construct QLEDs.
Figure 7
(a) Brightness–voltage and (b) current efficiency–current
density characteristics of all QLEDs based on the NiOx thin
film and NiOx NPLs with different thicknesses of 30, 70,
and 100 nm; (c) EL spectrum and snapshot of the QLED based on the
30 nm thick NiOx NPL at 10 V; and (d) current–voltage
characteristics of the hole-only and electron-only devices.
Table 1
Device Performance of All QLEDs Using
NiOx as the HTL
NiOx type
Von (V)a
Lmax (cd m–2@V)
Jmax (mA cm–2@V)
CEmax (cd A–1@V)
thin film
8.0
22 614@19.0
772@20.0
13.1@13.6
30 nm NPL
3.4
68 646@18.5
1490@13.2
7.6@11.3
70 nm NPL
4.1
10 928@13.4
1230@13.4
1.32@10.1
100 nm NPL
4.0
615@8.6
941@8.6
0.07@8.2
Defined as the
operating voltage
when the brightness reached 1 cd m–2.
(a) Brightness–voltage and (b) current efficiency–current
density characteristics of all QLEDs based on the NiOx thin
film and NiOx NPLs with different thicknesses of 30, 70,
and 100 nm; (c) EL spectrum and snapshot of the QLED based on the
30 nm thick NiOxNPL at 10 V; and (d) current–voltage
characteristics of the hole-only and electron-only devices.Defined as the
operating voltage
when the brightness reached 1 cd m–2.To compare carrier transport ability
between the NiOx thin film and NPL, two hole-only devices
made of the ITO/NiOx film or 30 nm thick NPL/Al and one
electron-only device of
the structure ITO/ZnO NPs/PEIE/LiF/Al were fabricated to measure their
current–voltage characteristics, as shown in Figure d. The device based on the
NiOxNPL showed a higher current value, indicative of better
hole transport ability than the NiOx thin film. The hole
mobility of the 30 nm thick NiOxNPL was calculated from
the space-charge limited current model J = (9/8)εrε0μeV2/d3, assuming εr = 11.9,[42] ε0 = 8.854
× 10–12 F m–1, and thickness d = 40 nm for the NiOx thin film and 30 nm for
the NiOxNPL. Hence, the hole mobility of the NiOx thin film was estimated to be 2.70 × 10–5 cm2 V–1 s–1, which
is close to the value in a previous report.[43] The hole mobility of the NiOxNPL was also calculated
to be 3.25 × 10–5 cm2 V–1 s–1, revealing a higher value than that of the
NiOx thin film. Moreover, the current of the NiOxNPL device was closer to that of the ZnO NPs/PEIE device, indicating
more balanced carrier transport that is responsible for the improved
device performance.The device based on the NiOx thin
film has more balanced
carrier recombination under a low current density below 180 mA cm–2, and it exhibits a peak efficiency of 13.1 cd A–1 at 18 mA cm–2. On the contrary,
the NiOxNPL device shows a lower current efficiency under
a low current density, possibly due to the exposed NiOx nanostructure after PVK deposition, as shown in Figure S2 in the Supporting Information. This would lead to
direct contact of NiOx and the CdSe active layer and a
leakage current that decreases current efficiency. On the other hand,
the leakage current for the device based on the NiOx thin
film was small at a low driving voltage due to its smooth surface.
The leakage current became more significant with increasing driving
voltage, which resulted in a sharp decrease in current efficiency.
Besides, the device based on the 30 nm thick NiOxNPL always
showed a higher luminance than the one based on the NiOx thin film. Therefore, the device based on the NiOxNPL
exhibited a higher performance when the current density was increased
over 180 mA cm–2 or higher.
Conclusions
Nanoporous NiOx was successfully prepared using a coprecipitation
method to serve as the HIL in QLEDs. The experimental results showed
that the NiOxNPL and thin film have similar crystalline
structures and high transmittance of up to 90%. The XPS results indicated
that the NiOx NPLs have more Ni2O3 species than NiO, revealing a better hole transport property. The
UPS results proved that the nanostructural change of NiOx slightly alters its energy levels. The best device exhibited a maximum
brightness of 68 646 cd m–2, a current efficiency
of 7.6 cd A–1, and a turn-on voltage of 3.4 V. More
balanced carrier transport from NiOx NPLs and ZnO NPs/PEIE
was achieved in our QLEDs.
Experimental Section
Materials
ITO glass substrates (7
Ω sq–1) were purchased from Merck. Nickel(II)
sulfate heptahydrate (purity 98%) was purchased from Acros. PEIE (37
wt % in water) and PVK were purchased from Alfa Aesar and TCI, respectively.
CdSe QDs were provided by Opulence Optronics Co., Ltd. from Taiwan.
Colloidal ZnO NPs in n-butanol were synthesized according
to our previous report.[23] Other reagents
and solvents were bought from Alfa Aesar, Acros, or ECHO Chemical
Co., Ltd. and used without further purification.
Preparation of the NiOx Thin Film
To prepare
NiOx precursor solution, 0.141 g of nickel(II)
sulfate heptahydrate (NiSO4·7H2O), 30 μL
of ethanolamine, and 5 mL of isopropanol (IPA) were mixed and heated
at 80 °C with stirring in a sealed glass vial overnight. The
color of the precursor solution became translucent green after dissolution.
The precursor solution was then spin-coated at 2000 rpm for 30 s into
a thin film on the ITO substrate, followed by heating at 80 °C
for 20 min. The dried film was calcinated at 300 °C for 1 h to
obtain the final NiOx thin film.
Preparation
of NiOx NPLs
The preparation of NiOx NPLs was carried out using a modified
coprecipitation method.[30] First, three
different weights (1.05, 1.123, and 1.4 g) of NiSO4·7H2O were dissolved in 50 mL of deionized (DI) water to form
three NiSO4 aqueous solutions with different concentrations
(0.075, 0.0875, and 0.1 M). Meanwhile, three different weights (0.253,
0.296, and 0.338 g) of potassium persulfate (K2S2O8) were dissolved in 50 mL of DI water to give three
K2S2O8 aqueous solutions with different
concentrations (0.019, 0.022, and 0.025 M). Second, 16 mL of 0.075
M (or 0.085 or 0.1 M) NiSO4 solution, 12 mL of 0.019 M
(or 0.022 or 0.025 M) K2S2O8 solution,
and 4 mL of aqueous ammonia (25–28%) were mixed and shaken
for 5 min to give three solution mixtures with different concentrations.
Third, the above solution mixtures were poured into individual Petri
dishes and precleaned ITO substrates were immersed horizontally for
4 min with the ITO side upward. The deposited films were rinsed with
DI water to remove loosely bound particles and further dried at 80
°C for 20 min in ambient air, followed by calcination at 300
°C for 1 h to obtain NiOx NPLs.
Device Fabrication
Regular QLEDs
with the configuration of ITO/NiOx/PVK/CdSe QDs/ZnO NPs/PEIE/
LiF/Al were fabricated. The ITO substrates were cleaned sequentially
with a detergent, DI water, acetone, and IPA under ultrasonication
for 30 min each, followed by nitrogen purge and ultraviolet–ozone
exposure for 20 min. The NiOx thin film or NPLs were deposited
on the cleaned ITO according to Sections and 4.3. The
substrates were then transferred into a nitrogen-filled glovebox.
PVK (in chlorobenzene, 8 mg mL–1) was spin-coated
on top of the NiOx film or NPLs at 3000 rpm for 30 s, followed
by drying at 150 °C for 20 min. CdSe QDs (in n-octane, 12 mg mL–1) were spin-coated into a thin
film on the PVK layer at 2000 rpm for 30 s and heated at 150 °C
for 30 min. ZnO NPs were deposited on top of the CdSe layer by spin
coating at 2000 rpm for 30 s, followed by baking at 150 °C for
20 min. A thin layer of PEIE was deposited from its 0.4 wt % solution
in 2-ethoxyethanol on ZnO NPs by spin coating at 5000 rpm for 30 s
and heated at 110 °C for 20 min. Finally, 0.5 nm of LiF and 100
nm of aluminum electrodes were deposited by thermal evaporation under
a base pressure of ∼10–6 Torr. The active
area of each device was 1 mm2 for performance evaluation.
Characterization Methods
The top-view
and cross-sectional micrographs of the NiOx surface and
fabricated devices were investigated with an ultra-high-resolution
ZEISS Crossbeam scanning electron microscope. The surface morphology
and roughness of the NiOx thin film and NPLs were studied
using a Bruker Innova atomic force microscope. The absorption and
PL spectra of CdSe QDs were recorded with a Princeton Instruments
Acton 2150 spectrophotometer equipped with a Xe lamp as the light
source. The UPS measurements for the NiOx films and NPLs
were performed on a Thermo VG-Scientific/Sigma Probe spectrometer.
A He I (hν = 21.22 eV) discharge lamp was used
as the excitation source. The XPS measurements were conducted on a
Thermo K-Alpha X-ray photoelectron spectrometer for elemental composition
analysis of NiOx. The XRD patterns and crystallinity of
NiOx were measured using a Rigaku D/MAX2500 X-ray diffractometer.
The current density–voltage characteristics of hole- and electron-only
devices were measured using an Agilent 4155C semiconductor parameter
analyzer. The performance and electroluminescence spectra of QLEDs
were recorded using an Agilent 4155C semiconductor parameter analyzer
and an Ocean Optics USB2000+ spectrometer.