| Literature DB >> 32373750 |
Rocio Geng Vivanco1, Renata Silva Cardoso1, Ana Beatriz Silva Sousa2, Michelle Alexandra Chinelatti1, Sergio Augusto de Freitas Vincenti1, Rafaella Tonani-Torrieri1, Fernanda de Carvalho Panzeri Pires-de-Souza1.
Abstract
OBJECTIVES: This study evaluated the influence of thermo-mechanical cycling (TMC) on the bond strength (BS) of a universal adhesive system (UAS - Adper Single Bond Universal, 3M ESPE) to dentin treated or not with 0.2% chlorhexidine (CHX).Entities:
Keywords: Bond strength; Chlorhexidine; Dentin bonding durability; Material science; Thermo-mechanical cycling; Universal adhesive systems
Year: 2020 PMID: 32373750 PMCID: PMC7191587 DOI: 10.1016/j.heliyon.2020.e03871
Source DB: PubMed Journal: Heliyon ISSN: 2405-8440
Materials used.
| Materials | Composition | Manufacturer | Application protocol |
|---|---|---|---|
| Universal Filtek Z350 | BIS-GMA, BIS-EMA, UDMA and small quantities of TEGDMA. Non-agglomerated nanoparticles of silica 20nm in size and nanoagglomerates formed of zirconium/silica particles ranging from 0.6 to 1.4 μm in size. | 3M ESPE, Sumaré, SP, Brasil | |
| Adper ScotchBond Multi-Purpose (3-step etch-and-rinse adhesive system) | Primer: HEMA, PAMA, GPDM, polyalkenoic acid. | 3M ESPE, Sumaré, SP, Brasil | 1. Acid etching for 15 s; 2. Rinse for 30 s; 3. Dry with absorbent paper; 4. Apply primer and volatization with air dry for 15 s; 5. Apply adhesive. 6. Light activation for 20s. |
| Adper Single Bond Universal (Universal adhesive system applied in self-etch mode) | 10-MDP, dimethacrylate resins, HEMA, Vitrebond copolymer, filler, ethanol, water, initiators, silane | 3M ESPE, Sumaré, SP, Brasil | 1. Apply adhesive for 20 s; 2. Volatization with air dry for 5 s; 3. Light activation for 10s. |
| Gel etchant | 37 % H3PO4, colloidal silica, surfactant and coloring agent. | Dentsply, Petrópolis, Brasil | |
| 0.2 % aqueous Chlorhexidine solution | 0.2 % Chlorhexidine digluconate | Not applicable |
Bis-GMA (Bisphenol A-diglycidyl dimethacrylate); Bis- EMA- Bisphenol A-polyethylene glycol diether dimethacrylate; UDMA, Urethane Dimethacrylate; TEGDMA - Triethylene glycol dimethacrylate; HEMA (2-hydroxyethyl methacrylate); MDP - 10-Methacryloyloxydecyl dihydrogen phosphate; CQ – Camphorquinone.
Distribution of the groups (n = 10).
| Adhesive system | Pre-treatment | Aging |
|---|---|---|
| Etch-and-rinse adhesive system (3-step) (n = 40) | Control (n = 20) | No cycling |
| CHX (n = 20) | No cycling | |
| Control (n = 20) | Thermo-mechanical cycling | |
| CHX (n = 20) | Thermo-mechanical cycling | |
| Universal Adhesive system applied in self-etch mode (1-step) (n = 40) | Control (n = 20) | No cycling |
| CHX (n = 20) | No cycling | |
| Control (n = 20) | Thermo-mechanical cycling | |
| CHX (n = 20) | Thermo-mechanical cycling |
Comparison of the mean (standard deviation) bond strength (MPa) values for the groups tested (3-way ANOVA, Bonferroni, α = 5%), analyzing treatment and aging within each adhesive system.
| Adhesive system | Groups | Pre-treatment | Aging | |
|---|---|---|---|---|
| TMC | No TMC | |||
| Etch-and-rinse adhesive system (3-step) | ENR | Control | 23,9 (±0,7) aA | 15,2 (±0,8) bB |
| ENR + CHX | CHX | 25,6 (±5,0) aA | 36,1 (±6,4) aB | |
| Universal adhesive system applied in self-etch mode (1-step) | UAS | Control | 21,3 (±0,8) aA | 23,7 (±0,7) aA |
| UAS + CHX | CHX | 36,7 (±6,9) bA | 38,1 (±7,1) bA | |
Different letters, uppercase on the line and lowercase letters in the column, indicate statistically significant difference (p < .05).
Figure 1Comparison of the mean (standard deviation) bond strength (MPa) values between the adhesive systems tested. Bars below the line indicate statistically significant difference (p < .05).
Figure 2Fracture patterns for control groups (Without CHX).
Figure 3Fracture patterns for groups with chlorhexidine application.
Figure 4Photomicrographs (SEM) representative of the hybrid layer morphology of each of the groups tested. ∗ hybrid layer region; # adhesive system region. A) ENR with TMC; B) ENR without TMC; C) UAS with TMC; D) UAS without TMC; E) ENR CHX with TMC; F) ENR CHX without TMC; G) UAS CHX with TMC; H) UAS CHX without TMC.