| Literature DB >> 24115484 |
Taylor Ware1, Dustin Simon, Keith Hearon, Tong H Kang, Duncan J Maitland, Walter Voit.
Abstract
Neural interfaces provide an electrical connection between computers and the nervous system: current penetrating devices are orders-of-magnitude stiffer than surrounding tissue. In this work, recent efforts in softening electronics and utilize thiol-ene and thiol-epoxy "click" reactions are built upon to incorporate fluid-sensitive hydrogen bonding into smart substrates for high electrode density neural interfaces. The modulus of these substrates drops more than two orders of magnitude in response to physiological conditions, despite fluid uptake of less than 6%, and can be tuned by the covalent crosslink density and degree of hydrogen bonding in the polymer network. Intracortical and intrafascicular electrode arrays are fabricated and characterized with impedance spectroscopy and cyclic voltammetry.Entities:
Keywords: mechanical properties; stimuli-sensitive polymers; structure-property relations; thermosets; thin films
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Year: 2013 PMID: 24115484 PMCID: PMC4817906 DOI: 10.1002/mabi.201300272
Source DB: PubMed Journal: Macromol Biosci ISSN: 1616-5187 Impact factor: 4.979