| Literature DB >> 23724201 |
Maryam Khoroushi1, Farinaz Shirban, Mohammadreza Shirban.
Abstract
OBJECTIVE: In recent years, newly developed solvent-free dental adhesives have been introduced. The aim of this study was to evaluate the marginal integrity of a new one-step solvent-free self-etch adhesive and to compare it with a commonly used two-step self-etch adhesive as the gold standard.Entities:
Keywords: Composite Resins; Dentin; Enamel; Microleakage; Solvents
Year: 2013 PMID: 23724201 PMCID: PMC3666063
Source DB: PubMed Journal: J Dent (Tehran) ISSN: 1735-2150
Adhesive Resins Used in the Study, Their Compositions and Manufacturers’ Instructions for Use
| Clearfil SE Bond (two-step, self etch adhesive) | Apply primer gently on the surface and leave undisturbed for 20 seconds. Gently air blow. Apply bond. Air thin and light cure for 10 seconds. | Primer: 10-MDP, HEMA, hydrophilic dimethacrylate, N,N-diethanol p-toluidine,water |
| Bond 1®SF (one-step self-etch adhesive) (Pentron Clinical, USA) | Scrub a layer of the bonding agent on the tooth’s surface for 20 seconds. light cure for 10 seconds. | UDMA, TEGDMA, HEMA, 4-MET,silane treated barium glass, silica(amorphous), photo curing system |
HEMA: Hydroxyl ethyl methacrylate;10-MDP: 10- Methacryloyloxydodecyl dihydrogen phosphate ; TEGDMA: Triethylen glycol dimethacrylateudma ;4-MET: 4-methacryloxyethyltrimellitic acid, UDMA: Urethane dimethacrylate
Bis-GMA: Bisphenol A-Glycidyl methacrylate; CQ: Comphorquinone.
Frequency of Microleakage Scores in the Enamel/Dentin Margins for the Study Groups
| 7 | 5 | 1 | 1 | 14 | ||
| 3 | 7 | 3 | 1 | 14 | ||
| 10 | 0 | 1 | 3 | 14 | ||
| 0 | 3 | 4 | 7 | 14 | ||
CSEB: Clearfil SE Bond; B1SF: Bond 1 SF
Fig 1Enamel/composite interfaces using B1SF as bonding agent. C: Composite resin; E: Enamel; Original magnification 2000×
Fig 2Enamel/composite interfaces using CSEB as bonding agent. C: Composite resin; E: Enamel; Original magnification 2000×
Fig 3Dentin/composite interfaces using B1SF as bonding agent. C: Composite resin; D: Dentin; Original magnification 500×
Fig 4Dentin/composite interfaces using CSEB asbonding agent. C: Composite resin; D: Dentin; Original magnification 500×