| Literature DB >> 21308290 |
Andrea Mello de Andrade1, Sandra Kiss Moura, Alessandra Reis, Alessandro Dourado Loguercio, Eugenio Jose Garcia, Rosa Helena Miranda Grande.
Abstract
OBJECTIVES: The aims of this study were to evaluate the effect of resin composite (Filtek Z250 and Filtek Flow Z350) and adhesive system [(Solobond Plus, Futurabond NR (VOCO) and Adper Single Bond (3M ESPE)] on the microtensile (μTBS) and microshear bond strength (μSBS) tests on enamel, and to correlate the bond strength means between them.Entities:
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Year: 2010 PMID: 21308290 PMCID: PMC3881754 DOI: 10.1590/s1678-77572010000600010
Source DB: PubMed Journal: J Appl Oral Sci ISSN: 1678-7757 Impact factor: 2.698
Composition, mode of application and batch number of the adhesives used
| Adper Single Bond 2 (3M ESPE) | 1. Scotchbond - 35% phosphoric acid 2. Adhesive - Bis-GMA, HEMA, dimethacrylates, polyalkenoic acid copolymer, initiators, water and ethanol | a, b, c, d, e, h | 7KK |
| SoloBond Plus (VOCO) | 1. Etching agent - Vococid 36% phosphoric acid 2.Primer - Maleic acid, hydrophilic methacrylates, polyfunctional monomers, acetone, water 3. Bonding agent - HEMA, polyfunctional monomers | a1, b1, c, d1, e, f, i | 621667 |
| Futurabond NR (VOCO) | 1. BIS-GMA, HEMA, phosphate methacrylates, BHT, ethanol, fluorides and organic acids | f1, f2, g, h | |
| Filtek Z250 (3M ESPE) | 1. Bis-GMA, UDMA and Bis-EMA, filler. Additional contents: stabilizers, catalysts and pigments. Particle size (average diameter: 0.6[0.01-3.5]) and approximately 83% wt filler load | ±2 mm light cured for 40 s at 600 mW/cm2 | 7WN |
| Filtek Flow Z350 (3M ESPE) | 2. Methacrylate resin monomers Bis-GMA, TEGDMA and Bis-EMA; dimethacrylate polymer; silica (75 nm) and zirconia (5-10 nm) nanofiller; approximately 65% wt filler load. | ±2 mm light cured for 40 s at 600 mW/cm2 | 6AR |
a- acid-etching (15 s); a1- acid-etching (30 s); b- rinsing (15 s); b1- rinsing (20 s); c- air-drying (30 s); d- two coats of adhesive were lightly applied (15 s); d1- one coat of primer was lightly applied(30 s); e- air-dry for 10 s at 20 cm; f- one coat of adhesive was applied (15 s); f1- mix one drop of liquid A and one drop of liquid B(5 s); f2- one coat of adhesive was lightly applied (20 s); g- air dry for s at 20 cm; h- light-polymerization (10 s - 600 mW/cm2); i- light polymerization (20 s -600 mW/cm2) Bis-GMA: bisphenol A diglycidyl methacrylate; HEMA: 2-hydroxyethyl methacrylate; BHT: butylated hydroxy toluene; UDMA: urethane dimethacrylate; TEGDMA: Triethylene glycol dimethacrylate; Bis-EMA: Bisphenol A polyethylene glycol diether dimethacrylate.
Fracture pattern mode [percentage (number)] of pre-testing failures according to each experimental condition
| Filtek Z250 | Solobond Plus | 46.8 (36) | 2.6 (2) | 44.2 (34) | 1.3 (1) | 5.2 (4) |
| Single Bond | 41.8 (33) | 6.3 (5) | 35.4 (28) | 0.0 (0) | 16.5 (12) | |
| Futurabond NR | 49.4 (39) | 11.4 (9) | 29.1 (23) | 1.3 (1) | 8.9 (7) | |
| Filtek Flow Z350 | Solobond Plus | 62.7 (47) | 1.1 (1) | 23.2 (20) | 0.0 (0) | 20.9 (18) |
| Single Bond | 54.1 (46) | 2.4 (2) | 17.7 (15) | 0.0 (0) | 25.9 (22) | |
| Futurabond NR | 55.1 (49) | 0.0 (0) | 25.8 (23) | 1.1 (1) | 18.0 (16) | |
| Filtek Z250 | Solobond Plus | 71.4 (10) | 0 (0) | 28.6 (4) | 0 (0) | 0.0 (0) |
| Single Bond | 40.0 (6) | 0 (0) | 60.0 (9) | 0 (0) | 0.0 (0) | |
| Futurabond NR | 31.3 (5) | 0 (0) | 62.5 (10) | 0 (0) | 6.2 (1) | |
| Filtek Flow Z350 | Solobond Plus | 70.6 (12) | 0 (0) | 23.5 (4) | 0 (0) | 5.9 (1) |
| Single Bond | 45.5 (5) | 0 (0) | 45.5 (5) | 0 (0) | 9.0 (1) | |
| Futurabond NR | 50.0 (10) | 0 (0) | 45.0 (9) | 0 (0) | 5.0 (1) | |
Figure 2Representative figures of the failure modes observed in the microtensile (200x) (A-D) and microshear (140x) (E-F) tests. In (A), one can see an adhesive fracture pattern (white star). (B) and (E) represents cohesive resin failure. Black star shows resin composite in the same surface of both fractured specimens. (C) and (F) are mixed failures. Enamel is represented by the pointer, adhesive by the white star and resin composite by the black star. (C) represents a cohesive failure in enamel
Microtensile (µTBS) and microshear bond strength (µSBS) values ± standard deviations (MPa)
| Solobond Plus | Filtek Z250 (A) | 34.7±2.4 | 26.9±6.6 |
| Single Bond | 33.2±9.8 | 33.9±4.2 | |
| Futurabond NR | 33.6±7.1 | 27.3±6.8 | |
| Solobond Plus | Filtek Flow Z350 (B) | 22.4±5.3 | 15.6±2.2 |
| Single Bond | 23.4±5.3 | 14.6±4.6 | |
| Futurabond NR | 28.0±6.3 | 20.5±4.0 |
(*) Groups with different letters are statistically different for tests (Tukey's test, p<0.05).
Figure 3Linear relationship between microshear (MPa) and microtensile bond strength means (MPa)
Figure 4Scanning eletron microscopy micrographs of the 35% phosphoric acid etching (A) and the self-etch Futurabond NR (B) patterns. Selective demineralization of enamel prism periphery can be observed (white arrow, type 2 pattern). Prism cores were also superficially demineralized increasing the bonding area (pointer). (B) Demineralization created by self-etch adhesive resembles the type 2 pattern, prism peripheries were demineralized more deeply than prism cores. A shallower demineralization is observed in comparison to that produced by the phosphoric acid treatment