| Literature DB >> 34764392 |
Xin Ying Chan1, Nazanin Saeidi2, Alireza Javadian3, Dirk E Hebel3, Manoj Gupta1.
Abstract
Mycelium, as the root of fungi, is composed of filamentous strands of fine hyphae that bind discrete substrate particles into a block material. With advanced processing, dense mycelium-bound composites (DMCs) resembling commercial particleboards can be formed. However, their mechanical properties and performance under the working conditions of particleboards are unknown. Here, we show how weathering conditions affect the DMC stress and elastic modulus. DMC was made using Ganoderma lucidum mycelium grown on a substrate of sawdust and empty fruit bunch. The DMC was then subjected to weathering under tropical conditions over 35 days and tested under flexural, tensile, and compressive loading with reference to international standards. After exposure to specified weathering conditions, the maximum stress in flexure, tension, and compression decreased substantially. The addition of a protective coating improved the resistance of DMC to weathering conditions; however, the difference between coated and uncoated samples was only found to be statistically significant in tensile strength.Entities:
Year: 2021 PMID: 34764392 PMCID: PMC8586338 DOI: 10.1038/s41598-021-01598-4
Source DB: PubMed Journal: Sci Rep ISSN: 2045-2322 Impact factor: 4.379
Figure 1Testing specimens: (a) dimensions of testing samples and (b) test specimens for flexural, tensile and compression testing (from top to bottom).
Figure 2Mechanical test results: (a) RB and CP against the number of days exposed to weathering conditions; (b) RC and CP against the number of days exposed to weathering conditions; (c) RT and CP against the number of days exposed to weathering conditions and (d) ET and CP against the number of days exposed to weathering conditions.
Figure 3SEM images of different surfaces: (a) and (b) Surfaces with smoother textures and (c) and (d), Surfaces with more porous textures. Examples of pores are shown by arrows in the images.