| Literature DB >> 33680892 |
Nelly Pradelle-Plasse1,2,3, Caroline Mocquot1,2,3, Katherine Semennikova1,2,3, Pierre Colon1,2,3, Brigitte Grosgogeat3,4,5.
Abstract
OBJECTIVES: This study aimed to evaluate the interface between a calcium silicate cement (CSC), Biodentine and dental adhesives in terms of sealing ability.Entities:
Keywords: 10-MDP; Adhesives; Calcium silicate; Leakage; Substitutes
Year: 2020 PMID: 33680892 PMCID: PMC7906853 DOI: 10.5395/rde.2021.46.e3
Source DB: PubMed Journal: Restor Dent Endod ISSN: 2234-7658
Materials used in this study
| Family of material | Material | Components | pH | Protocol | ||
|---|---|---|---|---|---|---|
| Calcium silicate | Biodentine (Septodont, St. Maur-des-Fossés, France) | Solid: tricalcium silicate (> 80%), calcium carbonate, zirconium oxide | 12.5 | 1. Incorporate 5 drops of liquid in the powder. | ||
| Liquid: water, CaCl2, partially modified polycarboxylate | 2. Close the capsule and put it 30 sec in the oscillator. | |||||
| Adhesive system | ||||||
| Self-etch 2 steps | Optibond XTR (Kerr, Orange, CA, USA; batch: LE03355) | Primer: GPDM, HEMA, water, acetone, ethanol, camphorquinone | Primer: 2.4 | 1. Apply primer to enamel/dentin using scrubbing motion (20 sec). | ||
| Bonding: HEMA, MEHQ, ethanol, camphorquinone, loads of silica | Bond: 3.3 | 2. Air thin with medium air pressure (5 sec). | ||||
| 3. Shake adhesive briefly, and apply to enamel/dentin surface using light brushing motion (15 sec). | ||||||
| 4. Air thin with medium air pressure, and then strong air for at least 5 sec. | ||||||
| 5. Light-cure (10 sec). | ||||||
| Clearfil SE Bond (Kuraray, Okayama, Japan; batch: 041838) | Primer: 10-MDP, HEMA, dimethacrylate aliphatque absorbent, camphorquinone, N-diethanol-p-toluidine, water | 2.0 | 1. Apply primer and leave for 20 sec. | |||
| Bonding:10-MDP, Bis-GMA, HEMA, dimethacrylate aliphatic hydrophobic subject, camphoroquinone, N-diethanol-p-toluidine, loads of silica | 2. Do not rinse and dry with mild air flow. | |||||
| 3. Apply bond and distribute evenly with mild air flow. | ||||||
| 4. Light-cure for 10 sec. | ||||||
| Self-etch 1 step | Xeno III (Dentsply/Caulk, Mildford, DE, USA; batch: 1212000562) | Liquid A: HEMA, water purified, ethanol, BHT, silicon dioxide | < 1.0 | 1. Apply generous amounts of self-etch adhesive to wet all cavity surfaces thoroughly. | ||
| Liquid B: Pyro-EMA, PEM-F, urethan dimethacrylate, BHT, camphorquinone, ethyl-4-Dimethylaminobenzoate | 2. Leave undisturbed for at least 20 sec. | |||||
| 3. Uniformly spread the adhesive using a gentle stream of oil free air for at least 2 sec. | ||||||
| 4. Cure the adhesive with a light-curing unit for at least 10 sec. | ||||||
| G-aenial Bond (GC, Tokyo, Japan; batch: 1301161) | 4-META, acetone, water, triethyleneglycol dimethacrylate, phosphoric acid ester monomer, silica loads, photo-initiators | 2.0 | 1. Apply to the prepared enamel and dentin surfaces using the disposable applicator. | |||
| 2. Leave undisturbed for 10 sec after applying. | ||||||
| 3. Then, dry thoroughly for 5 sec with oil-free air under maximum air pressure. | ||||||
| 4. Light-cure for 10 sec. | ||||||
| Clearfil Tri-S Bond (Kuraray, Okayama, Japan; batch: 1M004) | MDP, Bis-GMA, HEMA, Absorbent aliphatic dimethacrylate, hydrophobic aliphatic methacrylate, silica colloidal, sodium fluoride, di-camphorquinone, accelerators, initiators, ethanol, water | 2.7 | 1. Apply bond to the entire cavity wall with the applicator brush. Leave it in place for 10 sec. | |||
| 2. Dry the entire cavity wall sufficiently by blowing mild air for more than 5 sec. | ||||||
| 3. Light-cure for 10 sec. | ||||||
| Universal | ScotchBond Universal (3M ESPE, Monrovia, CA, USA; batch: 70201139014) | MDP, resin of dimethacrylate, HEMA, Vitrebond copolymer, loads, ethanol, water, silane | 2.7 | Protocol 1: self-etch 1-step | ||
| 1. Apply the adhesive to the prepared tooth and rub it in for 20 sec. | ||||||
| 2. Gently air dry the adhesive for approximately 5 sec to evaporate the solvent. | ||||||
| 3. Light-cure for 10 sec. | ||||||
| Protocol 2: etch-and-rinse 2-steps | ||||||
| 1. Apply orthophosphoric acid for 15 sec. | ||||||
| 2. Apply the adhesive to the prepared tooth and rub it in for 20 sec. | ||||||
| 3. Gently air dry the adhesive for approximately 5 sec to evaporate the solvent. | ||||||
| 4. Light-cure for 10 sec. | ||||||
| Etch-and-rinse 2 steps | Prime & Bond (Dentsply DeTrey, Konstanz, Germany; batch: 1206001168) | Resin di- and trimethacrylate, silica, PENTA, photo-initiators, stabilizing, cetylamine hydrofluoride, acetone | 2.0 | 1. Application of orthophosphoric acid 37% for at least 15 sec. | ||
| 2. Rinsing and blot drying for at least 10 sec. | ||||||
| 3. Application of Prime & Bond for 20 sec. | ||||||
| 4. Remove excess solvent by gently drying for at least 5 sec. | ||||||
| 5. Cure Prime & Bond adhesive for 10 sec. | ||||||
| Acid | Orthophosphoric acid 37% (Dentsply DeTrey, Konstanz, Germany; batch: 155245) | Phosphoric acid, water, thickener, methylen Blue benzalkonium chloride | 0.4 | |||
| Composite resin | Ceram X Mono (Dentsply, York, PA, USA; batch: 1107000M97) | Methacrylate modified polysiloxane, dimethacrylate resin, fluorescence pigment, UV stabilizer, stabilizer, camphorquinone, ethyl-4(dimethylamino)benzoate, barium-aluminium-borosilicate glass, methacrylate functionalised silicon dioxide nano filler, iron oxide pigments and titanium oxide aluminium sulfo silicate pigments | ND | The composite resin material is incrementally placed and light-cured for 20 sec. | ||
CaCl2, calcium chloride; GPDM, glycero-phosphate dimethacrylate; HEMA, hydroxyethylmethacrylate; MEHQ, hydroquinone monomethyl ether; MDP, methacryloyloxydecyl dihydrogen phosphate; Bis-GMA, bisphenol A-glycidyl methacrylate; BHT, butylated hydroxytoluene; Pyro-EMA, tetramethacryloxyethyl pyrophosphate; PEM-F, pentamethacryloxyethyl cyclophosphazen mono fluoride; META, methacryloyloxyethy trimellitate anhydride; PENTA, dipentaerythritol penta acrylate monophosphate; UV, ultraviolet; ND, not designated.
Figure 1Cavity preparation and measurements of the dye penetration length.
Figure 2Tooth section: on the left, the arrow shows silver nitrate penetration along the interface; on the right no penetration.
Percentage of percolation according to the adhesive system used for both time points
| Adhesive family | Adhesive system | % of percolation at D0 | % of percolation at D7 |
|---|---|---|---|
| Etch & rinse | Prime & Bond NT | 2.01% (1.072) | 0.38% (0.38) |
| Scotchbond Universal ER | 2.19% (0.611)* | 5.3% (1.328)* | |
| Self-etch 1 step | G-aenial Bond | 2.32% (0.821) | 4.95% (1.642) |
| Scotchbond Universal SE | 2.58% (1.084)* | 12.58% (2.177)* | |
| Xeno III | 4.33% (0.930)* | 18.49% (2.652)* | |
| Clearfil Tri-S Bond | 5.37% (2.274) | 5.7% (1.715) | |
| Self-etch 2 steps | Clearfil SE Bond | 5.95% (2.723) | 5.85% (1.303) |
| Optibond XTR | 9.73% (1.832)* | 0.97% (0.464)* |
Data are presented as mean % (standard error).
D0, immediate restoration; D7, delayed restoration (7 days).
*Represents significant differences for each adhesive system at D0 and D7 (p < 0.05).
Intergroup analysis at D0
| Prime & Bond NT | Scotchbond Universal ER | G-aenial Bond | Scotchbond Universal SE | Xeno III | Clearfil Tri-S Bond | Clearfil SE Bond | Optibond XTR | |
|---|---|---|---|---|---|---|---|---|
| Prime & Bond NT | NS | NS | NS | NS | NS | NS | S | |
| Scotchbond Universal ER | NS | NS | NS | NS | NS | NS | S | |
| G-aenial Bond | NS | NS | NS | NS | NS | NS | S | |
| Scotchbond Universal SE | NS | NS | NS | NS | NS | NS | S | |
| Xeno III | NS | NS | NS | NS | NS | NS | S | |
| Clearfil Tri-S Bond | NS | NS | NS | NS | NS | NS | NS | |
| Clearfil SE Bond | NS | NS | NS | NS | NS | NS | NS | |
| Optibond XTR | S | S | S | S | S | NS | NS |
NS, no significant difference; S, significant difference (p < 0.05).
Intergroup analysis at D7
| Prime & Bond NT | Scotchbond Universal ER | G-aenial Bond | Scotchbond Universal SE | Xeno III | Clearfil Tri-S Bond | Clearfil SE Bond | Optibond XTR | |
|---|---|---|---|---|---|---|---|---|
| Prime & Bond NT | NS | NS | S | S | S | S | NS | |
| Scotchbond Universal ER | S | NS | S | S | NS | NS | NS | |
| G-aenial Bond | NS | NS | S | S | NS | NS | NS | |
| Scotchbond Universal SE | S | S | S | S | S | S | S | |
| Xeno III | S | S | S | S | S | S | S | |
| Clearfil Tri-S Bond | S | NS | NS | S | S | NS | NS | |
| Clearfil SE Bond | S | NS | NS | S | S | NS | NS | |
| Optibond XTR | NS | NS | NS | S | S | NS | NS |
NS, no significant difference; S, significant difference (p < 0.05).
Figure 3Scanning electron microscopic (SEM) observation of Biodentine/2 steps self-etch system (Clearfil SE Bond) interface (×1,000).
Figure 4Scanning electron microscopic (SEM) observation of Biodentine/one step self-etch system (Clearfil Tri-S Bond) interface (×1,000).
Figure 5Scanning electron microscopic (SEM) observation of Biodentine/universal system used as one step self-etch system (Scotchbond Universal) interface (×1,000).
Figure 6Scanning electron microscopic (SEM) observation of Biodentine/universal system used as etch-and-rinse system (Scotchbond Universal) interface (×1,000).
Figure 7Scanning electron microscopic (SEM) observation of Biodentine/etch-and-rinse system (Prime & Bond) interface (×1,000).