| Literature DB >> 33644465 |
Rodrigo Ortega-Toro1, Alex López-Córdoba2, Felipe Avalos-Belmontes3.
Abstract
This work aims to improve the physicochemical properties of polylactic acid (PLA) and thermoplastic yam starch (TPS) blends using epoxidised sesame oil (ESO). We used epoxidised sesame oil from two Colombian Caribbean crops: Dioscorea rotundata and Sesamum indicum, with an oil substitution of 58.4 %. Films were obtained through extrusion and compression moulding processes. Moisture content, solubility, contact angle, and mechanical, barrier, and structural properties were determined using optical and scanning electron microscopy, infrared Fourier transform spectroscopy. Thermal analyses were also performed using thermogravimetry and differential scanning calorimetry techniques. The results suggest that the PLA and TPS interactions can be improved with the addition of ESO as coupling agent, enhancing the interfacial adhesion between the polymers, and favouring the smoothness of the film surface. Furthermore, the ESO addition led to increased thermal stability while restricting molecular mobility, indicating a coupling agent effect. In conclusion, the use of epoxidised oil for preparing films based on high PLA content and TPS allows obtaining enhanced interfacial adhesion. Considering the above, the developed materials have potential application in semi-rigid food packaging.Entities:
Keywords: Biodegradable films; Coupling agent; Dioscuri rotundata; Plasticiser; Sesamum indicum
Year: 2021 PMID: 33644465 PMCID: PMC7887399 DOI: 10.1016/j.heliyon.2021.e06176
Source DB: PubMed Journal: Heliyon ISSN: 2405-8440
Mass fraction of studied formulations.
| Formulations | PLA | TPS | Glycerol | Epoxidized sesame oil |
|---|---|---|---|---|
| PLA | 1.000 | 0.000 | 0.000 | 0.000 |
| TPS | 0.000 | 0.800 | 0.200 | 0.000 |
| PLA75/TPS25 | 0.706 | 0.235 | 0.059 | 0.000 |
| PLA75/TPS25/ESO1.5 | 0.696 | 0.232 | 0.058 | 0.014 |
| PLA75/TPS25/ESO3 | 0.686 | 0.229 | 0.057 | 0.027 |
Mean values and standard deviation of thickness (μm), moisture content (g of water/100g dry film), solubility in water (g soluble film/100g dry film), contact angle (°) and water vapor permeability (g· mm/kPa·h·m2) of the studied formulations conditioned at 53% R.H. and 25 °C.
| Formulations | Thickness | Moisture | Solubility in water | Contact angle | Water vapor permeability |
|---|---|---|---|---|---|
| PLA | 175 ± 26a | 0.36 ± 0.05a | 0.30 ± 0.09a | 63.3 ± 1.5d | 0.36 ± 0.11a |
| TPS | 439 ± 34c | 11.0 ± 0.8d | 28.4 ± 0.8c | 52.3 ± 0.6a | 9.43 ± 0.76d |
| PLA75/TPS25 | 198 ± 34b | 3.7 ± 0.5c | 6.6 ± 0.9b | 61.7 ± 2.5c | 2.30 ± 0.87c |
| PLA75/TPS25/ESO1.5 | 181 ± 17ab | 3.1 ± 0.4bc | 6.3 ± 1.7b | 61.0 ± 2.6c | 1.52 ± 0.33b |
| PLA75/TPS25/ESO3 | 176 ± 21a | 2.7 ± 0.6b | 6.7 ± 0.3b | 55.5 ± 0.7b | 1.36 ± 0.26b |
Different superscript letters mean significant differences (p < 0.05) between formulations.
Mean values and standard deviation of the elastic modulus (EM), tensile strength (TS) and deformation of the studied films (E) conditioned at 53% R.H. and 25 °C.
| Formulations | EM (MPa) | TS (MPa) | E (%) |
|---|---|---|---|
| PLA | 1276 ± 84c | 48 ± 3e | 4.5 ± 0.3b |
| TPS | 95 ± 12a | 8.1 ± 1.1a | 35 ± 5c |
| PLA75/TPS25 | 1123 ± 12b | 29.1 ± 0.8d | 3.8 ± 0.2a |
| PLA75/TPS25/ESO1.5 | 1105 ± 11b | 25.4 ± 0.5c | 4.8 ± 0.5b |
| PLA75/TPS25/ESO3 | 1094 ± 9b | 23.1 ± 0.7b | 5.3 ± 0.3b |
Different superscript letters mean significant differences (p < 0.05) between formulations.
Figure 1Surface optical micrographs of the studied films (40X) conditioned at 53% R.H. and 25 °C.
Figure 2Cross-section SEM micrographs of studied films without epoxidized oil (PLA75/TPS25) and with epoxidized oil (PLA75/TPS25/ESO3).
Figure 3FTIR Spectra of studied films with and without epoxidized oil conditioned at 53% R.H. and 25 °C: A) Complete FTIR spectra; B) FTIR spectra section between 2800 cm−1 and 3700 cm−1; C) FTIR spectra section between 1700 cm−1 and 1800 cm−1 and D) FTIR spectra section between 800 cm−1 and 1070 cm−1
Figure 4Thermogravimetry of the studied films conditioned at 53% R.H. and 25 °C: A) Thermogravimetric curve “TG”; B) Thermogravimetric curve first order derivative “DTG”.
Mean values and standard deviation of parameters obtained by DSC (glass transition temperature of PLA) and TGA (Maximum degradation temperature (TPeak) and Initial degradation temperature (T0)) of studied films conditioned at 53 % R.H. and 25 °C.
| Formulations | DSC | TGA | |
|---|---|---|---|
| Tg (°C) | TPeak (°C) | T0 (°C) | |
| PLA | 54.24 ± 0.3b | 315.6 ± 0.5a | 245.0 ± 0.2b |
| TPS | --- | 337.5 ± 1.1c | 236.1 ± 0.5a |
| PLA75/TPS25 | 50.6 ± 0.5a | 342.4 ± 0.9d | 267.33 ± 0.5c |
| PLA75/TPS25/ESO1.5 | 57.2 ± 1.6c | 341.3 ± 0.5d | 265.95 ± 0.3c |
| PLA75/TPS25/ESO3 | 57.9 ± 1.3c | 329.7 ± 0.5b | 285.13 ± 0.5d |
Different superscript letters mean significant differences (p < 0.05) between formulations.