| Literature DB >> 32098359 |
Agnieszka Nawrocka1, Monika Lukomska-Szymanska1.
Abstract
The technique described as indirect bonding is an alternative to the conventional intraoral method of bracket placement. The appliance position is planned and fixed on a plaster model and then transferred into the oral cavity. Indirect bonding is a precise and time-saving technique of bracket placement, growing in popularity in recent years. It provides a combination of great precision with time efficiency. The fundaments of the indirect bonding technique are presented here. From the first clinical trial conducted almost fifty years ago, the method has evolved; the progress that has been made is described. Modern technologies involving computer scanning and manufacturing have led to great precision in bracket placement. Digital innovations such as rapid prototyping and stereolithography open up a new avenue of research and represent the next steps in indirect technique development. Individual 3D transfers are convenient in difficult clinical cases and can improve the effectiveness of the procedure, reduce the number of technical stages and reduce total chairside time. This paper also summarizes the advancement in adhesive materials, including an overview of advantages and disadvantages of different types of bonding resins and of the mean shear bond strength (SBS) achieved in the indirect procedure.Entities:
Keywords: digital technologies; indirect-bonding progress; orthodontics
Year: 2020 PMID: 32098359 PMCID: PMC7078802 DOI: 10.3390/ma13040986
Source DB: PubMed Journal: Materials (Basel) ISSN: 1996-1944 Impact factor: 3.623
Figure 1The stages of Silvermann’s technique.
Mean shear bond strength (SBS) of different materials used in the indirect bonding technique.
| Author (Year) | Data from Research | ||||
|---|---|---|---|---|---|
| Method | Material | Number of Teeth | Mean SBS (SD) | Conclusions | |
| Hocevar et al., 1988 [ | Direct | Concise (3M, St Paul, Minn, USA) | 18 | 6.69 (0.92) | NSD |
| Indirect | Concise (3M, St Paul, Minn, USA) | 18 | 6.40 (0.87) | ||
| Milne et al., 1989 [ | Direct | Concise (3M, St Paul, Minn, USA) | 12 | 19.06 (1.67) | NSD |
| Indirect | Concise (3M, St Paul, Minn, USA) | 12 | 16.77 (3.04) | ||
| Yi et al., 2003 [ | Direct | Transbond XT (3M Unitek, Monrovia, CA, USA) | 27 | 10.9 (2.9) | NSD |
| Indirect | APC, Sondhi Rapid Set (3M Unitek, Monrovia, CA, USA) | 27 | 11.2 (2.6) | ||
| Klocke et al., 2003 [ | Direct | Transbond XT (3M Unitek, Monrovia, CA, USA) | 20 | 13.88 (4.33) | TC: lower SBS |
| Indirect | Thermacure+MaximumCure (Reliance Orthodontic Products, Itasca, Ill, USA) | 20 | 7.28 (4.88) | ||
| Thermacure+Custom IQ (Reliance Orthodontic Products, Itasca, Ill, USA) | 20 | 7.07 (4.11) | |||
| PhaseII+MaximumCure (Reliance Orthodontic Products, Itasca, Ill, USA) | 20 | 15.41 (3.21) | |||
| APC, Sondhi Rapid Set (3M Unitek, Monrovia, CA, USA) | 20 | 14.99 (2.85) | |||
| Polat et al., 2004 [ | Direct | Transbond XT (3M Unitek, Monrovia, CA, USA) | 20 | 12,8 (5.4) | Transbond XT + SondhiRapidSet: lower SBS |
| Indirect | Thermacure+CustomIQ+adhesion booster (Reliance Orthodontic Products, Itasca, Ill, USA) | 20 | 10.3 (4.1) | ||
| Transbond XT, Sondhi Rapid Set (3M Unitek, Monrovia, CA, USA) | 20 | 6.1 (1.6) | |||
| Linn et al., 2006 [ | Direct | Transbond XT (3M Unitek, Monrovia, CA, USA) | 20 | 16,27 (4.74) | NSD |
| Indirect | Transbond XT, Sondhi Rapid Set (3M Unitek, Monrovia, CA, USA) | 20 | 14.76 (4.06) | ||
| Enlight LV, OrthoSolo (Orm- co Corporation, Glendora, Calif, USA) | 20 | 13,83 (4.27) | |||
Legend: TC—Thermally Cured Material; CC—Chemo-Cured Material; LC—Light-Cured Material; SBS—Shear Bond Strength; SD—Standard Deviation; NSD—No Significant Difference
Advantages and disadvantages of various types of materials used in the indirect bonding technique [4,5,8,15,16,17].
| Enamel Preparation | Adhesive on Bracket Base | Sealant | Advantages | Disadvantages |
|---|---|---|---|---|
|
| CC | CC(2 components, (catalyst on bracket base and universal unfilled resin on enamel) | -Less failures than in Silvermann’s technique [ | -Limited time for bracket placement [ |
|
| TC | CC(2 components, mixed before application) | -Unlimited time for bracket placement [ | -Lower SBS in comparison to LC and CC bracket bases [ |
|
| LC | CC (2 components, mixed before application) | -Unlimited time for bracket placement [ | The risk of bonding failure between sealant and composite [ |
|
| LC | SET, LC (2 components, mixed before an application) | Reduced amount of adhesive after debonding (lower ARI) in comparison to AET [ | Lower SBS than AET [ |
Legend: TC—thermally cured material; CC—chemo-cured material; LC—light-cured material; SBS—shear bond strength; SET—self-etch technique; AET—acid-etch technique; DB—direct bonding
Figure 2Sondhi’s indirect bonding procedure. APC—Adhesive Precoated Bracket; NC—Non-coated bracket; A—orthodontic adhesive; RA—resin A in Sondhi’s System; RB—resin B in Sondhi’s System.
Figure 3SBS of Sondhi’s Rapid Set in different articles.
Figure 4The virtual orthodontic technique.