| Literature DB >> 31893225 |
Robert W Day1, D Kwabena Bediako2,3, Mehdi Rezaee2, Lucas R Parent4,5, Grigorii Skorupskii1, Maxx Q Arguilla1, Christopher H Hendon6, Ivo Stassen1, Nathan C Gianneschi4, Philip Kim2, Mircea Dincă1.
Abstract
Crystalline, electrically conductive, and intrinsically porous materials are rare. Layered two-dimensional (2D) metal-organic frameworks (MOFs) break this trend. They are porous crystals that exhibit high electrical conductivity and are novel platforms for studying fundamentals of electricity and magnetism in two dimensions. Despite demonstrated applications, electrical transport in these remains poorly understood because of a lack of single crystal studies. Here, studies of single crystals of two 2D MOFs, Ni3(HITP)2 and Cu3(HHTP)2, uncover critical insights into their structure and transport. Conductivity measurements down to 0.3 K suggest metallicity for mesoscopic single crystals of Ni3(HITP)2, which contrasts with apparent activated conductivity for polycrystalline films. Microscopy studies further reveal that these MOFs are not isostructural as previously reported. Notably, single rods exhibit conductivities up to 150 S/cm, which persist even after prolonged exposure to ambient conditions. These single crystal studies confirm that 2D MOFs hold promise as molecularly tunable platforms for fundamental science and applications where porosity and conductivity are critical.Entities:
Year: 2019 PMID: 31893225 PMCID: PMC6936098 DOI: 10.1021/acscentsci.9b01006
Source DB: PubMed Journal: ACS Cent Sci ISSN: 2374-7943 Impact factor: 14.553
Figure 1Porous, conductive 2D MOFs. Schematic illustrating the general structure of conductive 2D MOFs where layers stack in the c direction to form intrinsically porous crystals with pores of approximately 2 nm in diameter. Metal atoms and organic ligands comprise the honeycomb lattice of the 2D layers. Ni3(HITP)2 and Cu3(HHTP)2 have M/X = Ni/NH and Cu/O respectively.
Figure 2Conductive 2D MOF devices of Ni3(HITP)2. (a) SEM of a single rod Ni3(HITP)2 device with Ti/Pd contacts. Scale bar, 1 μm. (b) Current–voltage plots of a single rod Ni3(HITP)2 device at 295 K (red) and 1.4 K (blue). Inset: Normalized magnetoresistance at several fixed temperatures. (c, d) 4-probe temperature-dependent conductance (solid line; left axis) of a single rod device (c) and a polycrystalline film device (d) of Ni3(HITP)2 and their corresponding Zabrodskii plots with their reduced activation energy (dotted lines; right axes). Inset: Temperature-dependent conductance plotted with linear axes.
Figure 3Cu3(HHTP)2. (a, b) SEM images of Cu3(HHTP)2 rods (a) and particles (b) obtained using distinct synthetic conditions (see Methods). Scale bars, 1 μm. (c) Room temperature I–V curves of an exfoliated Cu3(HHTP)2 flake (solid line) and Cu3(HHTP)2 rod (dashed line) at 295 K. Insets show SEM images for corresponding devices.
Figure 4TEM of Ni3(HITP)2 and Cu3(HHTP)2. (a) Left: HRTEM image of a Ni3(HITP)2 rod whose long axis lies along the z-direction. Middle: FFT from a lower-magnification TEM image. Right: Schematic of Ni3(HITP)2 structure illustrated for four layers in a near-eclipsed stacking configuration for imaging perpendicular (top schematic) and parallel (bottom schematic) to the 2D layers. Bottom: average intensity in the z-direction measured along the x-direction from the green box in the HRTEM image. The periodic features seen in the FFT are indicated with the red, orange, and blue lines. The gray lines extending from the intensity profile to the schematic indicate the pathways giving rise to the observed intensity profile. Scale bar, 5 nm. (b) Left: HRTEM image of a Cu3(HHTP)2 rod whose long axis lies along the z-direction. Middle: FFT from a lower-magnification TEM image. Right: Schematic of the Cu3(HHTP)2 structure illustrated for four layers in a near-eclipsed stacking configuration for imaging perpendicular (top schematic) and parallel (bottom schematic) to the 2D layers. The three top layers are depicted as stacked with an offset along the same direction, while the bottom layer is stacked with an offset in the opposite direction, and represents a stacking fault. Scale bar, 10 nm. (c) Low- (left) and high-magnification (right) HRTEM image of Cu3(HHTP)2 flake obtained after exfoliation of Cu3(HHTP)2 particles. Scale bars, 10 nm (left) and 2 nm (right).