| Literature DB >> 28157319 |
Yajie Yang1, Sima Umrao1, Shen Lai1, Sungjoo Lee1,2.
Abstract
We report a simple and scalable method to fabricate homogeneous transparent conductive thin films (Ti2CTx, one of the MXene) by dip coating of an Al2O3 substrate in a colloidal solution of large-area Ti2CTx thin flakes. Scanning electron microscopy and atomic force microscopy images exhibit the wafer-scale homogeneous Ti2CTx thin film (∼5 nm) covering the whole substrate. The sheet resistance is as low as 70 Ω/sq at 86% transmittance, which corresponds to the high figure of merit (FOM) of 40.7. Furthermore, the thickness of the film is tuned by a SF6+Ar plasma treatment, which etches Ti2CTx film layer by layer and removes the top oxidized layer without affecting the bottom layer of the Ti2CTx flake. The resistivity of plasma-treated Ti2CTx film is further decreased to 63 Ω/sq with an improved transmittance of 89% and FOM of 51.3, demonstrating the promise of Ti2CTx for future transparent conductive electrode application.Entities:
Year: 2017 PMID: 28157319 DOI: 10.1021/acs.jpclett.6b03064
Source DB: PubMed Journal: J Phys Chem Lett ISSN: 1948-7185 Impact factor: 6.475