| Literature DB >> 26860894 |
Silvio Fuchs1,2, Christian Rödel1,3, Alexander Blinne1, Ulf Zastrau1, Martin Wünsche1,2, Vinzenz Hilbert1, Leif Glaser4, Jens Viefhaus4, Eugene Frumker5, Paul Corkum5, Eckhart Förster1,2, Gerhard G Paulus1,2.
Abstract
Optical coherence tomography (OCT) is a non-invasive technique for cross-sectional imaging. It is particularly advantageous for applications where conventional microscopy is not able to image deeper layers of samples in a reasonable time, e.g. in fast moving, deeper lying structures. However, at infrared and optical wavelengths, which are commonly used, the axial resolution of OCT is limited to about 1 μm, even if the bandwidth of the light covers a wide spectral range. Here, we present extreme ultraviolet coherence tomography (XCT) and thus introduce a new technique for non-invasive cross-sectional imaging of nanometer structures. XCT exploits the nanometerscale coherence lengths corresponding to the spectral transmission windows of, e.g., silicon samples. The axial resolution of coherence tomography is thus improved from micrometers to a few nanometers. Tomographic imaging with an axial resolution better than 18 nm is demonstrated for layer-type nanostructures buried in a silicon substrate. Using wavelengths in the water transmission window, nanometer-scale layers of platinum are retrieved with a resolution better than 8 nm. XCT as a nondestructive method for sub-surface tomographic imaging holds promise for several applications in semiconductor metrology and imaging in the water window.Entities:
Year: 2016 PMID: 26860894 PMCID: PMC4748318 DOI: 10.1038/srep20658
Source DB: PubMed Journal: Sci Rep ISSN: 2045-2322 Impact factor: 4.379
Figure 1Three-dimensional XCT image of a silicon-based sample with different buried layers of gold.
The nano-structures are clearly resolved inside the silicon host material (see also Fig. 4). The depth structure was reconstructed by analyzing the spectral interferogram. Due to the short coherence length of the applied XUV radiation, the axial resolution is better than 18 nm. Lateral imaging was achieved by scanning the focused XUV beam over the sample with a lateral resolution of 200 μm. This can be improved by using spatially coherent XUV sources and XUV optics of highest quality.
Figure 2Implementations of XCT as a common-path frequency-domain OCT scheme.
The broadband XUV radiation is focused on the sample using an incidence angle of 15° in respect to the sample’s normal. In this setup, an aperture can be used for spatial filtering and enhancing the lateral resolution at the expense of radiation flux. The scattered radiation is recorded with an efficient spectrometer consisting of a focusing mirror, a transmission grating (1000 lines/mm) and a CCD (Back-illuminated XUV-CCD, pixel size 13.5 μm, 2048 × 512 pixels). When the wavelength of the incident XUV radiation is swept, the spectrometer can be replaced by a photo diode as a detector.
Figure 3XCT signals in silicon- and water transmission window.
(a) Recorded reflected spectral intensity in the silicon transmission window from 30–100 eV (40–12 nm) of the layer system (c). The blue dots correspond to the CCD-cameras pixels the red curve is the interpolation. The grey curve is the used spectral window for suppression of Fourier artifacts. (b) Reconstructed depth profile: The two gold layers appear clearly separated, thus the resolution is better than 18 nm. The first peak at 16.7 nm is a ghost peak and corresponds to the distance between the two real depths. (d) Recorded reflected spectral intensity in the water window 280–530 eV (4.4–2.3 nm) of the layer system (f). The blue dots correspond to the energy measurement discretization and the red curve is the interpolation. The grey curve is the used spectral window for suppression of Fourier artifacts. (e) Reconstructed depth profile: The front and backside of the platinum layer appear separated, thus the resolution is better than 8 nm. The first peak at 7.7 nm is a ghost peak and corresponds to the difference between the two real depths.
Figure 4Sketch and cross-sectional images of a volume containing gold structures in a silicon substrate.
The top left side of the picture shows a schematic sketch of the investigated volume of a nanostructured silicon sample. Due to the fact that XCT exploits the surface reflection as a reference, the sketch in the middle of the picture shows the volume how it is expected to be measured. The false color plots in the right and lower part of the picture show slices through the volume indicated by the red, green, and blue lines. The plots are retrieved by calculating the Fourier-transform of the measured XUV spectrum for the respective lateral position. Due to the short coherence length of the employed XUV radiation, the axial resolution is better than 18 nm. All buried layers appear clearly visible and separated from each other.