| Literature DB >> 22294894 |
M Waleed Shinwari1, David Zhitomirsky, Imran A Deen, P R Selvaganapathy, M Jamal Deen, D Landheer.
Abstract
Over the past two decades, there has been an increasing trend towards miniaturization of both biological and chemical sensors and their integration with miniaturized sample pre-processing and analysis systems. These miniaturized lab-on-chip devices have several functional advantages including low cost, their ability to analyze smaller samples, faster analysis time, suitability for automation, and increased reliability and repeatability. Electrical based sensing methods that transduce biological or chemical signals into the electrical domain are a dominant part of the lab-on-chip devices. A vital part of any electrochemical sensing system is the reference electrode, which is a probe that is capable of measuring the potential on the solution side of an electrochemical interface. Research on miniaturization of this crucial component and analysis of the parameters that affect its performance, stability and lifetime, is sparse. In this paper, we present the basic electrochemistry and thermodynamics of these reference electrodes and illustrate the uses of reference electrodes in electrochemical and biological measurements. Different electrochemical systems that are used as reference electrodes will be presented, and an overview of some contemporary advances in electrode miniaturization and their performance will be provided.Entities:
Keywords: biosensor; electrochemical; electrode; lab-on-chip; microfabrication; reference electrode
Mesh:
Year: 2010 PMID: 22294894 PMCID: PMC3264446 DOI: 10.3390/s100301679
Source DB: PubMed Journal: Sensors (Basel) ISSN: 1424-8220 Impact factor: 3.576
Figure 1.Outer-sphere reaction effect on the reaction potentials.
Figure 2.Symmetric I–V curves for electrodes of varying polarizability.
Figure 3.Three electrode setup with a standard hydrogen reference electrode.
Figure 4.Different methods of micro-deposition of electrode’s material.
Figure 5.Illustration of a flow-through channel.
Figure 6.Steps in microfabricating a fully solid-state reference electrode [48].
Figure 7.Different methods for synthesis of a solid-state membrane [48–58].
Figure 8.Bulk micromachined reference electrode channel and membrane [59,60].
Figure 9.Bulk micromachined reference electrode channel and membrane [64].
Figure 10.UV polymerization and chloride trapping in a salt bridge [69].
Figure 11.Blocking cross-contamination with self-assembled molecules [78].
Figure 12.A microchannel made using toner mask, with the reference Ag/AgCl introduced as a paste blocking drilled holes [79,80].
Summary of the performance of microfabricated reference electrodes in the literature.
| Ag/AgCl | 13mm × 1.5mm × 0.4mm | Photolithography, Sputtering, Electrochemical oxidation | None (quasi-RE) | 0.1 M KCl in 20mM NaOH/KH2PO4 buffer, pH 7 | 90mV vs. commercial Ag/AgCl | < 1mV in 24h, 1mV in 8h with saturated AgCl and KCl in solution | 1998 | [ |
| Ag/AgCl | 13mm × 1.5mm × 0.9mm | Photolithography, Electrochemical oxidation, Bulk micromachining | Saturated KCl, AgCl. Pin hole liquid junction | 0.1 M KCl in 20mM NaOH/KH2PO4 buffer, pH 7 | 7mV vs. commercial Ag/AgCl | <1mV in 3h. | 1998 | [ |
| Ag/AgCl | 13mm × 1.5mm × 0.9mm | Photolithography, Electrochemical oxidation, Screen printing | Saturated KCl, AgCl. Hydrophillic Polymer liquid junction | 0.1 M KCl in 50mM NaOH/KH2PO4 buffer, pH 7 | 8mV vs. commercial Ag/AgCl | <2mV in 100h. | 1999 | [ |
| Ag/AgCl | N/A (macroscopic Ag wire used) | Photo-polymerization for junction polymer | 1M KCl. pDADMAC plug junction | PBS at pH 7.4 with 0.15M NaCl | 19.3mV vs. commercial Ag/AgCl in 3M KCl | <12mV in 30h. | 2006 | [ |
| Ag/AgCl | N/A | Photolithography, Lift-off, Sputtering, Electrochemical oxidation | Saturated KCl in Agarose supporting gel. | 10mM KCl, pH range 4–10 | 0.45mV vs. commercial Ag/AgCl | <1.5mV in 42h. | 2002 | [ |
| Ag/AgCl | 2cm×0.1 mm | Electroless plating on glass, Electroplating | None (quasi-RE) | 3M KCl | 13.5mV vs. commercial Ag/AgCl | <30mV in 14 days | 2006 | [ |
| Ag/AgCl | 106 μm2 | Photolithography, Chemical oxidation | None (quasi-RE) | 1mM KCl | 32mV vs. commercial Ag/AgCl at 1mM KCl, with identical electrode variation of 10mV | <2mV in 5000s | 2006 | [ |
| Ag/AgCl | 1μm diameter capillary | Pre-made capillary and silver wire. Capillary action for salt bridge and filling solution | 3.3M KCl + AgCl | Distilled water | (−4–0) mV vs. commercial Ag/AgCl | <2 mV in 2400s | 2005 | [ |
| Ag/AgCl | 1.2mm2 | Photolithography, Lift-off, Plasma chlorination | None (quasi-RE) | PBS (0.1M Na2HPO4, 0.15M NaCl, 0.1 g/l NaN3 at pH 7.4) | 70mV vs. commercial Ag/AgCl electrode in 3M KCl | <13mV in 5h | 2003 | [ |
| Ag/AgCl | 10mm×20mm | Screen-printing thick film | None (quasi-RE) | Technical buffer with 0.05mM Cl− | ≈230mV vs. commercial Ag/AgCl | <70mV in 12h | 2001 | [ |
| Ag/AgCl | 2mm×1.8mm (exposed area only) | Sputtering, Ni layer added, Photolithography, Chemical chloridizing | None (quasi-RE) | 50mM Tris buffer (pH 7.4) with 3.5M KCl | 0mV vs. commercial Ag/AgCl | <1mV in 2h | 2004 | [ |
| Graphite/AgCl | N/A (macroscopic) | None (macroscopic PVC encasing used) | None (quasi-RE) | KCl 0.1M | 40.8mV vs. commercial AgCl in saturated KCl | <0.2mV in 1h | 2005 | [ |
| Hydrogen | 4mm×7mm | Evaporation, Lift-off, Galvanic platenization of Pt | None. One variant uses pHEMA membrane | KCl 1M | −850mV vs. fabricated pseudo-Ag/AgCl (after 120–1100 s of initialization drifts) | <1.5mV/h | 2000 | [ |
| Ag/AgI | 1mm diameter | Sputtering, Lift-off, PECVD, RIE, Electrodeposition | None (quasi-RE) | PBS, pH 7.0 | −94mV vs. SCE | <1mV in 20h | 2005 | [ |
| IrOx | 0.1mm×1mm | Photolithography, Sputtering, CVD, Electrodeposition | None (quasi-RE) | PBS | 195mV vs. Ag/AgCl | <20mV in 9 days, after initial 120 mV/day drift. 4mV std. dev. | 2003 | [ |
| IrOx | 1500μm2 | Sputtering, Anodic growth (Electrochemical deposition) | None (quasi-RE) | 0.1M PBS | 40mV vs. Ag/AgCl | <100mV in 15 days | 2005 | [ |
Figure 13.pH glass electrode in a test solution.
Figure 14.Simplified structure of an ISFET sensor.