Literature DB >> 203801

Silicone-rubber adhesives as encapsulants for microelectronic implants; effect of high electric fields and of tensile stress.

P E Donaldson, E Sayer.   

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Year:  1977        PMID： 203801     DOI： 10.1007/bf02457937

Source DB:  PubMed          Journal:  Med Biol Eng Comput        ISSN： 0140-0118            Impact factor:   2.602


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  2 in total

1.  A vacuum centrifuge for void-free potting of implantable hybrid microcircuits in silicone.

Authors:  P E Donaldson; E Sayer
Journal:  Med Biol Eng       Date:  1975-07

2.  The encapsulation of microelectronic devices for long-term surgical implantation.

Authors:  P E Donaldson
Journal:  IEEE Trans Biomed Eng       Date:  1976-07       Impact factor: 4.538
  2 in total
  4 in total

1.  Encapsulating microelectronic implants in one-part silicone rubbers.

Authors:  P E Donaldson
Journal:  Med Biol Eng Comput       Date:  1989-01       Impact factor: 2.602

2.  A technology for implantable hermetic packages. Part 2: An implementation.

Authors:  P E Donaldson; E Sayer
Journal:  Med Biol Eng Comput       Date:  1981-07       Impact factor: 2.602

3.  A technology for implantable hermetic packages. Part 2: Design and materials.

Authors:  P E Donaldson; E Sayer
Journal:  Med Biol Eng Comput       Date:  1981-07       Impact factor: 2.602

4.  An implantable RF solenoid for magnetic resonance microscopy and microspectroscopy.

Authors:  D S Rivera; M S Cohen; W G Clark; A C Chu; R L Nunnally; J Smith; D Mills; J W Judy
Journal:  IEEE Trans Biomed Eng       Date:  2011-12-06       Impact factor: 4.538
  4 in total

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