Literature DB >> 1195864

A vacuum centrifuge for void-free potting of implantable hybrid microcircuits in silicone.

P E Donaldson, E Sayer.   

Abstract

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Year:  1975        PMID： 1195864     DOI： 10.1007/bf02477144

Source DB:  PubMed          Journal:  Med Biol Eng        ISSN： 0025-696X


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  5 in total

1.  Silicone-rubber adhesives as encapsulants for microelectronic implants; effect of high electric fields and of tensile stress.

Authors:  P E Donaldson; E Sayer
Journal:  Med Biol Eng Comput       Date:  1977-11       Impact factor: 2.602

2.  Encapsulating microelectronic implants in one-part silicone rubbers.

Authors:  P E Donaldson
Journal:  Med Biol Eng Comput       Date:  1989-01       Impact factor: 2.602

3.  Low-technology sealing method for implantable hermetic packages.

Authors:  N D Donaldson
Journal:  Med Biol Eng Comput       Date:  1988-01       Impact factor: 2.602

4.  A technology for implantable hermetic packages. Part 2: An implementation.

Authors:  P E Donaldson; E Sayer
Journal:  Med Biol Eng Comput       Date:  1981-07       Impact factor: 2.602

5.  A technology for implantable hermetic packages. Part 2: Design and materials.

Authors:  P E Donaldson; E Sayer
Journal:  Med Biol Eng Comput       Date:  1981-07       Impact factor: 2.602
  5 in total

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