Literature DB >> 1278923

The encapsulation of microelectronic devices for long-term surgical implantation.

P E Donaldson.   

Abstract

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Year:  1976        PMID： 1278923     DOI： 10.1109/tbme.1976.324586

Source DB:  PubMed          Journal:  IEEE Trans Biomed Eng        ISSN： 0018-9294            Impact factor:   4.538


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  9 in total

1.  Silicone-rubber adhesives as encapsulants for microelectronic implants; effect of high electric fields and of tensile stress.

Authors:  P E Donaldson; E Sayer
Journal:  Med Biol Eng Comput       Date:  1977-11       Impact factor: 2.602

2.  Miniaturised device for long-term intravaginal electrical stimulation for the treatment of urinary incontinence.

Authors:  B L Ohlsson; B E Erlandson
Journal:  Med Biol Eng Comput       Date:  1988-09       Impact factor: 2.602

3.  Epoxy moulding system for the encapsulation of microelectronic devices suitable for implantation.

Authors:  D F Lovely; M B Olive; R N Scott
Journal:  Med Biol Eng Comput       Date:  1986-03       Impact factor: 2.602

4.  Low-technology sealing method for implantable hermetic packages.

Authors:  N D Donaldson
Journal:  Med Biol Eng Comput       Date:  1988-01       Impact factor: 2.602

5.  Voltage regulators for implants powered by coupled coils.

Authors:  N N Donaldson
Journal:  Med Biol Eng Comput       Date:  1983-11       Impact factor: 2.602

6.  Design and fabrication of an experimental cochlear prosthesis.

Authors:  G E Loeb; C L Byers; S J Rebscher; D E Casey; M M Fong; R A Schindler; R F Gray; M M Merzenich
Journal:  Med Biol Eng Comput       Date:  1983-05       Impact factor: 2.602

7.  A technology for implantable hermetic packages. Part 2: Design and materials.

Authors:  P E Donaldson; E Sayer
Journal:  Med Biol Eng Comput       Date:  1981-07       Impact factor: 2.602

8.  Mechanical Characterization and Analysis of Different-Type Polyimide Feedthroughs Based on Tensile Test and FEM Simulation for an Implantable Package.

Authors:  Seonho Seok; HyungDal Park; Yong-Jun Kim; Jinseok Kim
Journal:  Micromachines (Basel)       Date:  2022-08-11       Impact factor: 3.523

9.  Capacitive Feedthroughs for Medical Implants.

Authors:  Sven Grob; Peter A Tass; Christian Hauptmann
Journal:  Front Neurosci       Date:  2016-09-08       Impact factor: 4.677
  9 in total

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