Wear simulation of ultra-high molecular weight polyethylene hip implants by incorporating the effects of cross-shear and contact pressure.

The effect of multi-directional cross-shear (CS) motion and contact pressure on ultra-high molecular weight polyethylene (UHMWPE) wear was investigated in this study, based on an integrated experimental and computational approach. The wear factor as a function of CS was determined experimentally from a multi-directional pin-on-plate wear tester under a nominal contact pressure of 1 MPa. A computational wear model was developed which included the effects of CS as well as the load and sliding distance imposed on the hip joint employing a UHMWPE cup against a metallic femoral head under both gait and Leeds ProSim hip joint simulator conditions. The CS ratios were quantified over the articular surface of the UHMWPE cup and the CS-dependent wear factors derived from multi-directional pin-on-plate studies were applied in the computational wear model. Outputs from the computational wear model were validated independently against an experimental hip simulator study. Comparisons of linear and volumetric wear were made between the computational wear model and the hip simulator testing for a nominal conventional (0 MRad) UHMWPE cup of 28mm diameter and a highly cross-linked (10 MRad) UHMWPE cup. The difference between the computed and experimental volumetric wear was approximately 30 per cent for the 0 MRad UHMWPE, although the worn areas between the prediction and the measurement were similar. For the 10 MRad UHMWPE, the discrepancy was reduced to 16 per cent. In both cases, the computational model predicted a lower wear rate than the experimental simulator testing. The effect of using alternative wear factors under a different nominal contact pressure of 3MPa was also considered. The input wear factor to the computational model, derived from a constant loaded pin-on-plate test configuration, may underestimate the dynamic effect due to the variation in the load in the hip joint simulator.