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Literature DB >> 3713284

Epoxy moulding system for the encapsulation of microelectronic devices suitable for implantation.

Abstract

Substances：
Epoxy Resins

Year: 1986 PMID： 3713284 DOI： 10.1007/bf02443939

Source DB: PubMed Journal: Med Biol Eng Comput ISSN： 0140-0118 Impact factor: 2.602

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4 in total

Authors: P E Donaldson
Journal: IEEE Trans Biomed Eng Date: 1976-07 Impact factor: 4.538

Authors: W C Lin; W H Ko
Journal: Med Biol Eng Date: 1968-06

Authors: D F Lovely; B S Hudgins; R N Scott
Journal: Med Biol Eng Comput Date: 1985-01 Impact factor: 2.602

Authors: P E Donaldson; E Sayer
Journal: Med Biol Eng Comput Date: 1981-07 Impact factor: 2.602

4 in total