| Literature DB >> 36236080 |
Yao Wang1, Xiangfu Liu1, Jiulin Shen1, Jianqiao Zhao1, Guoli Tu1.
Abstract
A new series of colorless polyimides (CPIs) with outstanding thermal properties and mechanical properties were fabricated by the copolymerization of a novel dianhydride and 4,4'-(hexafluoroisopropylidene)diphthalic anhydride (6FDA) with 2,2'-bistrifluoromethyl benzidine (TFDB). The novel dianhydride, 10-oxo-9-phenyl-9-(trifluoromethyl)-9,10-dihydroanthracene-2,3,6,7-tetraacid dianhydride (3FPODA), possessed a rigid semi-alicyclic structure, -CF3 and phenyl side groups, and an active carbonyl group. Benefitting from the special structure of 3FPODA, the glass transition temperatures (Tg) of the new CPIs improved from 330 °C to 377 °C, the coefficient of thermal expansion (CTE) decreased from 46 ppm/K to 24 ppm/K, and the tensile strength (TS), tensile modulus (TM), and elongation at break (EB) increased from 84 MPa to 136 MPa, 3.2 GPa to 4.4 GPa, and 2.94% to 4.13% with the increasing amount of 3FPODA, respectively. Moreover, the active carbonyl group of the 3FPODA could enhance the CPI's adhesive properties. These results render the new dianhydride 3FPODA an ideal candidate monomer for the fabrication of high-performance CPIs.Entities:
Keywords: coefficient of thermal expansion; colorless polyimide; glass transition temperatures; new dianhydride
Year: 2022 PMID: 36236080 PMCID: PMC9571554 DOI: 10.3390/polym14194132
Source DB: PubMed Journal: Polymers (Basel) ISSN: 2073-4360 Impact factor: 4.967
Scheme 1The route of the preparation of 3FPODA, and the synthesis of copolymerized polyimid.
Figure 1The molecular simulation of monomer 3FPODA, 6FDA, and structural units 3FPODA/TFDB and 6FDA/TFDB.
Figure 2(a) The FT-IR spectrum of CPIs; (b) The WARD spectrum of CPIs.
Figure 3(a) The picture of the CPIs; (b) The UV–Visible spectrum of CPIs; (c) The average refractive index (400–1000 nm) of CPIs; (d) The refractive index (400–1000 nm) of CPIs.
The optical properties of the CPIs.
| PI Film Code | λ0
a | T400
b | T550
b | b* | YI | n c | ∆nth d | Retardationth
e |
|---|---|---|---|---|---|---|---|---|
| PI-0 | 345 | 80 | 91 | 1.07 | 2.04 | 1.540 | 0.0276 | 276 |
| PI-1 | 343 | 71 | 91 | 1.58 | 2.83 | 1.571 | 0.0347 | 347 |
| PI-2 | 358 | 52 | 90 | 2.13 | 3.75 | 1.577 | 0.0397 | 397 |
| PI-3 | 372 | 30 | 90 | 2.84 | 4.90 | 1.579 | 0.0458 | 458 |
| PI-4 | 371 | 31 | 90 | 3.37 | 5.78 | 1.586 | 0.0468 | 468 |
| PI-5 | 376 | 21 | 89 | 4.93 | 8.63 | 1.580 | 0.0496 | 496 |
a cutoff wavelength of UV–vis; b transmittance at 400 nm and 550 nm; c refractive indices at 550 nm; d out-of-plane birefringence at 550 nm; e retardation per 10 μm of PI films at 550 nm.
Figure 4(a) The TGA curves of CPIs; (b) The DMA curves of CPIs; (c) The TMA curves of CPIs; (d) The stress–strain curves of CPIs.
The thermal properties, mechanical properties, and surface properties of the CPIs.
| PI Film Code | Thermal Properties | Mechanical Properties | Surface Properties | ||||||
|---|---|---|---|---|---|---|---|---|---|
| Char a Yield (%) | CTE b | Contact Angle | |||||||
| PI-0 | 330 | 485 | 520 | 45 | 46 | 84 | 2.94 | 3.2 | 88.4 |
| PI-1 | 342 | 499 | 552 | 49 | 42 | 89 | 2.74 | 3.6 | 83.3 |
| PI-2 | 355 | 492 | 549 | 48 | 33 | 76 | 2.05 | 4.1 | 73.8 |
| PI-3 | 372 | 489 | 549 | 53 | 27 | 105 | 2.93 | 4.2 | 70.9 |
| PI-4 | 377 | 480 | 542 | 55 | 24 | 136 | 4.13 | 4.4 | 67 |
| PI-5 | 382 | 481 | 543 | 55 | 23 | 90 | 2.19 | 4.5 | 65.4 |
a Residual weight retention at 800 °C in N2; b Coefficient of thermal expansion at 50–200 °C; TS—tensile strength; EB—elongation at break; TM—tensile modulus.
Figure 5The contact angle of CPIs.