| Literature DB >> 30966580 |
Fu Li1, Jikang Liu2, Xiangfu Liu3, Yao Wang4, Xiang Gao5, Xianggao Meng6, Guoli Tu7.
Abstract
A novel rigid semi-alicyclic dianhydride 9,10-difluoro-9,10-bis(trifluoromethyl)-9,10-dihydroanthracene-2,3,6,7-tetracarboxylic acid dianhydride (8FDA) was reported, and its single crystal X-ray diffraction result revealed the existence of the polymorphic structure in this compound. The detail geometric configuration transition during the synthesized process was investigated, exhibiting a transition of from trans- to cis- when the hydroxyl groups were substituted by fluoride with diethylaminosulfur trifluoride (DAST). Compared with the dianhydride 4,4'-(Hexaflouroisopropylidene) diphthalic anhydride (6FDA) and 1S,2R,4S,5R-cyclohexanetetracarboxylic dianhydride (HPMDA), the resulting polyimide (PI) films based on 8FDA exhibited an obviously higher glass transition temperature (Tg, 401 °C) and a much lower coefficient of thermal expansion (CTE, 14 ppm K-1). This indicates that 8FDA is an ideal building block in high-performance soluble PIs with low CTE.Entities:
Keywords: coefficient of thermal expansion; dianhydride; polyimide; polymorphic; semi-alicyclic
Year: 2018 PMID: 30966580 PMCID: PMC6415444 DOI: 10.3390/polym10050546
Source DB: PubMed Journal: Polymers (Basel) ISSN: 2073-4360 Impact factor: 4.329
Scheme 1Synthetic route to 8FDA.
Scheme 2Synthesis of polyimides based on 8FDA, 6FDA, and HPMDA.
Figure 1(a) The preparation process of PI films and (b) WAXD patterns of polyimides films.
Figure 2The one-dimensional chain structures of two polymorphs of compound 6 (8FDA), (a) zigzag (6a), and (b) linear (6b) chains by C–H…O interactions shown as dashed lines.
The solubility, d-spacing value, and optical properties of PI films.
| Polymer Code | Dianhydride | Diamine | Solubility a | WAXD b | Surface Properties | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| THF | EA | Toluene | CH2Cl2 | m-Cresol | DMAc | NMP | DMF | 2θ (°) | Water Absorbtion | Contact Angle (°) d | RMS | ||||
| PI-1 | 8FDA | TFDB | +s | +s | - | +- | +s | +s | +s | +s | 14.01 | 6.31 | 0.85 | 95 | 1.79 |
| PI-2 | 8FDA | TFODA | +s | +s | - | + | + | + | + | + | 13.84 | 6.38 | 1.06 | 92 | 1.16 |
| PI-3 | 6FDA | TFDB | +- | +- | - | +- | + | +s | + | +s | 14.38 | 6.20 | 1.21 | 92 | 2.01 |
| PI-4 | 6FDA | TFODA | + | +- | - | +- | + | +s | + | +s | 14.28 | 6.26 | 1.64 | 90 | 2.23 |
| PI-5 | HPMDA | TFDB | - | - | - | - | + | +s | + | +s | 15.10 | 5.79 | 1.21 | 84 | 1.93 |
| PI-6 | HPMDA | TFODA | - | - | - | - | + | + | + | + | 15.28 | 5.86 | 1.33 | 82 | 1.91 |
a Qualitative solubility measured with 100 mg of the polymer in 2 mL of solvent. +, soluble at room temperature; +s, soluble after heating; +-, slightly soluble after heating; -, insoluble; b The most prominent WAXD peak in the amorpous glassy polymer spectra was adopted to calculate the d-spacing value according to Bragg’s equation: 2dsinθ = nλ (n = 1, λ = 1.54 Å); c Water absorption (%) = ((W − W0)/W0) × 100%, in which W is the weight of polymer sample after being immersed in water for 96 h at room temperature and W0 the weight of polymer sample after being dried in vacuum at 100 °C for 8 h. d Equilibrium contact angle was measured at ambient temperature using double distilled water as solvent for a time period of 120 s depending on the stability of the drop, and the data were the average value of 10 experiments.
Figure 3Images of representative 8FDA-, 6FDA-, and HPMDA-based polyimides films.
Figure 4(a) The UV–Vis spectra of CPI films; (b) the DMA curves of PI films; (c) the TGA curves of PI films; and (d) the TMA curves of PI films.
The thermal resistant, mechanical, optical, and surface properties of PI films.
| Polymer | Dianhydride | Dianmine | Thermal Properties | Mechanical Properties a | Optical Properties | |||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Char Yield (%) b | CTE (ppm K−1) c | λ0 e (nm) | ||||||||||
| PI-1 | 8FDA | TFDB | 401 | 518 | 557 | 64 | 14 | 113 | 7.0 | 1.2 | 46 | 358 |
| PI-2 | 8FDA | TFODA | 369 | 492 | 550 | 60 | 18 | 96 | 2.1 | 4.5 | 64 | 344 |
| PI-3 | 6FDA | TFDB | 315 | 488 | 521 | 53 | 49 | 84 | 3.3 | 2.6 | 43 | 370 |
| PI-4 | 6FDA | TFODA | 300 | 490 | 520 | 50 | 63 | 65 | 5.8 | 1.1 | 71 | 353 |
| PI-5 | HPMDA | TFDB | 292 | 473 | 501 | 56 | 44 | 71 | 4.0 | 1.8 | 79 | 304 |
| PI-6 | HPMDA | TFODA | 348 | 462 | 497 | 57 | 64 | 39 | 2.7 | 1.8 | 83 | 296 |
aTs, tensile strength; Eb, elongation at break; Tm, tensile modulus; b residual weight percentage at 800 °C in N2; c coefficient of thermal expansion along the X-Y direction, measured in the range of 50–200 °C at a heating rate of 5 K min−1; d transmittance at 400 nm; e UV-vis cutoff wavelength.
Figure 5(a) The strain-stress curves of PI films and (b) representative images of contact angles of the polyimide films.
Figure 6The AFM images of PI-x.