| Literature DB >> 35949710 |
Marti Bernaus1, Jordi Guillem-Marti2, Adrian Bermúdez-Castel3, Jose Antonio Calero4, Diego Torres4, Margarita Veloso5, Lluís Font-Vizcarra5.
Abstract
BACKGROUND: Orthopedic implant-related infection remains one of the most serious complications after orthopedic surgery. In recent years, there has been an increased scientific interest to improve prevention and treatment strategies. However, many of these strategies have focused on chemical measures. AIM: To analyze the effect of alternating current electrical fields on bacterial adherence to titanium surfaces.Entities:
Keywords: Bacterial adhesion; Electrical fields; Metal surfaces; Orthopedic infection; Titanium
Year: 2022 PMID: 35949710 PMCID: PMC9244958 DOI: 10.5312/wjo.v13.i6.578
Source DB: PubMed Journal: World J Orthop ISSN: 2218-5836
Figure 1Design of the 12-well culture plate. A: The connection to the generator, the amplifier, and both electrodes in one of the wells of the plate. The lower electrode acted as a cathode, and the upper electrode acted as an anode; B: Photograph of the function generator with four separate connections to allow four different trials to be performed simultaneously. There are three rows of wells on the culture plate allowing tests to be triplicated.
Figure 2Electrical field application without bacteria. A: Initial setup of the titanium disks; B: Microscope used to visualize titanium oxidation and bubble formation.
Figure 3Microbubble formation test and results. A: Microbubble formation at the cathode using a 7 V current; B: Bubble rate formation on the X-axis compared to voltage. Exponential formation of bubbles after 5V.
Figure 4Results for colony-forming units. A: Results for colony-forming units of Staphylococcus aureus for the studied conditions; B: Results for colony-forming units of Escherichia coli for the studied conditions. S. aureus: Staphylococcus aureus; E. coli: Escherichia coli.
Figure 5Bacteria inside the lumps formed by electrocoagulation of the medium.
Figure 6Anodizing of the titanium surfaces.