Laser-induced forward transfer (LIFT) printing has emerged as a valid digital printing technique capable of transferring and printing a wide range of electronic materials. In this paper, we present for the first time LIFT printing as a method to fabricate silver (Ag) nanoparticle (np) grids for the development of indium tin oxide (ITO)-free inverted PM6:Y6 nonfullerene acceptor organic photovoltaics (OPVs). Limitations of the direct use of LIFT-printed Ag np grids in inverted ITO-free OPVs are addressed through a Ag grid embedding process. The embedded laser-printed Ag grid lines have high electrical conductivity, while the Ag metal grid transparency is varied by altering the number of Ag grid lines within the inverted OPVs' ITO-free bottom electrode. Following the presented Ag-grid embedding (EMP) process, metal-grid design optimizations, and device engineering methods incorporating an EMB-nine-line Ag np grid/PH500/AI4083/ZnO bottom electrode, we have demonstrated inverted ITO-free OPVs incorporating laser-printed Ag grids with 11.0% power conversion efficiency.
Laser-induced forward transfer (LIFT) printing has emerged as a valid digital printing technique capable of transferring and printing a wide range of electronic materials. In this paper, we present for the first time LIFT printing as a method to fabricate silver (Ag) nanoparticle (np) grids for the development of indium tin oxide (ITO)-free inverted PM6:Y6 nonfullerene acceptor organic photovoltaics (OPVs). Limitations of the direct use of LIFT-printed Ag np grids in inverted ITO-free OPVs are addressed through a Ag grid embedding process. The embedded laser-printed Ag grid lines have high electrical conductivity, while the Ag metal grid transparency is varied by altering the number of Ag grid lines within the inverted OPVs' ITO-free bottom electrode. Following the presented Ag-grid embedding (EMP) process, metal-grid design optimizations, and device engineering methods incorporating an EMB-nine-line Ag np grid/PH500/AI4083/ZnO bottom electrode, we have demonstrated inverted ITO-free OPVs incorporating laser-printed Ag grids with 11.0% power conversion efficiency.
In
the past few years, organic photovoltaics (OPVs) have achieved
tremendous power conversion efficiency improvements mainly due to
the emergence of n-type organic semiconductor nonfullerene acceptors
(NFAs). In comparison to the traditional fullerene acceptors, the
NFAs have lower cost due to simpler synthetic methods, suitable band
gap that increases the active-layer absorption, and tunable energy
levels that favor the open-circuit voltage.[1,2] Organic
solar cells based on NFA have boosted the OPVs’ power conversion
efficiency from approximately 10 to over 17%,[3−6] while a significant improvement
in device stability has been also reported in the literature.[7−9] Possibilities of the new organic electronic material systems in
large-scale OPV manufacturing have also been recently investigated,
and successful upscaling modules have been fabricated.[10,11] Aiming toward commercialization, the widely used transparent indium
tin oxide (ITO) conductive electrode increases the overall cost, while
its brittleness makes it incompatible to flexible optoelectronics
and large-scale roll-to-roll manufacturing. Among the proposed solutions,
the inkjet-printed metal nanoparticle ink is the most used method
for the development of printed ITO-free electrodes for organic optoelectronic
applications. Highly efficient ITO-free OPVs,[12−14] perovskite
PVs,[15] and OLED[16,17] devices have been successfully fabricated using silver and copper
nanoparticle inks, while possibilities of up-scalability have also
been investigated.[18] Despite the successful
and promising results, inkjet printing requires specific ink formulation
properties (surface tension, viscosity, etc.) to avoid nozzle clogging
and control flow.[19] On the other hand,
the laser-induced forward transfer (LIFT) digital printing technique
provides more flexibility on the donor ink properties.[20] LIFT printing was introduced by Bohandy and
his co-workers,[21] and its working principle
usually employs a pulsed laser source that provides the energy to
a laser transparent substrate that can be coated with a solid, paste,
or liquid donor layer, which absorbs the laser energy and transfers
the material toward the acceptor substrate. In case of liquid donors,
the absorption of pulsed laser results in the formation of a high-pressure
bubble, which expands and creates a stable jet of the donor material.
Details of the LIFT technology can be found in review papers.[20,22] Laser printing has been successfully applied in organic electronics
and biosensors[23] and demonstrated to be
a vital digital printing technique capable of transferring and printing
a wide range of materials and systems such as metal nanowires,[24,25] metal nanoparticles,[26] conducting polymers,[27] and light-emitting polymer diode pixels.[28] Optimization studies of laser printing and laser
sintering of silver nanoparticle (Ag-np) inks on glass[29−34] and flexible substrates[35−37] were performed in terms of laser
parameters, sacrificial layer properties, and rheological properties
of the inks. LPKF provides LIFT integrated systems in the market[38] and shows the potentials of the digital laser
transfer printing technology for a range of applications. Main electronic
applications of laser-printed metal np patterns include conduction
paths in sensors[39] and metallization methods
in the flexible electronic industry.[40] The
LIFT technology has not been previously applied for the development
of ITO-free organic optoelectronic applications.Motivated by
the compatibility with various inks, scalability,
and high productivity rates, LIFT-printed and laser-sintered Ag np
grids are implemented for the first time as an alternative to the
ITO electrode in inverted OPV devices. The highly efficient binary
organic NFA-based semiconductor material system consisting of the
PBDB-T-2F (PM6) polymer donor and the BTP-4F (Y6) as the nonfullerene
acceptor is used as an active layer in the inverted OPV device structure.[41] The presented study is focused on the Ag np
grids as an ITO-free bottom electrode, with the aim to identify the
optimized processing conditions and device structure engineering to
achieve highly efficient LIFT-printed inverted ITO-free OPVs. Different
PEDOT:PSS formulations were investigated in this work relevant to
their potential to planarize the as-laser-printed (not-embedded) metal
grid height. We show that PEDOT:PSS HIL-E100 provided high-quality
thick buffer layers (∼700 nm), which however were not enough
to planarize effectively the ∼1300 nm metal-grid height on
glass substrates. As a result, limitations on the performance of not-embedded
Ag-grid based inverted OPVs on glass substrates were identified. Not-embedded
LIFT-printed Ag np grid ITO-free OPVs exhibited a very low shunt resistance
resulting to ITO-free OPVs with low reliability and limited maximum
power conversion efficiency (PCE) of 3.7%.We demonstrate that
the reverse nanoimprinting embedding method
is necessary for the planarization of the Ag np grids to achieve functional
ITO-free OPV devices. The effect of PEDOT:PSS in an embedded (EMB)
Ag grid/PEDOT:PSS/ZnO bottom electrode structure is investigated using
different PEDOT:PSS formulations. PH500 is identified as the optimum
PEDOT:PSS for the laser-printed embedded Ag-grids. The conductivity
of laser-printed metal grids is in the range of 40,000 S/cm, while
transparency of the metal grid was varied by varying the number of
∼70 μm width metal grid lines incorporated in the design
of the ITO-free bottom electrode. The experimental results show that
a nine-line metal grid design provides the optimum balance between
conductivity and transparency for the laser-printed Ag nanoparticle
current collecting bottom electrode grid. The ITO-free inverted OPVs
with the EMB-nine-line Ag np grid/PH500/ZnO bottom electrode exhibited
a maximum PCE of 8.9%, while the reference ITO-based devices provided
a PCE of 12.1%. Further device optimization is achieved by incorporating
a bilayer PEDOT:PSS configuration within the device structure, with
laser-printed ITO-free inverted OPVs incorporating the EMB-nine-line
Ag np grid/PH500/AI4083/ZnO bottom electrode demonstrating a maximum
PCE of 11.0%.
Results and Discussion
LIFT-Printed and Laser-Sintered Ag Np Grids
A schematic
illustration of the laser-printing and -sintering process
is presented in Figure a. A nanosecond (ns) pulsed laser at 532 nm and high repetition rate
(up to 500 kHz) create a laser beam that is guided through mirrors
and lenses toward a galvanometric set of two mirrors (galvo) with
configurable speed, thus enabling the two-dimensional scanning of
a quartz donor that is coated with a Ag np ink (Sicrys I70DB-H72_E32)
at the liquid phase developed by PV Nano Cell. The Ag np ink contains
70% Ag in diethylene glycol monobutyl ether (DGBE) and has a viscosity
of 630 cP (0.63 N·s/m2), surface tension of 28.2 dyn/cm
(2.82 × 10–6 N·m), and particle size in
the range of 30–150 nm. Utilizing a blade coater, the quartz
donor is coated with the aforementioned ink resulting in a 12–14
μm thickness film. The investigation for the determination of
the laser printing parameters and the ink’s viscosity influence
is thoroughly presented in ref (33). The same study was performed while taking into consideration
the new ink’s viscosity as well as the surface properties.
Therefore, the donor is irradiated with a laser fluence of 125 mJ/cm2 and beam size of 35 μm, resulting in a dimensionally
controlled printed droplet. Associating a galvo speed of 0.45 m/s
with a laser repetition rate of 10 kHz and keeping the distance between
donor and receiver at 50 μm, a drop on demand deposition was
achieved, succeeding in the formation of smooth lines with no bulging
effects and discontinuities. Subsequently, the same laser configuration
was employed for the selective laser sintering of the Ag np grid.
For the decision on the laser sintering parameters, an investigation
concerning the laser repetition rate, the laser beam size, and the
scanning speed was performed, as in ref (35). For this soda-lime glass substrate and ink,
the optimum laser sintering power was determined after a series of
tests correlating the laser power with the resulting resistivity as
presented in Figure a. The resistivity values display a significant drop with the increase
of the laser power, reaching a plateau after 700 mW. For higher laser
powers, the printed lines exhibited cracks and delamination effects
that resulted in an electrical performance drop. Thus, 850 mW laser
power was selected for the sintering of the Ag np printed lines to
minimize the undesired crack effects that are limited at the thinner
edges of the line as presented in scanning electron microscopy (SEM)
images in Figure b.
At the same time, this specific laser power value induced the necessary
nanoparticle’s necking (Figure d) compared to the nonsintered nanoparticles (Figure c), enabling the
printed lines to obtain a resistivity value of less than 30 μΩ·cm.
By employing a 60 kHz repetition rate combined with a 0.1 m/s galvo
scanning speed and a laser spot of 100 μm beam size, a spatial
overlap of 98% was realized. The resulted electrical properties of
laser-printed and -sintered Ag np grid on soda-lime glass were determined
using four points on the side-bar and the grid lines (grid layout Figure a). The measured
sheet resistance in the case of the side-bar was 0.08 Ω/sq,
which according to the measured thickness results in a resistivity
of 25 μΩ·cm and conductivity of ∼40,000 S/cm.
As expected, similar values were calculated on the grid lines, with
a sheet resistance of 0.21 Ω/sq, resistivity of 27 μΩ·cm,
and conductivity of ∼37,000 S/cm. The achieved electrical conductivity
values are much higher in comparison to our reference ITO electrode
with a sheet resistance of 5 Ω/sq, resistivity of 30 μΩ·cm,
and conductivity of ∼6600 S/cm.
Figure 1
(a) Schematic illustration
of the laser configuration and the laser-printing
and laser-sintering process. In the inset, two examples of laser-printed
and -sintered samples are presented. (b) Optical transmission spectra
of parallel lines assembling 6-, 9-, and 12-line grids. (c) Schematic
explanation of the reverse nanoimprinting process for the embedding
of Ag grids using Ormocomp and Ormoprime resins. (d) Cross-section
profiles of the as-laser-printed versus embedded laser-printed Ag
np grids.
Figure 2
Laser sintering of LIFT-printed Ag nps: (a)
resistivity to laser
power correlation, (b) SEM image of laser-sintered Ag np line, (c)
magnified SEM of nonsintered Ag nps, and (d) magnified SEM image of
850 mW laser-sintered Ag nps.
(a) Schematic illustration
of the laser configuration and the laser-printing
and laser-sintering process. In the inset, two examples of laser-printed
and -sintered samples are presented. (b) Optical transmission spectra
of parallel lines assembling 6-, 9-, and 12-line grids. (c) Schematic
explanation of the reverse nanoimprinting process for the embedding
of Ag grids using Ormocomp and Ormoprime resins. (d) Cross-section
profiles of the as-laser-printed versus embedded laser-printed Ag
np grids.Laser sintering of LIFT-printed Ag nps: (a)
resistivity to laser
power correlation, (b) SEM image of laser-sintered Ag np line, (c)
magnified SEM of nonsintered Ag nps, and (d) magnified SEM image of
850 mW laser-sintered Ag nps.To form the ITO-free bottom electrode, a parallel line pattern
connected to busbars was laser-printed on the soda-lime glass substrate
to prepare electrodes for four device pixels (9 mm2) as
presented in the inset photograph of Figure a. The specific grid pattern was chosen due
to its simplicity, fast printability, and high reproducibility, while
6-, 9-, and 12-line Ag np grids were printed to include a range of
15–30% grid coverage area. The transparency evaluation of the
different printed electrodes is presented in Figure b. The average transmittance of different
grid patterns in the visible spectrum were calculated as ∼82%
for 6-line, ∼77% for 9-line, and ∼70% for 12-line grids.
Compared to the ITO average transmittance of ∼81%, 9-line and
12-line grids show lower transmittance due to increased shadowing
effects. However, by incorporating a higher number of LIFT-printed
Ag np lines, the resistance measured from side-bar to side-bar was
reduced from 2.7 to 2.0 to 1.5 Ω at the respective number of
the 6-, 9-, and 12-line grid. A detailed study on the influence of
optical and electrical properties of the laser-printed Ag np grid
on the OPV device performance is presented later. Geometrical characteristics
of the laser-printed Ag np lines were analyzed using cross-section
profilometry as presented in Figure c. When analyzing the geometrical characteristics of
the printed Ag np grids in Figure c, ∼70 μm line width and
∼1300 nm line height were recorded. Even though the relatively
narrow width favors the optical transmittance of the metal-grid based
electrode, the grid height presented limitations for direct use within
the OPV device structure. Organic optoelectronic devices consist of
very thin layers. Therefore, such high laser-printed Ag np line height
(∼1300 nm) based ITO-free bottom electrodes have a great possibility
to penetrate through the functional overcoated layers and contact
the top electrode, leading to short circuit devices. To avoid the
above-mentioned limitation, a thick PEDOT:PSS layer can be used to
overcoat and planarize the surface of the metal grids.[42] To examine that approach, ITO-free devices were
fabricated using the laser-printed Ag np grids overcoated with a ∼700
nm thick PEDOT:PSS HIL-E100 formulation. The specific formulation
is developed by Heraeus to be used on rough surfaces with the ability
to planarize and keep high transparency even at very thick films.
However, even in the case of the ∼700 nm thick PEDOT:PSS, the
device performance was very poor and reliability issues were observed
due to the penetration of the laser-printed Ag np grid through the
functional layers creating a short circuit with the top electrode.
The best performing ITO-free inverted OPVs using non-embedding as-laser-printed
Ag np grids/HIL-E100 (∼700 nm) provided a PCE of only 3.7%,
while the PCE of the respective reference ITO/HIL-E100 (∼700
nm) device was 10.6%, as presented in Figure S1a and Table S1 (Supporting Information).
The performance of the presented inverted OPV devices using the ∼700
nm thick HIL-E100 PEDOT:PSS is much lower compared to the 13.5% PCE
obtained for the ITO/ZnO/PM6:Y6/MoO3/Ag-based devices.
The reduced short-circuit current (Jsc) and fill factor (FF) in ITO-based solar cell devices are mainly
attributed to the thick HIL-E100 layer, while significantly lower
photovoltaic parameters of ITO-free devices strongly depend on the
lack of Ag np grid planarization that promoted high leakage currents
and device short circuits (Figure S1).
Our ongoing efforts aim to maintain similar values of Ag grid resistance
with reduced Ag-grid height to simplify processing steps for the development
of high-performance ITO-free inverted OPVs. To avoid grid penetration
and device failure in the presented work, Ag grid total planarization
was achieved using the highly effective reverse nanoimprinting method.[12,14,18,43] The planarization is performed using highly transparent resins,
a sacrificial glass substrate containing the as-printed and sintered
Ag np grid, and the final glass substrate where the embedded (EMB)
grid is transferred, as schematically described in Figure d. As presented in Figure c, Ag np grids were
successfully embedded and planarized, maintaining their electrical
and optical properties. Atomic force microscopy (AFM) investigation
of the surface topography before and after the embedding process is
shown in Figure S2 (Supporting information).
The root-mean-square (rms) roughness and peak-to-valley values of
the printed and sintered Ag np grid surface were reduced from 16.8
to 1.7 nm and from 140 to 24.1 nm, respectively, after the embedding
process (Figure S2 a,b), indicating the
effectiveness of electrode planarization by the presented embedding
process.
Effect of PEDOT:PSS Formulation on the Performance
of ITO-Free Inv-OPVs
For the development of ITO-free inverted
OPVs, LIFT-printed and embedded Ag np grids were implemented with
the approach of using a PEDOT:PSS/ZnO electron selective contact for
the bottom electrode of the OPV device structure, as was previously
reported.[42] As also indicated in more details
above, for the completion of inverted OPV devices, PM6 as a polymer
donor and Y6 as a nonfullerene molecular acceptor were used within
the active layer, with thermally evaporated MoO3 as the
hole transporting layer and Ag as the top contact. Three different
PEDOT:PSS (PH, HIL-E100, and PH500) formulations were selected based
on their intrinsic electrical conductivity and employed in the following
bottom electrode configuration EMB-nine-line Ag np grid/PEDOT:PSS/ZnO
with the aim to investigate the functionality of the laser-printed
Ag np grid ITO-free electrode within the reported inverted OPV device
structure. The photocurrent (PCT) mapping characterization presented
in Figure shows the
generated photocurrent images after a constant wavelength laser beam
is absorbed by the OPV device and current is extracted by the apparatus.
PCT images of ITO-free OPV devices with different PEDOT:PSS formulations
are presented and compared to our ITO-based global reference device
with the following configuration: ITO/ZnO/PM6:Y6/MoO3/Ag.
Parallel line grids with nine lines and 21% grid surface coverage
area calculated from the geometrical characteristics of the lines
were selected to be used as the constant grid pattern in the study
of the PEDOT:PSS formulation effect. Among the ITO-free devices, a
homogeneous photocurrent distribution and the highest absolute photocurrent
were detected in the case of the PH500 formulation, with a value of
482 μΑ that was very close to the reference ITO-based
device with 536 μΑ. Significantly lower absolute photocurrent
values were recorded in the case of HIL-E100 (360 μΑ)
and PH (111 μΑ). The reduced PCT can be directly correlated
to the intrinsic electrical conductivity of each PEDOT:PSS formulation.
The electrical conductivity of the corresponding PEDOT:PSS formulation
was evaluated through four-point probe measurements, and the values
for each formulation were ∼0.10 S cm–1 for
PH, ∼60 S cm–1 HIL-E100, and ∼500
S cm–1 for PH500. Illuminated J–V characteristics and photovoltaic parameters
of the fabricated devices with different PEDOT:PSS formulations were
also investigated as presented in Figure S3 and Table S2 (Supporting Information).
All the devices presented the same open-circuit voltage (Voc) of 0.76 V; however, significant differences were presented
in Jsc and FF. The EMB-Ag
np grid/PH device showed the lowest Jsc (7.5 mA/cm2) due to its lowest intrinsic electrical conductivity,
which significantly increased the series resistance of the device
and therefore reduced FF (34.3%), resulting in a PCE of 1.9%. On the
other hand, although HIL-E100 demonstrated a relatively high Jsc (16.8 mA/cm2), the high series
resistance of the HIL-E100 based devices induces a low FF of 37.1%
as can be seen in the J–V characteristics presented within Figure S3, providing therefore a PCE of 4.7%. Eventually, the best performance
was provided by the PEDOT:PSS (PH500) formulation. By incorporation
of PH500 on top of the LIFT-printed Ag np grid, the highest Jsc of 22.5 mA/cm2 and the lowest
series resistance among the investigated formulations were achieved,
resulting in increased FF of 52.5% and PCE of 8.9%. The presence of
a suitable PEDOT:PSS buffer layer on top of the embedded Ag np grid
is therefore an improving strategy for the development of high-performance
ITO-free inverted OPVs using LIFT nanoparticle-based metal grids.
Figure 3
Photocurrent
mapping images of 9 mm2 inverted OPV devices:
(a) ITO-based reference device and ITO-free devices using the EMB
nine-line Ag np grid with different PEDOT:PSS formulations, (b) PH,
(c) PH500, and (d) HIL-E100. The reference device in that case was
ITO/ZnO/PM6:Y6/MoO3/Ag.
Photocurrent
mapping images of 9 mm2 inverted OPV devices:
(a) ITO-based reference device and ITO-free devices using the EMB
nine-line Ag np grid with different PEDOT:PSS formulations, (b) PH,
(c) PH500, and (d) HIL-E100. The reference device in that case was
ITO/ZnO/PM6:Y6/MoO3/Ag.
Effect of Ag Np Grid Surface Coverage Area
on the Performance of ITO-Free Inv-OPVs
To define the ideal
balance between optical transparency and electrical conductivity of
laser-printed and embedded Ag np grids, it is necessary to determine
the ideal grid coverage area. Metal grid coverage areas have been
previously defined to be in the range of ∼17% for normal structure
OPVs[14] and ∼23% for OLEDs.[18] In general, the optimum metal grid coverage
area strongly depends on the requirements of the optoelectronic device
and the metal grid properties such as deposition technique, material,
design pattern, and geometrical characteristics. Since LIFT-printed
Ag np grids are for the first time incorporated in ITO-free inverted
OPVs, the optimum balance between the grid electrical conductivity
and transparency was necessarily investigated using 6-, 9-, and 12-line
grids, with corresponding surface coverage areas of ∼14, ∼21,
and ∼28%. The different grids were laser-printed, embedded,
and incorporated in the bottom ITO-free electrode structure EMB-Ag
np grid/PH500/ZnO. The corresponding J–V characteristics of the devices are shown in Figure , while the photovoltaic parameters
of the best devices are presented in Table . Significant differences were presented
in the J–V characteristics
especially in FF of the ITO-free devices compared to the ITO-based
reference device that in this case was ITO/PH500/ZnO/PM6:Y6/MoO3/Ag. Dark J–V characteristics
(Figure b) revealed
the highest leakage current in both reverse and forward bias regimes
for the 12-line embedded Ag np grid followed by the 9-line grid, the
6-line grid, and finally the reference ITO/PH500/ZnO bottom electrode
device. A similar trend was also presented in the shunt resistance
(Rsh) calculated from the dark J–V plot as the inverse slope around J (0 mW/cm2, 0 V). The 12-line grid exhibited
the lowest Rsh followed by the 9-line
grid, 6-line grid, and ITO-based reference device as presented in Table .
Figure 4
Inverted OPVs with different
bottom electrodes, ITO reference,
and ITO-free embedded Ag np grids with different numbers of grid lines.
(a) Illuminated J–V characteristics
and (b) dark J–V characteristics.
Table 1
Photovoltaic Parameters of the Best
Inverted OPV Devices with Laser-Printed and Embedded Ag Np Grids/PEDOT:PSS
(PH500) and Different Numbers of Grid Linesa
bottom electrode
Voc [V]
Jsc [mA/cm2]
FF [%]
PCE [%]
Rs [Ω·cm2]
Rsh [Ω·cm2]
ITO/PH500/ZnO..(ref. device)
0.76
26.8
59.6
11.7 ± 0.3 (12.1)
1.72
217.5
EMB-6/PH500/ZnO..
0.76
23.3
41.4
5.8 ±
0.8 (7.3)
4.76
163.0
EMB-9/PH500/ZnO..
0.76
22.5
52.5
8.4 ± 0.5 (8.9)
2.02
121.5
EMB-12/PH500/ZnO..
0.70
19.6
31.5
3.9 ± 0.5 (4.6)
1.93
45.0
Average PCE values obtained from
several experimental device runs are presented together with standard
deviations and maximum values in brackets.
Inverted OPVs with different
bottom electrodes, ITO reference,
and ITO-free embedded Ag np grids with different numbers of grid lines.
(a) Illuminated J–V characteristics
and (b) dark J–V characteristics.Average PCE values obtained from
several experimental device runs are presented together with standard
deviations and maximum values in brackets.Leakage current is commonly affected by several factors,
such as
substrate cleaning, electrode interlayers, film thickness, and film
deposition techniques. In this work, such a large variation in the
leakage current is attributed mainly to the intrinsic properties of
the PEDOT:PSS PH500 and the morphology of the functional layers on
top of embedded Ag np grids. A significantly higher leakage current
was also recorded in the ITO-based device with the ITO/PH500/ZnO electrode
in comparison to the ITO/ZnO without the PH500 interlayer. The high
electrical conductivity of the PH500 formulation is attributed to
the lower PSS to PEDOT ratio that however affects negatively its charge
carrier blocking properties, creating intrinsic leakage currents.[44] Thereby, the presence of PH500 itself significantly
increases the leakage current of the device. It has been shown that
leakage or shunt current can lead to significant decreases in both
the Voc and FF of organic solar cells.[45] The additional impact on leakage characteristics
can be attributed to the morphology of the functional layers and interfaces.
The embedded and flattened Ag np grid lines rise to ∼40 nm
after PEDOT:PSS PH500 coating and annealing, as presented in Figure S4b. The increase of Ag np grid line height
can be attributed to the thermal expansion and contraction due to
the first thermal annealing step of PEDOT:PSS PH500. Therefore, the
increased number of printed Ag np grid lines increases the possibility
of morphology abnormalities and leakage currents that negatively affect
the device’s FF values, as presented in Figure b and Table . Affected by the highest leakage current and lowest
optical transmittance, the 12-line Ag np grid exhibited the lowest
photovoltaic efficiency parameters among the investigated metal-grid
designs, resulting to a maximum PCE of 4.6%. The photocurrent mapping
analysis shown in Figure S5 (Supporting
Information) presents the homogeneous current distribution of the
well-defined solar cell active region for the inverted ITO-free OPVs
using PEDOT:PSS PH500/ZnO as the electron selective contact and Ag
np grid with different numbers of parallel lines. The highest absolute
photocurrent was recorded for the 6-line grid with 506 μA followed
by the 9-line (482 μA) and 12-line (440 μΑ) grids,
presenting a similar trend with the Jsc values as shown in Table . The higher generated photocurrent for the six-line grid
is attributed to its highest optical transmittance due to the reduced
shadow losses, as presented in Figure b. Since PCT analysis is also affected by the functional
layer morphology and interfaces, differences in PCT images between
6-, 9-, and 12-line grids may be presented according to embedded line
″rise″ that was discussed earlier. The six-line metal
grid provided higher Rsh of 163 Ω·cm2 and Jsc of 23.3 mA/cm2 in comparison to the nine-line grid with 121.5 Ω·cm2 and 22.5 mA/cm2, respectively. The maximum PCE
of 7.3% for the six-line grid is significantly lower than 8.9% for
the nine-line grid device. The reason is the much lower FF of the
six-line grid (41.4%) in comparison to 52.5% for the nine-line grid.
The lower FF of the six-line grid is mainly due to the higher series
resistance (Rs), which is almost doubled
(4.76 Ω·cm2) compared to the nine-line grid
devices (2.02 Ω·cm2). Thus, it is inferred that
by applying the six-line grid, the required conductivity could not
be achieved for a well-functioning Ag np grid electrode. On the contrary,
the 12-line metal grid showed the lowest Rs (1.93 Ω·cm2) due to the highest number of
conductive paths. Thus, the impact of both high leakage current and
excessive shadowing losses resulted in the lowest PCE. Therefore,
it is concluded that the nine-line Ag np grid design with a ∼21%
coverage area provides the optimum trade-off between transparency
and conductivity for implementation of the bottom electrode in inverted
ITO-free OPVs using LIFT Ag np embedded grids.
Table 2
Photovoltaic Parameters of the Optimized
Inverted OPV Devices with Laser-Printed and Embedded Ag Np grids Using
Bilayer PEDOT:PSS (PH500/AI4083) Layersa
bottom electrode
Voc [V]
Jsc [mA/cm2]
FF [%]
PCE [%]
Rsh [Ω·cm2]
ITO/PH500/ZnO..
0.76
26.8
59.6
11.7 ± 0.3 (12.1)
217
ITO/PH500/AI4083/ZnO..
0.78
24.5
66.7
12.8 ± 0.5 (13.5)
232
EMB-9/PH500/ZnO..
0.76
22.5
52.5
8.4 ±
0.5 (8.9)
121
EMB-9/PH500/AI4083/ZnO..
0.78
21.2
60.5
10.4
± 0.4 (11.0)
294
Average
PCE values obtained from
several experimental device runs are presented together with standard
deviations and maximum values in brackets.
Average
PCE values obtained from
several experimental device runs are presented together with standard
deviations and maximum values in brackets.
PEDOT:PSS (PH500/AI4083) Bilayer to Further
Improve the ITO-Free Inv-OPVs
As a final device engineering
method, the ITO-free inverted OPV device with the nine-line embedded
Ag np grid and PH500/ZnO electron selective contact was further optimized
by introducing an additional 25 nm thin layer of low conductive PEDOT:PSS
(AI4083) on top of the PH500. The combination of two PEDOT:PSS formulations
in a bilayer configuration (PH500/AI4083) is proposed as a method
to improve the nine-line embedded Ag np grid/PH500/AI4083/ZnO bottom
electrode’s electron selectivity and promote the further reduction
of ITO-free OPV device leakage currents. For better understanding,
the same bilayer PEDOT:PSS (PH500/AI4083) concept is applied on the
reference ITO-based inverted OPV bottom electrode (ITO/PH500/AI4083/ZnO).
Compared to PH500/ZnO, the incorporation of the PH500/AI4083/ZnO electron
selective bottom contact within the inverted OPV bottom electrode
in both ITO-based and ITO-free inverted OPVs only slightly affected
the overall transmittance and device series resistance, therefore
resulting in a small reduction of Jsc values
as presented in Figure a and Table . Despite
the slightly reduced Jsc, a significant
improvement was achieved in FF. The FF values increased from 59.6
to 66.7% in ITO-based inverted OPVs and from 52.6 to 60.5% in ITO-free
inverted OPVs under investigation. Dark J–V characteristics presented in Figure b show the significant reduction in leakage
current for the nine-line EMB Ag nps/PH500/AI4083/ZnO bottom electrode-based
device in comparison to the nine-line EMB Ag nps/PH500/ZnO bottom
electrode device. The reduced leakage current is ascribed to the higher
shunt resistance values extracted from dark J–V’s, as shown in Table . Specifically, the shunt resistance in inverted
ITO-free OPV devices increased from 121 Ω·cm2 for the nine-line EMB Ag nps/PH500/ZnO bottom electrode to 294 Ω·cm2 for the nine-line EMB Ag nps/PH500/AI4083/ZnO bottom electrode.
Surface topography studies indicate that the rms-roughness was reduced
from 20.3 nm in the case of Ag np grid/PH500 to 12.2 nm when AI4083
was deposited on top of PH500 (Ag nps/PH500/AI4083). The incorporation
of AI4083 provides a smoother surface for the overcoated ZnO layer
within the ITO-free inverted OPV bottom electrode (embedded Ag np
grid/PH500/AI4083/ZnO), providing more intimate interfaces and thus
reducing the device leakage currents. As a result, AI4083 provided
a further increase in the performance of ITO-free OPVs with an average
PCE of 10.4% (max PCE of 11.0%) and ITO-based OPVs with average an
PCE of 12.8% (max PCE of 13.5%).
Figure 5
Inverted OPVs with different bottom electrodes,
ITO reference,
and ITO-free embedded nine-line Ag np grids using PEDOT:PSS (PH500)
and a bilayer (PH500/AI4083). (a) Illuminated J–V characteristics and (b) dark J–V characteristics.
Inverted OPVs with different bottom electrodes,
ITO reference,
and ITO-free embedded nine-line Ag np grids using PEDOT:PSS (PH500)
and a bilayer (PH500/AI4083). (a) Illuminated J–V characteristics and (b) dark J–V characteristics.
Conclusions
LIFT-printing and laser-sintering
techniques were employed to develop
Ag metal nanoparticle grids as an alternative to the bottom ITO electrode
in inverted structure nonfullerene acceptor PM6:Y6 based OPVs. The
developed Ag np grid lines exhibited a height of ∼1300 nm and
width of ∼70 μm, while their electrical conductivity
on glass substrates was in the range of 37–40 kS/cm. To avoid
short-circuit solar cell device effects, the reverse nanoimprinting
method was applied to embed and planarize the LIFT-printed Ag np metal
grids. The incorporation of PH500 PEDOT:PSS within the LIFT-printed
embedded Ag np grid/PH500/ZnO bottom electrode provided the best performing
PEDOT:PSS formulation for the development of high-performance ITO-free
inverted OPVs. To define the optimum laser-printed Ag grid surface
coverage area for inverted ITO-free OPVs, different numbers of embedded
LIFT-printed Ag nps-parallel lines (6, 9, and 12) were investigated.
The nine-line LIFT-printed Ag np grid provided the optimum balance
between laser-printed Ag grid transparency and conductivity. The corresponding
inverted ITO-free OPV devices provided a maximum PCE of 8.9% due to
limited FF values originated from high leakage currents. We show
that the incorporation of low conductive AI4083 PEDOT:PSS within the
laser-printed Ag nanoparticle-based metal-grid inverted ITO-free OPV
bottom electrode (embedded Ag np grid/PH500/AI4083/ZnO) reduces leakage
currents and improves charge carrier selectivity for the inverted
ITO-free OPVs incorporating LIFT-printed Ag np grids. The optimized
ITO-free inverted OPVs incorporating nine-line laser-printed Ag nanoparticle
embedded metal grids (Ag grid/PH500/AI4083/ZnO/PM6:Y6/MoO3/Ag) demonstrated
up to 11% PCE.
Experimental
Methods
Materials
Pre-patterned indium tin
oxide (ITO) (sheet resistance 4 Ω/sq) on a 1.5 × 1.5 cm
soda-lime glass substrate was purchased from Psiotec Ltd. Clevios
(P VP AI4083), (PH), (PH500) and (HIL-E100) PEDOT:PSS (3,4-ethylenedioxylthiophene):poly(styrene
sulfonate) formulations were purchased from Heraeus. Zinc oxide (ZnO,
2.5 wt %) in a mixture of butanols (N-10-Flex) was provided by Avantama.
The PM6 polymer donor and the BTP-4F (Y6) nonfullerene acceptor were
purchased from Solarmer Energy, Inc. For the embedding and flattening
of laser-printed Ag np grids, the reverse nanoimprinting transfer
procedure was applied[12] using Ormocomp
and Ormoprime resins purchased from Micro Resist Technology. All the
other chemicals were purchased from Sigma-Aldrich.
Device Fabrication
Reference ITO-based
inverted OPV devices were fabricated according to the following device
structure: ITO/ZnO/PM6:Y6/MoO/Ag. ITO
substrates were subsequently cleaned in acetone and isopropanol under
sonication for 10 min and then dried and exposed to UV-ozone treatment
for 5 min. The ZnO (∼20 nm) film was spin-coated at 4000 rpm
(Delta 6RC-Suss MicroTec, Garching, Germany) and was thermally annealed
at 120 °C for 20 min under ambient atmosphere. The polymer PM6:Y6
(D/A = 1:1.2, 16 mg mL–1 in total) was dissolved
in chloroform (CF) with the solvent additive of 1-chloronaphthalene
(CN) (0.5%, v/v) and spin-coated on ZnO at 3000 rpm to achieve a ∼130
nm thickness and then transferred into a nitrogen-filled glovebox
for thermal annealing at 110 °C for 10 min. To complete the device
stack, 10 nm (0.2 Å/s) of a molybdenum oxide (MoO) anode interlayer and 80 nm (2 Å/s) silver
(Ag) were thermally evaporated in a vacuum chamber (Angstrom Engineering,
Kitchener, Canada) at a base pressure of ∼1 × 10–6 mbar through a shadow mask, resulting in a device active area of
9 mm2. In the case of ITO-free devices, Ag np grids were
embedded and then cleaned with isopropanol. All PEDOT:PSS formulations
were filtered through a 0.22 μm polyvinylidene difluoride (PVDF)
filter prior to processing. Ethylene glycol (5% v/v) was added to
PH500 formulation. PEDOT:PSS formulations were spin-coated to maintain
the same layer thickness of ∼40 nm on both ITO and ITO-free
electrodes. In case of the bilayer PH500/AI4083, AI4083 was spin-coated
at 5000 rpm to give a thickness of ∼25 nm. PEDOT:PSS films
were thermally annealed at 140 °C for 20 min under ambient atmosphere.
The 2.5 wt % zinc oxide (ZnO) nanoparticle (size ∼10 nm) in
the mixture of butanols was purchased from Avantama (N-10-Flex). The
ZnO electron transporting layer (∼20 nm) was dynamically spin-coated
at 5000 rpm (Delta 6RC-Suss MicroTec, Garching, Germany) and was thermally
annealed at 120 °C for 20 min under ambient atmosphere. The rest
of the layers was deposited as has been described before, and the
final ITO-free OPV device stack was Ag np grid/PEDOT:PSS/ZnO/PM6:Y6/MoO/Ag.
Characterization
For the film characterization,
a Shimadzu UV-2700 UV–vis spectrophotometer was used to measure
the optical transmittance of the different surface coverage area grids,
while a Veeco Dektak 150 profilometer was used to define the metal
grid profile and the thickness values of every functional layer of
the OPV device. A four-point probe (Jandel RM3000) conductivity meter
was employed for sheet resistance measurements. The characterization
of complete devices was performed under ambient atmosphere without
device encapsulation, while a 9 mm2 mask was used to ensure
the exact active area of the device. The current–voltage characteristics
were measured with a Keithley source measurement unit (SMU 2420) and
a calibrated Newport solar simulator equipped with a Xe lamp (AM1.5G
spectrum at 100 mW cm–2 as measured by an Oriel
91150V calibration cell equipped with a KG5 filter). Photocurrent
mapping measurements were performed under 405 nm laser excitation
wavelength, 50% laser intensity, and 40 μm laser spot size using
a Botest PCT photocurrent system.[46]
Authors: James Shaw-Stewart; Thomas Lippert; Matthias Nagel; Frank Nüesch; Alexander Wokaun Journal: ACS Appl Mater Interfaces Date: 2011-01-24 Impact factor: 9.229
Authors: Yaowen Li; Lei Meng; Yang Michael Yang; Guiying Xu; Ziruo Hong; Qi Chen; Jingbi You; Gang Li; Yang Yang; Yongfang Li Journal: Nat Commun Date: 2016-01-11 Impact factor: 14.919