| Literature DB >> 35519322 |
Qiaoyun Qi1, Yanru Li1, Wu Qiu1, Wenhai Zhang1, Chenyang Shi1, Chen Hou1, Wen Yan1, Jiani Huang1, Likun Yang1, Hao Wang1, Wenxi Guo1, Xiang Yang Liu2,1, Naibo Lin1.
Abstract
Transient devices have attracted extensive interest because they allow changes in physical form and device function under the control of external stimuli or related commands and have very broad application prospects for information security, biomedical care and the environment. Transient bioelectrical devices were fabricated inspired by a silkworm moth breaking out of its cocoon, which has shown many advantages, including the use of mild stimulation, biocompatible materials, a simple process, and a universal strategy. For the fabrication of the transient devices, heat-sensitive microspheres with a 9.3 mol L-1 LiBr solution in wax shells were prepared by microfluidic technology, which were then assembled into silk fibroin (SF) electronic materials/devices, such as SF conductive film, an LED circuit on SF film, and a Ag/SF film/Pt/SF film memristor. The contribution from the LiBr/wax microspheres to the transient time of the SF films upon exposure to heat was quantitatively investigated. This approach was applied to transiently dissolve a flexible Ag-nanowire resistance circuit line on a SF substrate. Moreover, memristors constructed with a functional layer of SF were destroyed by melting the LiBr/wax microspheres. This technique paves the way for realizing transient bioelectrical devices inspired by biological behavior, which have been well optimized by nature via evolution. This journal is © The Royal Society of Chemistry.Entities:
Year: 2019 PMID: 35519322 PMCID: PMC9064003 DOI: 10.1039/c9ra02147g
Source DB: PubMed Journal: RSC Adv ISSN: 2046-2069 Impact factor: 3.361
Fig. 1Inspired by the natural phenomenon that a silk cocoon protecting silkworm pupa, and a juvenile silkworm moth secreting an enzyme to dissolve silk sericin and break a silk cocoon. Heat-triggerable transient electronics were assembled with wax microspheres containing LiBr solution. The LiBr solution can be released by melting the wax coating, leading to rapid electronic destruction.
Fig. 2Schematic illustration of the LiBr@Wax microspheres preparation process by glass capillary-based microfluidic devices.
Fig. 3(A) Optical microscopy imaging of the microspheres. (B) The size distribution of the LiBr@Wax microspheres.
Fig. 4(A) Images of SF films with different contents of LiBr/wax microspheres before heat triggering and after 7 min of heating. (B) Correlation between the microsphere contents in the SF film and transient time/the degree of destruction after 7 min of heating. (C) The dissolution process of a silk film with 70% LiBr@Wax microspheres at 60 °C. (D) Degradation of silk films with 70% LiBr@Wax microspheres at different temperatures after 5 min. (E) Effect of temperature on transient time and degree of destruction of silk films with 70% LiBr@Wax microspheres.
Fig. 5(A) Schematics of the structure and operational principle of a transient device with a Ag nanowire resistor on a silk film substrate. (i) The Ag resistor on a silk film substrate coated with 70% LiBr@Wax microspheres. (ii) Heat-triggered disintegration of the device at 70 °C. (iii) Disintegration of the silk film substrate. (iv) Further disintegration. (B) Image of heat-triggered degradation of the device at 70 °C. (ii) Thermal infrared imaging of the transient device. (C) The resistance transient change of the device trigger by heat at 70 °C.
Fig. 6(A) Multistage transition of LEDs achieved by selective microsphere coatings. The melting of LiBr/wax microspheres degrades the coated area at the desired temperature. (B) Illustration of transient dissolution of the silk-based memristor device. (i) The structure of the Ag/SF film/Pt memristor. (ii) Ag/SF film/Pt memristor on a flexible silk substrate with LiBr@Wax microspheres. (iii) Heat-triggered disintegration of the device at 70 °C. (iv) Further disintegration. (C) Typical current versus voltage (I/V) curves of the Ag/SF film/Pt memristor in voltage sweeping mode at ambient condition. (D) Images of the disintegration process of the Ag/SF film/Pt memristor.
Fig. 7The absorbance of each sample A–E.