| Literature DB >> 35480904 |
Intisar Salah1, Ivan P Parkin1, Elaine Allan2.
Abstract
From its uses in ancient civilisations, copper has an established history as an antimicrobial agent. Extensive research has determined the efficacy and mechanism of copper's antimicrobial activity against microorganisms. The process is multifaceted with the main mechanism of bactericidal activity being the generation of reactive oxygen species (ROS), which irreversibly damages membranes. Copper ions released from surfaces lead to RNA degradation and membrane disruption of enveloped viruses. For fungi, the mechanism involves the physical deterioration of the membrane and copper ion influx. Due to variations in the experimental parameters, it is difficult to compare studies directly. In this review article, we outline the importance of the experimental conditions currently employed and how they bear little resemblance to real-world conditions. We endorse previous recommendations calling for an update to industrial standard tests. This journal is © The Royal Society of Chemistry.Entities:
Year: 2021 PMID: 35480904 PMCID: PMC9033467 DOI: 10.1039/d1ra02149d
Source DB: PubMed Journal: RSC Adv ISSN: 2046-2069 Impact factor: 4.036
Fig. 1(a) Gram-positive bacteria possess a characteristic thick peptidoglycan layer. (b) Gram-negative bacteria exhibit an outer membrane and a thinner peptidoglycan layer.
Fig. 2The primary mechanism of death in different microorganisms by copper nanoparticles.
Antimicrobial activity of copper suspensions and copper-containing surfaces against microorganismsa
| Test organism & strain | Inoculum | Antimicrobial agent & UNS name | NP concentration & size | Inactivation time | Primary/significant MoA | Ref. |
|---|---|---|---|---|---|---|
|
| 1 × 107 CFU | Cu surface (C11000) | — | 10 min | ROS not |
|
|
| 1 × 107 CFU | Cu surface (C11000) | — | 10 min | ||
|
| <1.0 × 108 CFU | CuNP suspension | 20–100 μg mL−1, 12 nm | Not specified | Physical interaction |
|
|
| 1 × 108 CFU | CuNP suspension | 3.0 & 7.5 μg mL−1 62.5 nm | 1 h | ROS |
|
| MRSA-NCTC 10442 | 1 × 107 CFU | Cu surface (C19700) | — | 45 min | ROS not |
|
| EMRSA-1 NCTC 11939 | 1.9 × 107 CFU | Cu surface (C19700) | — | 60 min | ||
| EMRSA-16 NCTC 13143 | 1.5 × 107 CFU | Cu surface (C19700) | — | 90 min | ||
| EMRSA-16 NCTC 13143 | 1 × 107 CFU | Cu surface | — | 20 min |
| |
| MSSA-ATCC 49230 | 1 × 107 CFU | Cu surface | — | 15 min | ||
|
| 1 × 105 CFU | CuNP suspension | 200–3200 μg mL−1, 9 nm | 16 h | Physical interaction |
|
| SARS-CoV-2 – USA-WA1/2020 | 5 μm × 105.25 TCID50/mL | Cu surface | — | 4 h | RNA degradation |
|
| HuCoV-229E | 1 × 103 PFU | Cu surface (C11000) | — | 60 min |
| |
| Influenza A H1N1 | 2 × 106 PFU | Cu surface (C11000) | — | 6 h | Cu ions cause RNA degradation |
|
| Norovirus-murine norovirus | 5 × 104 PFU | Cu surface (C11000) | — | 30 min | Cu ions, particularly, Cu+, cause RNA degradation |
|
|
| 1 × 106 spores | CuNP suspension | 100 μg mL−1, 25.5 nm | 5 days | Physical interaction, copper ions |
|
|
| 12.5 × 106 CFU | Cu surface (C11000) | — | 60 min (mutants 5–10 min) |
| |
|
| 1–5 × 105 CFU | CuONP suspension | 25–200 mM, 35 nm | Not specified |
|
UNS: unified numbering system for metals and alloys; MoA: mechanism of action; ref: reference.
Antimicrobial activity of copper alloys against microorganismsa
| Test organism & strain | Inoculum | Antimicrobial surface & UNS name | % Copper | Extent of reduction | Inactivation time | Ref. |
|---|---|---|---|---|---|---|
| Murine norovirus-HuCoV-229E | 5 × 105 PFU | CuZn (C26000) | 70 | 4-log | 30 min |
|
| CuNi (C71500) | 70 | 1-log | 2 h | |||
|
| 1 × 107 CFU | CuZn (C23000 & C24700) | 86 | 100% | 15 min |
|
| 63 | 100% | 30 min | ||||
| MRSA-NCTC 10442 | 1 × 107 CFU | CuZn (C24000) | 80 | 4-log | 3 h |
|
| MSSA, VRE, | Not specified | CuZn | 60 & 70 | 90–100% | 10 weeks |
|
|
| 1 × 107 CFU | CuSi (C65500) | 97 | 100% | 65 min |
|
| CuAlNi (C61500) | 90 | 100% | 180 min | |||
| CuSn (C51000) | 95 | 100% | 105 min |
UNS: unified numbering system for metals and alloys; %copper: percentage of copper in alloy; ref.: references.