| Literature DB >> 35408303 |
Abdul Jabbar1, Qammer H Abbasi1, Nadeem Anjum2, Tahera Kalsoom3, Naeem Ramzan3, Shehzad Ahmed4, Piyya Muhammad Rafi-Ul-Shan5, Oluyemi Peter Falade6, Muhammad Ali Imran1, Masood Ur Rehman1.
Abstract
Industry 4.0 is a new paradigm of digitalization and automation that demands high data rates and real-time ultra-reliable agile communication. Industrial communication at sub-6 GHz industrial, scientific, and medical (ISM) bands has some serious impediments, such as interference, spectral congestion, and limited bandwidth. These limitations hinder the high throughput and reliability requirements of modern industrial applications and mission-critical scenarios. In this paper, we critically assess the potential of the 60 GHz millimeter-wave (mmWave) ISM band as an enabler for ultra-reliable low-latency communication (URLLC) in smart manufacturing, smart factories, and mission-critical operations in Industry 4.0 and beyond. A holistic overview of 60 GHz wireless standards and key performance indicators are discussed. Then the review of 60 GHz smart antenna systems facilitating agile communication for Industry 4.0 and beyond is presented. We envisage that the use of 60 GHz communication and smart antenna systems are crucial for modern industrial communication so that URLLC in Industry 4.0 and beyond could soar to its full potential.Entities:
Keywords: 5G; 60 GHz; Industry 4.0; millimeter-wave communication; smart antennas
Mesh:
Year: 2022 PMID: 35408303 PMCID: PMC9002810 DOI: 10.3390/s22072688
Source DB: PubMed Journal: Sensors (Basel) ISSN: 1424-8220 Impact factor: 3.576
Figure 1Avenues of 5G services in the viewpoint of Industry 4.0 and beyond.
Figure 2Key performance indicators for Industry 4.0 and beyond communication.
Comparison of the related contributions of selected literature at 60 GHz band.
| Ref. | Comments |
|---|---|
| [ | Discussion on the differences between Industry 4.0 and Industry 5.0, the co-existence of these two, and some enabling technologies. |
| [ | Review of IoT, big data, and cloud computing for Industry 4.0-based healthcare |
| [ | Discussion on cyber-physical systems for Industrial IoT in Industry 4.0. |
| [ | A survey of potential applications of Industry 5.0 such as intelligent healthcare, cloud manufacturing, supply chain management, and manufacturing production |
| [ | Discussed opportunities and challenges of 60 GHz mmWave communication for industrial environment. |
| [ | Highlighted the potential of 60 GHz communication for factory automation scenarios. |
| [ | Overview of IEEE 802.11ay standard, as well as new PHY and MAC specifications based on IEEE 802.11ad, MIMO enhanced channel access and beamforming training. |
| [ | Design concerns for the IEEE 802.11ad standard, as well as solutions for overcoming mmWave communication problems. |
| [ | Industrial perspective of using 60 GHz WiGig communication. |
| [ | Review of beamforming training, design issues, channel bonding and aggregation, channel access, and channel allocation in IEEE 802.11ay. |
| [ | A detailed survey of 60 GHz radio transceivers, antennas, low-noise amplifiers, power amplifiers, mixers, etc. |
| [ | Review of various mmWave antenna designs from 10 to 100 GHz. |
| [ | Discussion on 60 GHz radio, link budget, channel propagation, RF front end architecture, and antenna solutions. |
|
| Review of URLLC requirements in Industry 4.0 and beyond, overview of potential of 60 GHz mmWave band for industrial communication, analysis of wireless standards and protocols at 60 GHz band. Review of various 60 GHz mmWave antennas for Industry 4.0 and beyond and their design challenges. Inclusive discussion on the prospects and research opportunities of 60 GHz mmWave communication and PHY-based solutions for Industry 4.0 and beyond. |
Figure 3Organization of this review paper.
Figure 4Advantages of 60 GHz mmWave communication in Industry 4.0 and beyond.
Figure 5Worldwide allocation of 60 GHz mmWave spectrum.
The 60 GHz mmWave ISM band standards suitable for indoor industrial communication.
| IEEE Standard | Forum Type | Peak Data Rate (Gbps) | Bandwidth |
|---|---|---|---|
| IEEE 802.11ay | International standard | 100 | 8.64 |
| IEEE 802.11ad | Industry consortium | 8 | 2.16 |
| IEEE 802.15.3c | International standard | 5.7 | <3 |
| WirelessHD | Industry consortium | 4 | 2 |
| ECMA387 | International standard | 4.032 | 2.16 |
Categories of 60 GHz mmWave antennas with benefits and drawbacks.
| Antenna Type | Advantages | Disadvantages |
|---|---|---|
| Microstrip and PCB | Compact, low cost, easy fabrication, | High substrate loss, conductor and dielectric loss, feed radiation issues, impedance matching issues, bandwidth issues for thick substrates |
| On-chip integrated | Compact, low power, light weight, low profile | Low gain, low efficiency, high radiation losses, complex fabrication, and complex design rules |
| Leaky wave and surface wave antennas | Low fabrication cost, planar tunability, | Low efficiency usually due to traveling wave, scanning angle varies with frequency, complex design considerations |
Summary of various 60 GHz antenna designs available in the literature.
| Ref. | Antenna Technology | Antenna Type | Array Configuration | Peak Gain | Size |
|---|---|---|---|---|---|
| [ | PCB | Integrated horn | Single unit structure | 14.6 | - |
| [ | PCB | Monopole array | 1 × 2 | 11.6 | 20.64 × 20 |
| [ | PCB | SIW coplanar fed slot | Linear array | 12 | 30 × 5 |
| [ | PCB | T-slot planar | Single element | 8.77 | 11.7 × 9.8 |
| [ | PCB | CP substrate-integrated cavity | 4 × 4 | 20 | 30 × 30 |
| [ | PCB | Microstrip CP array | 2 × 2 | 16 | 20 × 20 |
| [ | PCB | Dielectric resonator | 2 × 2 | 11.43 | - |
| [ | PCB | SIW-based leaky wave | Linear array | 14.5 | 23 × 3 |
| [ | PCB | SIW fractal antenna | Single SIW | 4.57 | 4.1 × 8.6 |
| [ | PCB | SIW fractal antenna | Single SIW | 7.9 | 6.5 × 9.6 |
| [ | LTCC | CP SIW | 4 × 4 | 18.2 | 18.6 × 18.6 |
| [ | LTCC | Parasitic microstrip patches | 4 × 4 | 10.5 | 10.1 × 8.5 |
| [ | LTCC | Planar aperture | 16 × 16 | 24.6 | 37 × 37 |
| [ | LTCC | Patch with SIW feed | 4 × 4 | 16.7 | ≈20 × 20 |
| [ | LTCC | Patch | 4 × 4 | 17.1 | 13 × 13 |
| [ | LTCC | U-slot patch | 4 × 4 | 16 | 14 × 16 |
| [ | LTCC | Helical | 4 × 4 | 14 | 12 × 10 |
| [ | On-chip | Yagi | - | -8 | Chip size 1.1 × 0.95 |
| [ | On-chip | MEMS based | 9 × 9 | 23.3 | 24.75 × 24.75 |
| [ | On-chip | Folded slot silicon integrated | - | 3.9 | - |