| Literature DB >> 35350441 |
Abstract
Transforming lab research into a sustainable business is becoming a trend in the microfluidic field. However, there are various challenges during the translation process due to the gaps between academia and industry, especially from laboratory prototyping to industrial scale-up production, which is critical for potential commercialization. In this Perspective, based on our experience in collaboration with stakeholders, e.g., biologists, microfluidic engineers, diagnostic specialists, and manufacturers, we aim to share our understanding of the manufacturing process chain of microfluidic cartridge from concept development and laboratory prototyping to scale-up production, where the scale-up production of commercial microfluidic cartridges is highlighted. Four suggestions from the aspect of cartridge design for manufacturing, professional involvement, material selection, and standardization are provided in order to help scientists from the laboratory to bring their innovations into pre-clinical, clinical, and mass production and improve the manufacturability of laboratory prototypes toward commercialization.Entities:
Year: 2022 PMID: 35350441 PMCID: PMC8933055 DOI: 10.1063/5.0079045
Source DB: PubMed Journal: Biomicrofluidics ISSN: 1932-1058 Impact factor: 2.800
FIG. 1.Industrial supply chain of microfluidic devices.
FIG. 2.Development process of microfluidic devices in prototyping and scale-up production stages.
Comparison of materials used in microfluidic chips.
| Material | Silicon | Glass | Polymer | Paper | |||||
|---|---|---|---|---|---|---|---|---|---|
| PDMS | PS | PC | PMMA | COC/COP | |||||
| Property | Optical transparency | No | High | High | High | High | High | High | Low |
| Thermal conductivity [W/(m k)] | High | Low | Low | Low | Low | Low | Low | Low | |
| Glass transition temperature (°C) | NA | NA | ∼80[ | 92–100 | 145–148 | 100–122 | 70–155 | NA | |
| Solvent resistance | High | High | Low | Low | High | High | Excellent | High | |
| Gas permeability | Low | Low | High | Low | Low | Low | Low | High | |
| Hydrophobicity | hydrophilic | hydrophilic | hydrophobic | hydrophobic | hydrophobic | hydrophobic | hydrophobic | Amphophilic | |
| Fabrication methods | Wet etching, dry etching | Wet etching, reactive ion etching | Replica molding (mold mostly from soft lithography and CNC micromachining) | Injection molding, hot embossing | Hot embossing | Hot embossing, micromachining, laser ablation, injection molding | Injection molding | Photolithography, printing, cutting | |
| Design freedom | Low | Low | High | High | High | High | High | Low | |
| Mass manufacturing Capability | Low | Low | Low | High | High | High | High | High | |
| Application | Digital PCR | Capillary electrophoresis, organic synthesis, droplet formation | Cell culture, organs on a chip | DNA synthesis, cell culture | PCR | DNA analysis, electrophoresis | Biochemical reactions, chip-HPLC[ | Glucose detection, environment and food safety tests | |
| Material cost | ∼7$/4 in. wafer | 0.15$/microscope slide (75 × 25 × 1 mm3) | ∼150$/kg | <3$/kg | <3$/kg | 2–4$/kg | 11–35$/kg | NA | |
PDMS curing temperature.
HPLC: High Performance Liquid Chromatography.
Comparison between different tooling methods.
| Technology | Minimum feature size | Aspect ratio | Surface roughness (Ra) | Feature tolerance | Mold materials |
|---|---|---|---|---|---|
| Micromilling | 50 | 1.5 (features in the range between 50 and 100 | 0.1–1 | 5 | Stainless steel, brass, aluminum |
| 5 | <20 | 100 nm | 3 | Stainless steel, titanium | |
| UV-LIGA | 50 nm–500 | <20 | 15 nm | 5% channel size | Nickel, copper, nickel alloy |
Note: Industrial practice of tool fabrication indicates feature more than 100 μm is commonly achievable for micromilling and micro-EDM.
Comparison between injection molding, hot embossing, and R2R imprinting.
| Injection molding | Hot embossing | R2R imprinting | ||
|---|---|---|---|---|
| Mold cost | High | Low | Low | |
| Unit cost | Low | Low | Low | |
| Cycle time | ∼30 s | tens of minutes | seconds | |
| Complexity of part geometry | 3D | 2.5D | limited to thin films | |
| Aspect ratio | Low | High | Low | |
| Suitable for low quantity | Dependent on quantity | Yes | Yes | |
| Commonly used for | Low-cost scale-up production and 3D complex geometry | High-precision and high-quality microstructures | Large area nano/micropatterns | |
Commonly used bonding techniques between various materials.
| Silicon | Glass | PDMS | Thermoplastic | |
|---|---|---|---|---|
| Silicon | Fusion bonding | |||
| Glass | Fusion bonding | Fusion bonding | ||
| PDMS | Adhesive bonding | Oxygen plasma | Oxygen plasma | |
| Thermoplastic | Adhesive bonding | Thermal bonding | Adhesive bonding | Ultrasonic welding |
Standards developed by SEMI and ISO.
| Association | Standards of interest | Status |
|---|---|---|
| SEMI | SEMI MS6-0308 Guide for Design and Materials for Interfacing Microfluidic Systems | Published |
| SEMI MS7-0708 Specification for Microfluidic Interfaces to Electronic Device Packages | Published | |
| SEMI MS9-0611 Specification for High Density Permanent Connections Between Microfluidic Devices | Published | |
| SEMI MS11 Specification for Microfluidic Port and Pitch Dimensions | Published | |
| ISO | IWA 23:2016 Interoperability of microfluidic devices—Guidelines for pitch spacing dimensions and initial device classification | Published |
| ISO/DIS 22916 Microfluidic devices—Interoperability requirements for dimensions, connections, and initial device classification | Under development | |
| ISO/AWI TS 6417 Microfluidic pumps—Symbols and performance communication | Under development |