| Literature DB >> 35075447 |
Yaping Xie1,2, Lizhong Dai1, Yijia Yang1.
Abstract
Since the outbreak of the coronavirus disease 2019 (COVID-19), countries around the world have suffered heavy losses of life and property. The global pandemic poses a challenge to the global public health system, and public health organizations around the world are actively looking for ways to quickly and efficiently screen for viruses. Point-of-care testing (POCT), as a fast, portable, and instant detection method, is of great significance in infectious disease detection, disease screening, pre-disease prevention, postoperative treatment, and other fields. Microfluidic technology is a comprehensive technology that involves various interdisciplinary disciplines. It is also known as a lab-on-a-chip (LOC), and can concentrate biological and chemical experiments in traditional laboratories on a chip of several square centimeters with high integration. Therefore, microfluidic devices have become the primary implementation platform of POCT technology. POCT devices based on microfluidic technology combine the advantages of both POCT and microfluids, and are expected to shine in the biomedical field. This review introduces microfluidic technology and its applications in combination with other technologies.Entities:
Keywords: Biosensors; Loop-mediated isothermal amplification (LAMP); Microfluidic technology; Point-of-care testing (POCT); Three-dimension (3D) printing
Year: 2022 PMID: 35075447 PMCID: PMC8769924 DOI: 10.1016/j.biosx.2022.100109
Source DB: PubMed Journal: Biosens Bioelectron X ISSN: 2590-1370
Fig. 1Microfluidic technology and its integrated applications in POCT.
Classification, principle, and characteristics of various 3D printing methods.
| Additive manufacturing (3D printing) | Principles | Classifications | Properties | Characteristics | References |
|---|---|---|---|---|---|
| Photocuring | The liquid photosensitive resin is used as the printing material, and the liquid resin is selectively cured by photopolymerization to achieve molding | SLA, DLP, TPP | SLA: UV light + scanning galvanometer; DLP: UV light + digital micromirror | The printing size is related to the size of the liquid tank, high accuracy, slow speed, and photosensitive resin | ( |
| Material jetting | The printing material is sprayed to the printing platform continuously and then solidified. The model is built layer by layer | Inkjet printing, polymer jetting, MJM | Inkjet printing: waxy materials; MJM: photosensitive resin | Polymers, waxy materials | ( |
| Binder jetting | Powder materials and adhesive are used as the forming materials. The powder materials are evenly distributed on the forming platform, adhesive droplets are sprayed by the inkjet printing nozzle, and the powders are bonded together by adhesive | / | The combination of the powder material and binder together determines the surface quality and mechanical properties of the formed entity | Forming fast, low cost, most polymers, ceramic materials | ( |
| Material extrusion | The nozzle extrusion wire is used to build a two-dimensional plane. The two-dimensional plane is then used to form a three-dimensional entity | FDM, 3D micro extrusion, 3D plotting | The step grain of forming surfaces is obvious and difficult to improve | Silica gel, organic, or inorganic slurry, hydrogel, polymers, or even cells | ( |
| Powder bed fusion | The powder material is melted using an energy beam such as a laser, or an electron beam is scanned and forms an entity after the material is sintered and bonded | SLS, SLM, EBM | SLS: laser melts the polymer SLM: laser melts metal powder EBM: electron beam melts metal powder | Good mechanical properties, expensive equipment, high cost, slow speed | ( |
| Sheet lamination | The sheet coated with the adhesive is fed to the printing platform and it is bonded with the previous layer by the hot pressing roller | LOM | It is difficult to obtain a precise surface, and the application field is limited | Fast speed, low cost, paper, and composite materials | ( |
| Directed energy deposition | Uses a laser, plasma, electron beam, and other different heat sources to selectively melt powder or filamentous materials. Layer by layer deposition is used to form the solid | LMD, LENS, DMD | Suitable for large size machining and industrial automation, parts repair, and parts additions | Parts repair, parts additions | ( |
DLP, digital light procession; DMD, digital mirror device; FDM, fused deposition modeling; LENS, laser engineered net shaping; LMD, laser metal deposition; LOM, laminated object manufacturing; MJM, multi-jetting mold; SLA, stereo lithography apparatus; TPP: two photon polymerization; UV, ultraviolet.
Classification, principle, and characteristics of the various bonding methods.
| Bonding methods | Classifications | Principles | Characteristics | References |
|---|---|---|---|---|
| Direct bonding | Thermal bonding | Heat to near the vitrification temperature of the material and apply pressure to achieve bonding | Without auxiliary binder, no contaminants produced; good mechanical and thermal properties after bonding; high quality for surface, complex post-treatment | ( |
| Surface modification bonding | The surface of the material is modified by radiation treatment (X-ray, UV light) or plasma treatment (O2, O3, N2) to achieve bonding | Low bonding temperature, high requirements for equipment | ( | |
| Ultrasonic bonding | Bonding is achieved by melting the material using ultrasonic energy | Fast bonding speed, high efficiency, part-bonding; suitable for mass production of polymer chips; does not use adhesives, reduces pollution; simple process and low cost; increases the difficulty of chip manufacturing | ( | |
| Indirect bonding | Solvent bonding | A special solvent, such as acetone, is used to slightly dissolve the surface of the material and then pressure is applied to achieve permanent bonding | Room temperature bonding technique; small microchannel deformation, suitable for small batch production; high requirements for the chip surface cleanliness and flatness; suitable solvent selection | ( |
| Adhesive bonding | Bonding is achieved by adding an intermediate medium between the substrate and the cover (epoxy, UV glue, etc.) | Simple, low cost, suitable for chips of most materials; room temperature bonding technique; poor stability, adhesives may block microchannels | ( |
Fig. 2Schematic of the applications of biosensors.