| Literature DB >> 34687169 |
Weiwei Quan1, Yingbin Lin1,2, Yongjin Luo3, Yiyin Huang1,2.
Abstract
The electrochemical CO2 reduction reaction (ECO2 RR) on Cu catalysts affords high-value-added products and is therefore of great practical significance. The outcome and kinetics of ECO2 RR remain insufficient, requiring essentially the optimized structure design for the employed Cu catalyst, and also the fine synthesis controls. Herein, synthesis-controlled structure preferences and the modulation of intermediate's interactions are considered to provide synthesis-related insights on the design of Cu catalysts for selective ECO2 RR. First, the origin of ECO2 RR intermediate-dominated selectivity is described. Advanced structural engineering approaches, involving alloy/compound formation, doping/defect introduction, and the use of specific crystal facets/amorphization, heterostructures, single-atom catalysts, surface modification, and nano-/microstructures, are then reviewed. In particular, these structural engineering approaches are discussed in association with diversified synthesis controls, and the modulation of intermediate generation, adsorption, reaction, and additional effects. The results pertaining to synthetic methodology-controlled structural preferences and the correspondingly motivated selectivity are further summarized. Finally, the current opportunities and challenges of Cu catalyst fabrication for highly selective ECO2 RR are discussed.Entities:
Keywords: catalysis; copper; electrochemical CO2 Reduction; structural engineering; synthesis
Year: 2021 PMID: 34687169 PMCID: PMC8655169 DOI: 10.1002/advs.202101597
Source DB: PubMed Journal: Adv Sci (Weinh) ISSN: 2198-3844 Impact factor: 16.806
Figure 1Standard reduction potentials (vs SHE) for ECO2RR to different products in alkaline and acidic solutions under the standard condition (25 °C and 1.0 atm).[ , ] The pH of acid and alkaline in the figure is 0 and 14, respectively.
Figure 2The general C1 and C2/2+ pathways on the Cu catalyst surface.
Figure 3Electrodeposition synthesis of Cu complex on Cu foil and its SEM images at different synthesis time (H4BTC = pyromellic acid, BTC4− = tetraanion of pyromellitic acid), as well as the electroreduction synthesis of Cu–Cu2O from this Cu complex at applied potential of −0.4 V versus RHE. Reproduced under the terms of the Creative Commons CC BY license.[ ] Copyright 2019, Nature Publishing Group.
The key synthesis process, and structure–performance insights on various Cu‐based alloy and compound catalysts
| Electrocatalysts | Synthesis method/process | Electrolyte and ECO2RR performance | Primary structure–performance relationship |
|---|---|---|---|
| CuPd nanoparticle alloy[
| Colloidal synthesis route (300 °C) |
0.1 87% CO FE at −0.9 V versus RHE 47 mA mg−1 Pd | d‐band center of Cu upshift, increased energy barrier for *CO protonation and hydrogen evolution processes |
| Pd | Supercritical CO2 drying of Pd |
25 mol% [Bmim]BF4 + 75 mol% water 80.0% CH3OH FE at 0.24 V (vs Ag/Ag+) 31.8 mA cm−2 | Synergistic effect from Pd/Cu facilitated adsorption of COads/CHOads on Cu(I) + Cu(0) species |
| CuAg alloy[
| Physically melting method |
0.05 ≈35% FE for multicarbon oxygenates | Compressive strain on the surface alloy reduced coverage of adsorbed H and reduced oxophilicity |
| Cu70Ag30 thin film[
| Physical vapor deposition |
0.1 Fourfold FE increase and threefold partial current density increase for liquid carbonyl compounds | Ag miscibility in Cu reduced the surface binding energies of oxygen‐containing intermediates |
| Ag/Cu alloy phase catalyst[
| Physical cosputtering |
1 41% ethanol FE at −0.67 V versus RHE 250 mA cm−2 | Ag introduction to lower site‐carbon bonding ability and destabilize the unsaturated ethylene intermediates for ethanol production |
| AuCu nanoparticles[
| Chemical reduction in organic solvent (200–280 °C) |
0.1 80% CO FE at −0.85 V versus RHE | Formation of the three‐atoms‐thick gold overlayers with compressively strained properties |
| AuCu/Cu‐SCA catalyst [
| Electrodeposition |
0.5 29% ethanol FE at −1.0 V versus RHE −5.59 mA cm−2 | Au incorporation altered the binding energies of CH2CHO*, CH3CHO*, and CH3CH2O* for ethanol generation |
| Sn‐Cu bimetallic catalyst[
| Two‐step electrodeposition |
0.1 92% formate FE at −0.95 V versus RHE | Abundant interfaces and possible electron effect to promote CO2•− and HCOO• generation |
| CuSe catalyst[
| Solvothermal synthesis |
[Bmim]PF6‐CH3CN‐H2O 77.6% methanol FE at −2.1 V (vs Ag/Ag+) 41.5 mA cm−2 | Intrinsic properties of CuSe facilitated formation of *COOH, *CO, *CHO, *OCH2 and *OCH3 |
| Cu4O3‐enrhched Cu catalyst [
| Solvothermal synthesis |
0.5 40% ethylene FE at −0.64 V versus RHE at 400 mA cm−2 (flow reactor) | Unknown |
| Cu3P/C catalyst [
| Annealing treatment |
0.1 47% CO FE at −0.3 V versus RHE | Unknown |
| Cu–Cu2O/Cu catalyst[
| Electrodeposition of MOF followed by in situ electroreduction |
0.1 80% FE for C2/2+ product at −0.4 V versus RHE at 11.5 mA cm−2 | Abundant surface active sites, suitable copper(I)/copper(0) ratio, and almost zero contacting resistance |
| CuII/ade‐MOFs catalyst[
| Wet chemical synthesis |
0.1 73% hydrocarbon FE and 45% ethylene FE at a current of 8.5 mA cm−2 at −1.4 V versus RHE | Reconstruction of CuII/ade‐MOFs and formation of Cu nanoparticles functionalized with N in ligand promoted the performance |
Figure 4Schematics to show the morphology evolution of Cu catalysts prepared from different precursors, and defect structures‐influenced electrochemical selectivity. The sphere with green, blue, light gray, dark gray, and brown color represents the Cu atom with the coordination number of 2, 3, 4, 5, and 6, respectively. (EP‐Cu represents electropolished Cu foil.) Reproduced under the terms of the Creative Commons CC BY license.[ ] Copyright 2020, Nature Publishing Group.
The key synthesis process, and structure–performance insights on various Cu‐based catalysts with doping and defect engineering
| Electrocatalysts | Synthesis method/process | Electrolyte and ECO2RR performance | Primary structure–performance relationship |
|---|---|---|---|
| S‐doped Cu catalyst[
| Solvothermal and electrochemical reduction |
0.1 80% formate FE at −0.8 V versus RHE | S facilitated the *OCHO intermediate adsorption |
| O‐doped Cu catalyst[
| Electrochemical reduction |
4 × 10−3
Ethylene production | O doping enhanced adsorption of *CO |
| Cu4.16CeO | Deposition‐participation process and annealing treatment |
0.1 47.6% C2H4 FE and 62% C2H4–CH4 FE at −1.1 V versus RHE | Cuprous promoted the *CH2–*CH2 coupling and/or *C–*CO coupling, and *CH2 protonation |
| Cu catalyst[
| Anodic halogenation and electroreduction processes |
0.1 50.0% ethylene FE and 72.6% C2/2+ FE at −1.69 V versus RHE | Abundant surface defects and low roughness |
| Cu nanocube catalyst[
| Electrochemically anodizing possessing and plasma treatments |
0.1 73% C2/2+ FE at −1.0 V versus RHE | Defects, surface roughness, and oxygen species may alter the *CO adsorption strength |
Figure 5a) Schematic of the Cu nanowires with (100) surface, and the activated Cu nanowires after the electrochemical ECO2RR with surface steps. Adapted with permission.[ ] Copyright 2020, Nature Publishing Group. b) TEM image and the selected area electron diffraction of Cu twin boundary (TB, the white atoms are Cu(111) atoms and the red ones are TB atoms. The yellow circles are twin's spots and the white ones are matrix's diffraction spots). Adapted with permission.[ ] Copyright 2020, American Chemical Society.
The key synthesis process, and structure–performance insights on various Cu‐based catalysts with crystal and catalyst face engineering
| Electrocatalysts | Synthesis method/process | Electrolyte and ECO2RR performance | Primary structure–performance relationship |
|---|---|---|---|
| SW‐Cu2O/Cu film cathode[
| Square‐wave (SW) electrochemical redox cycling |
0.5 98.2% formate FE at ‐0.64 V versus RHE (60 atm CO2) | Lower energy battier for formate intermediate formation on Cu(111) |
| (100)‐rich Cu catalyst[
| In situ electrochemical treatment during ECO2RR |
0.15 90% C2/2+ FE at −0.67 V versus RHE 520 mA cm−2 | High chemisorbed CO selectivity for further conversion of C2 products on Cu(100) |
| Triangular 2D Cu nanosheets[
| Wet chemical reduction synthesis |
2 48% acetate FE at −0.74 V versus RHE 131 mA cm−2 | Suppression of other C2/2+ products based on decreasing ratio of (110) and (100) planes |
| Truncated‐octahedral‐Cu2O nanoparticles[
| Wet chemical reduction synthesis |
0.5 59% ethylene FE at −1.1 V versus RHE 23.1 mA cm−2 | Fermi level is lower on (111) than on (100) facets, enhancing charge transfer and promoting multielectron kinetics processes |
| A‐Cu nanowires[
| Wet chemical synthesis of nanowires and electrochemical activation to form steps |
0.1 77.4% ethylene FE at −1.01 V versus RHE 17.3 mA cm−2 | High energy barrier C1 path and high local population of 2CO* intermediate |
| Cu (751) thin films[
| Physical vapor deposition |
0.1 15% oxygenate FE and 51.7% hydrocarbon FE at −1.1 V versus RHE | Less nearest neighbors on the topmost layer of the Cu(751) film or the Cu(S)–[ |
| Cu nanofibers[
| Electrochemically reduction of Cu halide |
0.1 57.2% C2–C3 FE at −0.735 V versus RHE | Unknown |
| Hexarhombic docadehedron‐like Cu[
| Wet chemical synthesis |
0.1 25% ethanol FE at −1.2 V versus RHE ≈3.5 mA cm−2 | Edge sides to lower the stability of adsorbed *O and tune ECO2RR pathway from ethylene to ethanol |
| Cu twin boundaries[
| Pulsed electrochemical deposition |
0.2 59% CH4 FE at −1.6 V versus RHE ≈7.04 mA cm−2 | Twin boundaries enhanced protonation of adsorbed CO* to convert into CH4 |
| Star decahedron Cu nanocatalyst[
| Wet chemical synthesis |
0.1 52.4% C2H4 FE at ≈−0.993 V versus RHE | Formation energy of *CHO intermediate was lowered on the twin boundaries |
| Cu overlayers on tetrahexahedral Pd nanocrystals [
| Underpotential deposition Cu on Pd(310) |
0.1 ≈20% ethanol FE at ≈−0.46 V versus RHE | Unknown |
| Amorphous Cu nanoparticles[
| Slow reduction by tannic acid at room temperature |
0.1 59% liquid fuel FE and 22% ethanol FE at −1.4 V versus Ag/AgCl | Stronger CO2 adsorption ability, larger ECSA, and fine particle size |
Figure 6a) Schematic of the synthetic processes of 3D hierarchical Sn2.7Cu catalyst on Cu foam, and its high resolution transmission electron microscopy (HRTEM) image. Reproduced with permission.[ ] Copyright 2020, Wiley‐VCH. b) Schematic of preparation of N‐doped nanodiamond/Cu composite and its HRTEM image. Reproduced with permission.[ ] Copyright 2020, Nature Publishing Group.
The key synthesis process, and structure–performance insights on various Cu‐based catalysts with heterostructure engineering
| Electrocatalysts | Synthesis method/process | Electrolyte and ECO2RR performance | Primary structure–performance relationship |
|---|---|---|---|
| Cu–Ag tandem catalyst[
| Physical mixing |
1 C2/2+ product partial current of 160 mA cm−2 | Ag was responsible for CO production, and Cu was in charge of subsequent C–C coupling |
| Ag15Cu85 catalyst[
| Additive‐assisted electrodeposition |
0.5 33.7% ethanol FE at −1.0 V versus RHE; 6.9% n‐propanol FE at −0.9 V versus RHE | Ag facilitated CO generation, which was transferred to Cu surface for C–C coupling |
| Ag–Cu2O electrode[
| Electrochemical deposition |
0.2 34.2% ethanol FE at −1.2 V versus RHE | Ag incorporation promoted CO production, and suppressed HER |
| Ag@Cu‐20 catalyst [
| Wet chemical synthesis (polyol method) |
0.1 28.6% ethylene FE at −1.06 V versus RHE | Geometric effect and synergistic effect of Ag to produce CO and Cu to couple CO intermediate |
| Au‐bipy‐Cu catalyst[
| Wet chemical synthesis |
0.1 25% FE for CH3CHO production | Au promoted the CO production, and bipy could stabilize and make protonation of CO2* |
| Phase‐separated CuPd catalyst[
| Two‐step wet chemical synthesis |
1 63% C2/2+ FE | Geometric effect and synergistic effect of Pd to produce C1 intermediate and Cu for C–C coupling |
| Cu/Cu2O catalyst [
| Electrochemical deposition |
0.1 53.6% methanol FE at −0.7 V versus RHE with 1.3 mA cm−2 (photoanode is TiO2) | Interface balanced the adsorption between *H and *CO intermediates |
| Cu/CuI catalyst[
| Physical mixing |
1 87% C2/2+ FE at −0.87 V versus RHE with partial current of 591 mA cm−2 | Surface reconstruction to induce formation of Cu+ species and adsorbed iodine for enhanced CO adsorption |
| ZnO‐shell/CuO‐core bimetal‐oxide[
| Atomic layer deposition of ZnO on CuO |
1 48.6% C2/2+ FE at −0.68 V versus RHE with partial current of −97 mA cm−2 | Zn‐modified Cu sites could moderately bind CO and *CH3 to promote *COCH3 formation |
| Cu–In heterostructure catalyst[
| Dipping and thermal decomposition |
0.1 93% CO FE at −0.6≈‐0.8 V versus RHE | Enhanced *COOH adsorption and *H destabilization adsorption on the interface |
| In2O3/Cu3N catalyst [
| Calcination of In(OH)3 supported on Cu3N |
0.1 80% CO FE at −0.5 V versus RHE | Cu–In interface promotion effects |
| CuSn NPs/C‐A catalyst [
| Annealed in 5% H2 +95% N2 at 250 °C |
0.1 80% HCOOH FE at −1.0 V versus RHE | Decreased Δ |
| Sn–Cu/SnO | In situ electroreduction for formation of Sn/SnO |
1 83.0% formate FE at −0.93 V versus RHE | In situ formed Sn/SnO |
| Mo8/Cu heterostructure[
| Electrochemical deposition |
NaHCO3 (unknown concentration) 48.68% acetate FE at −1.13 V versus RHE ≈110 mA cm−2 | New Cu–O–Mo sites promote the *CH3 formation and can be coupling by CO2 |
| N‐doped nanodiamonds/Cu heterostructure[
| Chemical vapor deposition of NC and sputtering Cu |
0.5 ≈63% C2 oxygenates FE at −0.5 V versus RHE | N increased conductivity and tune Cu activity, C enhanced binding strength of *CO, stable Cu—C bond enhanced the stability |
| SnO2/CuO nanowires[
| Atomic layer deposition |
0.1 13.4 CO FE with the solar‐to‐fuel efficiency of 14.4% under AM 1.5G illumination | Unknown |
| Au/Cu electrocatalyst[
| Physical vapor deposition |
0.1 5.8% ethanol FE and 4.7% n‐propanol FE at −0.97 V versus RHE with the current of 0.49 and 0.39 mA cm−2 | Au promoted production of CO which was transferred to the nearby Cu for further C–C coupling; Locally alkaline environment |
| Ce(OH) | Electrochemical deposition |
1 43% ethanol FE at −0.7 V versus RHE with partial current of 128 mA cm−2 | Adsorbed hydrogen hydrogenated surface *HCCOH for formation of ethanol |
Figure 7Schematic of synthesis of the carbon‐supported Cu single atom catalyst via the amalgamated Cu–Li method. Reproduced with permission.[ ] Copyright 2020, Nature Publishing Group.
The key synthesis process, and structure–performance insights on various Cu‐based catalysts with single‐atom engineering
| Electrocatalysts | Synthesis method/process | Electrolyte and ECO2RR performance | Primary structure–performance relationship |
|---|---|---|---|
| CuSAs/TCNFs catalyst [
| Electrostatic spinning and pyrolysis |
0.1 44% methanol FE at −0.9 V versus RHE, C1 product partial current: 93 mA cm−2 | Strongly binding with *CO intermediate on single Cu |
| Cu–N–C‐800 catalyst [
| Pyrolysis |
0.1 24.8% C2H4 FE and 13.9% CH4 FE at −1.4 V versus RHE, partial current: 6.84 and 3.83 mA·cm−2 | Adjacent Cu–N2 moieties for *CO protonation and C–C coupling |
| Cu–C3N4 catalyst [
| Thermal treatment synthesis |
0.1 ≈5% ethanol FE at −1.6 V versus Ag/AgCl | Synergy between Cu for C‐terminated adsorption, and neighboring C for O‐terminated adsorption |
| Cu/C‐0.4 catalyst [
| Amalgamated Cu–Li method |
0.1 ≈91% ethanol FE at −0.7 V versus RHE | Dynamical formation of Cun cluster favorable for C–C coupling |
| Cu–N–C catalyst [
| Ball milling and pyrolysis |
0.1 55% ethanol FE and 80% C2/2+ product FE at −1.2 V versus RHE | Dynamical formation of Cu nanoparticles favorable for C–C coupling |
| Cu(II)‐phthalocyanine[
| Purchase commercially |
0.5 66% methane FE at −1.06 V versus RHE with current of 13 mA cm−2 | Unknown |
| Cu–Pd10Te3 catalyst[
| Wet impregnation method |
0.2 92% CO FE at −0.78 V versus RHE | Cu1
|
| Cu–CeO2‐4% catalyst [
| Wet impregnation method |
0.1 ≈58% methane FE at −1.8 V versus RHE | Atomic Cu sites, surrounded multiple oxygen vacancies, and cooperative effect from CeO2 |
Figure 8Schematic of the role comparison of hydrophilcity and hydrophobicity in influencing ECO2RR relative to hydrogen evolution. Reproduced with permission.[ ] Copyright 2019, Nature Publishing Group.
The key synthesis process, and structure–performance insights on various Cu‐based catalysts with surface modification engineering
| Electrocatalysts | Synthesis method/process | Electrolyte and ECO2RR performance | Primary structure–performance relationship |
|---|---|---|---|
| Fluorine‐modified Cu catalyst[
| Solvothermal process and electroreduction |
1 80% C2/2+ FE at −0.89 V versus RHE, current:1600 mA cm−2 | Surface F‐modifier enhanced *CO adsorption, H2O activation, and *CO hydrogenation |
| OHad‐modified Cu electrode[
| Electrochemical treatment (pulsed voltammetry) |
Phosphate buffer solution (pH = 7.9) Production of oxygenated hydrocarbon | Cooperativity effect between *OH and *CO facilitated decreasing HER, and formation of C—C bonds to generate oxygenated products |
| Cu‐enriched Au catalyst[
| Underpotential deposition of Cu on Au |
0.5 Syngas production with current more than 20 mA cm−2 | Cu modified the surface electronic structure and influenced the *CO binding |
| Alkanethiols‐coated dendritic Cu[
| Electrodeposition and wet impregnation method |
0.1 56% ethylene FE and 17% ethanol FE at −1.5 V versus RHE | Plastron effect and suppressing HER |
| Poly(acrylamide)‐modified Cu[
| Wet impregnation method |
0.1 26% ethylene FE at −0.96 V versus RHE | Charge donation to Cu for CO activation, facilitation of *CO adsorption and stabilization of *CO dimer |
| Benzimidazole‐modified Cu foil[
| Wet impregnation method |
0.1 ≈77% C2/2+ FE at −1.07 V versus RHE | Restriction of H diffusion and highly active H
|
Figure 9a) Representative SEM images, FE of C3 and C2 products, and the ratio of C3/C2 along with different Cu catalyst morphologies. Adapted with permission.[ ] Copyright 2018, Nature Publishing Group. b) Schematic of synthesis for branched CuO nanoparticles. Adapted with permission.[ ] Copyright 2019, American Chemical Society.
The key synthesis process, and structure–performance insights on various Cu‐based catalysts with nano‐ and microstructure engineering
| Electrocatalysts | Synthesis method/process | Electrolyte and ECO2RR performance | Primary structure–performance relationship |
|---|---|---|---|
| Nano porous Cu–Ag alloy[
| Electrodeposition with presence of 3,5‐diamino1,2,4‐triazole |
0.1 60% C2H4 FE and 25% C2H5OH FE at −0.7 V versus RHE, current: ≈300 mA cm−2 | Enhanced stabilization of Cu2O overlayer and optimal availability of CO intermediate with presence of Ag |
| Porous Cu microspheres[
| Electroreduction of Cu2O in KI solution |
0.05 78% C2/2+ FE at −1.1 V versus RHE | Moderate coordination number (7.7) of Cu in the pore |
| Open Cu nanocavity structures[
| Nucleation and growth of nanocrystals, acid etching to form nanocavity |
1 21% proponol FE at −0.56 V versus RHE with current of ≈7.8 mA cm−2 in CO electroreduction | Nanocavity enabled the trapping of C2 intermediates for further reaction |
| Ag core‐porous Cu shell nanoparticles[
| Chemical reduction with presence of poly(ethylene glycol) methyl ether |
0.1 ≈5.5*10−8 mol s−1 g−1 for production of C3H8O at −0.65 V versus RHE | Ag produced CO, and Cu for C–C coupling reaction |
| Porous 3D Cu skeleton[
| Electrochemical deposition |
0.5 29.1% C2/2+ FE at −1.1 V versus RHE | Pores in micrometers to prolong the reaction time |
| Branched Cu oxide nanoparticles[
| Slow oxidation of cubic Cu2O in NH3 solution |
0.1 70% ethylene FE at −1.05 V versus RHE | Highly active junctions and interfaces, and high local pH |
| Nanoporous Cu electrocatalyst[
| Precipitating Cu salt, thermal annealing, and electroreduction |
1 ≈62% C2/2+ product FE at ≈−0.67 V with the current of 653 mA cm−2 | Fast gas transport and high local pH for favorable C–C coupling reaction |
Statistical example number (red dots) on the primary synthesis methods and processes from Tables 1, 2, 3, 4, 5, 6, 7 resulting in specific structural engineering in Cu‐based catalysts. Wet chemical process includes chemical reduction in aqueous solution and organic solvent, wet impregnation process, and chemical etching under standard atmosphere pressure. Electrochemical process involves electrodeposition, electroreduction, and electrochemical activation. Thermal treatment includes pyrolysis and annealing. Physical method treatment refers to physically melting, physical vapor deposition, physical mixing, and sputtering processes
| Wet chemical process | Electrochemical process | Solvothermal process | Themal treatment | Physical process | Amalgamated Cu–Li method | |
|---|---|---|---|---|---|---|
| Alloy | ●●● | ●● | ●● | |||
| Compound | ● | ● | ●● | |||
| Doping | ● | ●● | ||||
| Defect | ● | |||||
| Crystal facet | ●●●● | ●●●●●● | ||||
| Amorphization | ● | ● | ||||
| Heterostructure | ●●●●● | ●●●●● | ●● | ●●●●●● | ||
| Single atom | ●● | ●●●● | ● | |||
| Surface modification | ●●● | ●●●● | ||||
| Nano–microstructure | ●●● | ●●● | ● |
Figure 10Summary on the main product from ECO2RR on different engineered Cu structures.
Summary on intermediate modulation and additional effects on different engineered Cu structures
| Enhanced intermediate adsorptiona/reactivityb | Suppressing intermediate adsorptionc/reactivityb | Additional effects | |
|---|---|---|---|
| Alloying/compounding engineering | PdCu (*CO/*CHO)a, AuCu (CH2CHO*, CH3CHO*, and CH3CH2O*)a, SnCu (CO2•− and HCOO• generation)b, CuSe (*COOH, *CO, *CHO, *OCH2, and *OCH3 generation)b | PdCu (*CO protonation)b, CuAg (*H and O‐containing intermediates)c | PdCu (S‐HER), CuAg(reduced oxophilicity), SnCu (S‐HER) |
| Doping and defect engineering | S‐doped Cu (*OCHO)a, O‐doped Cu (*CO)a, Ce‐doped Cu (*CH2–*CH2 coupling, *C–*CO coupling, *CH2 protonation)b | Truncated‐octahedral‐Cu2O (enhanced charge transfer) | |
| Crystal face engineering and amorphization | Cu(111) (formate formation)b, Cu(100) (*CO)a, Cu nanowires (*CO)a, Cu twin boundaries (*CO protonation)b, star decahedron Cu (*CHO generation)b; amorphous Cu (CO2)a | Hexarhombic docadehedron‐like Cu (*O)c | |
| Heterostructure engineering | Cu–Ag (*CO generation)b, Ag–Cu2O (*CO generation)b, Au‐bipy‐Cu (*CO generation)b and (*CO2 protonation)a,b, Cu–Cu2O (*CO)a; ZnO–CuO (*CO, *CH3)a, Cu–In (*COOH)a, Cu–Sn (*COOH generation)b, Mo8–Cu (*CH3 generation)b, NC–Cu (*CO)a, Au–Cu (*CO generation)b, Ce(OH) | Cu–Cu2O (*H)c, Cu–In (*H)c | Ag–Cu (geometric effect), Cu–Pd (geometric effect), NC–Cu (increased conductivity) |
| Single atom engineering | CuSAs/TCNFs (*CO)a, Cu–N–C (*CO protonation)b, Cu–C3N4 (C‐/O‐terminated intermediate)a, Cu–Pd10Te3 (*H2O)a | Cu/C (formation of Cu cluster), Cu–N–C (formation of Cu nanoparticle) | |
| Surface modification | F‐modified Cu (*CO)a and (H2O activation, *CO hydrogenation)b, —OH‐modified Cu2O (*COOH)a, Cu atom‐modified Cu (*CO)a, Cu‐modified Au (*CO)a, poly(acrylamide)‐modified Cu (*CO activation)a,b, benzimidazole‐modified Cu (*COOH formation)b | Benzimidazole‐modified Cu (H diffusion)b | —OH‐modified Cu2O (S‐HER), —OH‐modified Cu (S‐HER), alkanethiols‐coated Cu (plastron effect and S‐HER) |
| Nano/microstructure engineering | Open Cu nanocavity (C2 intermediate trapping)a, Ag core–porous Cu shell (CO generation and coupling)a,b | Porous 3D Cu skeleton (prolonged reaction time), branched Cu oxide nanoparticle (high local pH), nanoporous Cu (fast gas transport, high local pH) |
Note: S‐HER represents suppressing HER. Intermediate reactivity includes its generation, protonation, and so on.