| Literature DB >> 34562058 |
Aya E Samaha1, Ahmad K ElFadl1, Mohammed N Anwar1.
Abstract
OBJECTIVES: To evaluate the micro-shear bond strength of two resin cements to aged laser bleached enamel after the application of three different desensitizing agents.Entities:
Keywords: bleaching; desensitizing agent; fluoride; laser; resin cement
Mesh:
Substances:
Year: 2021 PMID: 34562058 PMCID: PMC8874074 DOI: 10.1002/cre2.496
Source DB: PubMed Journal: Clin Exp Dent Res ISSN: 2057-4347
Materials used in the study
| Material | Code | Composition | Manufacturer | Batch no. |
|---|---|---|---|---|
| GC MI Paste Plus | G2 |
Glycerol, 5–10% CPP–ACP, pure water, zinc oxide, CMC–Na, xylitol, Fluoride level is 0.2% wt/wt (900 ppm). | GC Corp., Tokyo, Japan. | 090813M |
| Hydroxyapatite nanoparticles | G3 | |||
| Flor‐Opal | G4 |
0.5% fluoride ion pH 6.5 | Ultradent, Inc., South Jordan, USA. | F115 |
| DUO‐LINK universal resin luting cement | DC |
Base: UDMA, Bis‐GMA, TEGDMA, fiberglass Catalyst:10–30% Bis‐GMA, 1% dibenzoyl peroxide | BISCO, Schaumburg, USA. | 1900003959 |
| Choice 2 light cured resin cement | LC | UDMA, BisGMA, tetrahydrofurfuryl methacrylate, glass strontium, amorphous silica | BISCO, Schaumburg, USA. | 1900004426 |
Abbreviations: Bis‐GMA, Bisphenol A‐glycidylmethacrylate; CMC‐Na, sodium carboxymethyl cellulose; TEGDMA, tetraethyleneglycol dimethacrylate; UDMA, urethane dimethacrylate.
The mean MSBS of the 2 resin cements for the same desensitization protocol
| Desensitization | No‐post bleaching treatment (G1) | GC MI Paste Plus (G2) | n‐HAP (G3) | Flor‐Opal (G4) |
|
|---|---|---|---|---|---|
| 36.06 ± 5.7 c | 55.29 ± 6.3 b | 58.71 ± 7.1 b | 65.42 ± 6.5a | 0.0001 | |
| Resin cement | Dual‐curing resin cement | Light‐curing resin cement |
| ||
| 49.78 ± 8.3 b | 58.68 ± 7.9 a | 0.01 | |||
Note: Different lower‐case superscript letters within the same row indicate statistically significant difference p < 0.05.
The mean MSBS of the resin cements with different desensitizing protocols
| Desensitization | No‐post bleaching treatment (G1) | GC MI Paste Plus (G2) | n‐HAP (G3) | Flor‐Opal (G4) |
|
|---|---|---|---|---|---|
| Dual‐curing resin cement | 32.11 ± 5.8 c | 56.34 ± 11.2 ab | 48.12 ± 16.9 b | 63.77 ± 11.9 a | 0.0001 |
| Light‐curing resin cement | 40.02 ± 6.4 c | 54.32 ± 9.9 b | 68.49 ± 12.6 a | 67.03 ± 14.5 a | 0.0001 |
|
| <0.002 | <0.625 ns | <0.004 | <0.554 ns |
Note: Different lower‐case superscript letters within the same row indicate statistically significant difference p < 0.05.
Within the same column indicates statistically significant difference p < 0.05.
Figure 1Bar graph showing the mean micro‐shear bond strength of the resin cements with different desensitizing protocols
The modes of failure of the different tested groups
| Adhesive failure | Cohesive failure (resin cement) | Cohesive failure (enamel) | Mixed failure | ||
|---|---|---|---|---|---|
| GC MI Paste Plus | DC | 4 | 3 | 1 | 6 |
| LC | 4 | 3 | 1 | 6 | |
| n‐HAP | DC | 8 | 0 | 1 | 5 |
| LC | 5 | 3 | 1 | 5 | |
| Flor‐Opal | DC | 6 | 2 | 0 | 6 |
| LC | 5 | 5 | 3 | 1 | |
Figure 2Bar chart showing the failure mode percentages in each group
Figure 3Stereo‐microscope photograph of the representative specimens for different modes of failure; (a) cohesive failure in the resin cement, (b) adhesive failure, (c) cohesive failure in the enamel, (d) mixed failure