| Literature DB >> 33477456 |
Chun Fei Siah1, Lucas Yu Xiang Lum1, Jianxiong Wang2, Simon Chun Kiat Goh2, Chong Wei Tan1, Liangxing Hu1, Philippe Coquet2,3, Hong Li2,4, Chuan Seng Tan1, Beng Kang Tay1,2.
Abstract
Carbon nanotubes (CNTs) have, over the years, been used in research as a promising material in electronics as a thermal interface material and as interconnects amongst other applications. However, there exist several issues preventing the widespread integration of CNTs onto device applications, e.g., high growth temperature and interfacial resistance. To overcome these issues, a complementary metal oxide semiconductor (CMOS)-compatible CNT array transfer method that electrically connects the CNT arrays to target device substrates was developed. The method separates the CNT growth and preparation steps from the target substrate. Utilizing an alignment tool with the capabilities of thermocompression enables a highly accurate transfer of CNT arrays onto designated areas with desired patterns. With this transfer process as a starting point, improvement pointers are also discussed in this paper to further improve the quality of the transferred CNTs.Entities:
Keywords: bonding; carbon nanotubes; microelectronics fabrication; temperature
Year: 2021 PMID: 33477456 PMCID: PMC7830489 DOI: 10.3390/mi12010095
Source DB: PubMed Journal: Micromachines (Basel) ISSN: 2072-666X Impact factor: 2.891