Literature DB >> 20941774

Ultrafast transfer of metal-enhanced carbon nanotubes at low temperature for large-scale electronics assembly.

Yifeng Fu1, Yiheng Qin, Teng Wang, Si Chen, Johan Liu.   

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Year:  2010        PMID： 20941774     DOI： 10.1002/adma.201002415

Source DB:  PubMed          Journal:  Adv Mater        ISSN： 0935-9648            Impact factor:   30.849


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  3 in total

1.  All WSe2 1T1R resistive RAM cell for future monolithic 3D embedded memory integration.

Authors:  Maheswari Sivan; Yida Li; Hasita Veluri; Yunshan Zhao; Baoshan Tang; Xinghua Wang; Evgeny Zamburg; Jin Feng Leong; Jessie Xuhua Niu; Umesh Chand; Aaron Voon-Yew Thean
Journal:  Nat Commun       Date:  2019-11-15       Impact factor: 14.919

2.  Development of a CMOS-Compatible Carbon Nanotube Array Transfer Method.

Authors:  Chun Fei Siah; Lucas Yu Xiang Lum; Jianxiong Wang; Simon Chun Kiat Goh; Chong Wei Tan; Liangxing Hu; Philippe Coquet; Hong Li; Chuan Seng Tan; Beng Kang Tay
Journal:  Micromachines (Basel)       Date:  2021-01-18       Impact factor: 2.891

3.  Degradation of Carbon Nanotube Array Thermal Interface Materials through Thermal Aging: Effects of Bonding, Array Height, and Catalyst Oxidation.

Authors:  Andreas Nylander; Josef Hansson; Torbjörn Nilsson; Lilei Ye; Yifeng Fu; Johan Liu
Journal:  ACS Appl Mater Interfaces       Date:  2021-06-23       Impact factor: 9.229
  3 in total

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