| Literature DB >> 33411506 |
Hyunho Seok1, Yonas Tsegaye Megra2, Chaitanya K Kanade1, Jinill Cho2, Vinit K Kanade1, Minjun Kim1, Inkoo Lee2, Pil J Yoo1,3, Hyeong-U Kim4, Ji Won Suk1,2,5, Taesung Kim1,2.
Abstract
Two-dimensional (2D) transition metal dichalcogenides (TMDs) have attracted considerable attention owing to their synergetic effects with other 2D materials, such as graphene and hexagonal boron nitride, in TMD-based heterostructures. Therefore, it is important to understand the physical properties of TMD-TMD vertical heterostructures for their applications in next-generation electronic devices. However, the conventional synthesis process of TMD-TMD heterostructures has some critical limitations, such as nonreproducibility and low yield. In this paper, we synthesize wafer-scale MoS2-WS2 vertical heterostructures (MWVHs) using plasma-enhanced chemical vapor deposition (PE-CVD) via penetrative single-step sulfurization discovered by time-dependent analysis. This method is available for fabricating uniform large-area vertical heterostructures (4 in.) at a low temperature (300 °C). MWVHs were characterized using various spectroscopic and microscopic techniques, which revealed their uniform nanoscale polycrystallinity and the presence of vertical layers of MoS2 and WS2. In addition, wafer-scale MWVHs diodes were fabricated and demonstrated uniform performance by current mapping. Furthermore, mode I fracture tests were performed using large double cantilever beam specimens to confirm the separation of the MWVHs from the SiO2/Si substrate. Therefore, this study proposes a synthesis mechanism for TMD-TMD heterostructures and provides a fundamental understanding of the interfacial properties of TMD-TMD vertical heterostructures.Entities:
Keywords: adhesion energy; dry transfer; heterostructure; plasma-enhanced chemical vapor deposition (PE-CVD); transition metal dichalcogenides (TMDs)
Year: 2021 PMID: 33411506 DOI: 10.1021/acsnano.0c06989
Source DB: PubMed Journal: ACS Nano ISSN: 1936-0851 Impact factor: 15.881