| Literature DB >> 32110535 |
Mi-Kyung Yu1, Myung-Jin Lim1, Noo-Ri Na1, Kwang-Won Lee1.
Abstract
OBJECTIVES: This study investigated the effects of a hydrofluoric acid (HA; solution of hydrogen fluoride [HF] in water)-based smart etching (SE) solution at an elevated temperature on yttria-stabilized tetragonal zirconia polycrystal (Y-TZP) ceramics in terms of bond strength and morphological changes.Entities:
Keywords: Bond strength; HA-based etchant; Temperature elevation; Y-TZP
Year: 2019 PMID: 32110535 PMCID: PMC7030966 DOI: 10.5395/rde.2020.45.e6
Source DB: PubMed Journal: Restor Dent Endod ISSN: 2234-7658
Materials used, manufacturers, and major components
| Material | Trade name | Manufacturer | Main components |
|---|---|---|---|
| PA etching | Etch-37 | Bisco Inc., Schaumburg, IL, USA | 37% PA gel |
| w/benzalkonium chloride | |||
| HA etching | Porcelain Etchant | Bisco Inc., Schaumburg, IL, USA | 4% buffered HA gel |
| SE solution etching | Smart Etching | Yesbiogold Inc., Seoul, Korea | 40% HA (vol %) |
| 59% PA (vol %) | |||
| 1% HCl (vol %) | |||
| Zirconia primer | Z-prime Plus | Bisco Inc., Schaumburg, IL, USA | BPDM, HEMA, ethanol |
| MDP-containing resin cement | G-CEM LinkAce | GC Inc., Tokyo, Japan | Paste A: Fluoro-alumino-silicate glass, UDMA, dimethacrylate, silicon dioxide |
| Paste B: PA ester monomer (MDP), silicon dioxide, UDMA, dimethacrylate | |||
| MDP-free resin cement | Duo-link Universal | Bisco Inc., Schaumburg, IL, USA | Base: Bis-GMA, TEGDMA, UDMA, glass filler |
| Catalyst: Bis-GMA, TEGDMA, glass filler |
PA, phosphoric acid; HA, hydrofluoric acid; SE, smart etching; HCl, hydrochloric acid; BPDM, biphenyl dimethacrylate; HEMA, hydroxyethyl methacrylate; UDMA, urethane dimethacrylate; MDP, methacryloyloxydecyl dihydrogen phosphate; Bis-GMA, bisphenyl A glycidyl methacrylate; TEGDMA, triethylene glycol dimethacrylate.
Shear bond strength values of each experimental group according to the use of methacryloyloxydecyl dihydrogen phosphate (MDP)-free or MDP-containing resin cement after etching the yttria-stabilized tetragonal zirconia polycrystal (Y-TZP) surface under various conditions
| Etching condition | Resin cement, Mean ± SD (MPa) | |
|---|---|---|
| MDP-free resin cement | MDP-containing resin cement | |
| Control | 8.50 ± 2.16Aa | 12.80 ± 0.81Ab |
| 37% PA at 20°C–25°C | 12.37 ± 2.92Ba | 16.17 ± 0.99Bb |
| 4% HA at 20°C–25°C | 12.60 ± 3.03Ba | 15.60 ± 2.55Bb |
| HA-based SE at 70°C–80°C | 16.15 ± 2.82Ca | 20.39 ± 2.29Cb |
SD, standard deviation; PA, phosphoric acid; HA, hydrofluoric acid; SE, smart etching.
Identical uppercase letters indicate no statistically significant differences (p > 0.05).
Figure 1Shear bond strength values of yttria-stabilized tetragonal zirconia polycrystal (Y-TZP) in each group etched under various conditions with different resin cements.
MDP, methacryloyloxydecyl dihydrogen phosphate; PA, phosphoric acid; HA, hydrofluoric acid; SE, smart etching.
Identical uppercase letters indicate no statistically significant differences (p > 0.05).
Figure 2Scanning electron microscopy (SEM) images at 30,000 times magnification of yttria-stabilized tetragonal zirconia polycrystal (Y-TZP) surfaces etched under different conditions. (A) Etching-free specimen (control); (B) 37% phosphoric acid (PA)-etched specimen; (C) 4% hydrofluoric acid (HA)-etched specimen; (D) HA-based smart etching (SE)-etched specimen.
Figure 3Atomic force microscopy images of yttria-stabilized tetragonal zirconia polycrystal (Y-TZP) surfaces etched under different conditions. (A) Etching-free specimen (control); (B) 37% phosphoric acid (PA)-etched specimen; (C) 4% hydrofluoric acid (HA)-etched specimen; (D) HA-based smart etching (SE)-etched specimen.