| Literature DB >> 32015329 |
Yen-Ju Wu1, Tianzhuo Zhan2, Zhufeng Hou3, Lei Fang1, Yibin Xu4.
Abstract
Heat transfer at interfaces plays a critical role in material design and device performance. Higher interfacial thermal resistances (ITRs) affect the device efficiency and increase the energy consumption. Conversely, higher ITRs can enhance the figure of merit of thermoelectric materials by achieving ultra-low thermal conductivity via nanostructuring. This study proposes a dataset of descriptors for predicting the ITRs. The dataset includes two parts: one part consists of ITRs data collected from 87 experimental papers and the other part consists of the descriptors of 289 materials, which can construct over 80,000 pair-material systems for ITRs prediction. The former part is composed of over 1300 data points of metal/nonmetal, nonmetal/nonmetal, and metal/metal interfaces. The latter part consists of physical and chemical properties that are highly correlated to the ITRs. The synthesis method of the materials and the thermal measurement technique are also recorded in the dataset for further analyses. These datasets can be applied not only to ITRs predictions but also to thermal-property predictions or heat transfer on various material systems.Entities:
Year: 2020 PMID: 32015329 PMCID: PMC6997172 DOI: 10.1038/s41597-020-0373-2
Source DB: PubMed Journal: Sci Data ISSN: 2052-4463 Impact factor: 6.444
Fig. 1A schematic overview of the ITR and descriptor datasets. The ITR dataset includes experimental data collected from 87 papers, the experimental conditions, and their reference details. The descriptor datasets are composed of the physical and chemical descriptors of different materials that can be used for data training and/or prediction via machine learning.
The ITR dataset collected from the 87 papers. There are 11 data points given as examples including the interface id, interface, interlayer (1: exists, 0: absent), ITR, temperature, measurement method, materials for the film and substrate, the preparation method, film thickness, substrate details, and reference id. The columns showing the substrate details, substrate pretreatment, and interfacial properties are not listed here; this information can be found at 10.5281/zenodo.3564173[99]. The reference id (id-R) corresponds to the sheet of ITR references at 10.5281/zenodo.3564173[99].
| id | interface id | Interface | interlayer | ITR (10−9 m2K/W) | Measuring temperature (K) | Measurement method | Film 1 | Film 1 preparation method | Film 1 thickness (nm) | substrate (Film2) | Substrate details | Reference (id-R) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 1 | 1 | Au/SiO2/Si | 1 | 26.3157895 | 100 | TDTR | Au | e-beam evaporation | 80 | Si | Boron-doped Si (100) | [ |
| 1 | 1 | Au/SiO2/Si | 1 | 26.3157895 | 100 | TDTR | Au | e-beam evaporation | 80 | Si | Boron-doped Si (100) | [ |
| 2 | 1 | Au/SiO2/Si | 1 | 24.3902439 | 150 | TDTR | Au | e-beam evaporation | 80 | Si | Boron-doped Si (100) | [ |
| 3 | 1 | Au/SiO2/Si | 1 | 25.6410256 | 200 | TDTR | Au | e-beam evaporation | 80 | Si | Boron-doped Si (100) | [ |
| 4 | 1 | Au/SiO2/Si | 1 | 22.7272727 | 250 | TDTR | Au | e-beam evaporation | 80 | Si | Boron-doped Si (100) | [ |
| 5 | 1 | Au/SiO2/Si | 1 | 21.2765957 | 296 | TDTR | Au | e-beam evaporation | 80 | Si | Boron-doped Si (100) | [ |
| 119 | 17 | Al/Si | 0 | 5.18134715 | 298 | TDTR | Al | evaporation | 80 | Si | Phosphorus-doped Si (100) | [ |
| 153 | 30 | Bi/H-diamond | 1 | 256.410256 | 80 | TDTR | Bi | thermal evaporation | 100 | C | Hydrogen-terminated Diamond | [ |
| 230 | 60 | Cr/Si | 0 | 8.84955752 | 298 | TDTR | Cr | Sputter deposition | 50 | Si | Si | [ |
| 231 | 61 | Cr/a-Si/Si | 1 | 5.61797753 | 298 | TDTR | Cr | Sputter deposition | 50 | Si | Si | [ |
| 232 | 62 | Au/TiO2 | 0 | 25 | 298 | TDTR | Au | magnetron sputtering | 50 | TiO2 | Si | [ |
| 479 | 154 | Au/a-SiO2 | 0 | 4.5045045 | 298 | 2 ω | Au | thermal evaporation | 100 | a-SiO2 | Si | [ |
The descriptor dataset for 12 different materials is shown as an example. The material id (id-M), material, formula, specific heat capacity, melting point, density, volume per formula unit (f.u.), atomic ratio (R), mass, atomic coordinate (AC), electronegativity (EN), ionic potential (IP), and binding energy (Eb) can be found in the dataset.
| id-M | Material | Formula | Specific heat capacity (J/gK) | Melting point (K) | Density (g/cm3) | Volume per f.u. (10−29 m3/f.u.) | R1 | R2 | Mass (u) | AC1x | AC1y | AC2x | AC2y | ENc | ENa | IPc | IPa | Eb(eV/f.u.) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 1 | Silicon | Si | 0.71 | 1687 | 2.33 | 2 | 1 | 1 | 28.09 | 14 | 3 | 14 | 3 | 1.9 | 1.9 | 8.15 | 8.15 | −4.62 |
| 2 | Germanium | Ge | 0.31 | 1211 | 5.34 | 2.26 | 1 | 1 | 72.64 | 14 | 4 | 14 | 4 | 2.01 | 2.01 | 7.9 | 7.9 | −3.86 |
| 3 | Glass | a-SiO2 | 0.75 | 1873 | 2.2 | 4.53 | 1 | 2 | 60.08 | 14 | 3 | 16 | 2 | 1.9 | 3.44 | 8.15 | 13.62 | −19.65 |
| 4 | Gold | Au | 0.13 | 1337 | 19.3 | 1.7 | 1 | 1 | 196.97 | 11 | 6 | 11 | 6 | 2.54 | 2.54 | 9.23 | 9.23 | −3.81 |
| 5 | Aluminium | Al | 0.9 | 934 | 2.7 | 1.65 | 1 | 1 | 26.98 | 13 | 3 | 13 | 3 | 1.61 | 1.61 | 5.99 | 5.99 | −3.39 |
| 6 | Lead | Pb | 0.13 | 600 | 11.4 | 3.03 | 1 | 1 | 207.2 | 14 | 6 | 14 | 6 | 2.33 | 2.33 | 7.42 | 7.42 | −2.03 |
| 7 | Bismuth | Bi | 0.12 | 545 | 9.8 | 3.52 | 1 | 1 | 208.98 | 15 | 6 | 15 | 6 | 2.02 | 2.02 | 7.29 | 7.29 | −2.18 |
| 8 | Titanium | Ti | 0.52 | 1953 | 4.5 | 1.76 | 1 | 1 | 47.87 | 4 | 4 | 4 | 4 | 1.54 | 1.54 | 6.82 | 6.82 | −4.85 |
| 9 | Chromium | Cr | 0.45 | 2118 | 7.2 | 1.2 | 1 | 1 | 52 | 6 | 4 | 6 | 4 | 1.66 | 1.66 | 6.77 | 6.77 | −4.09 |
| 10 | Titanium nitride | TiN | 0.6 | 3200 | 5.5 | 1.91 | 1 | 1 | 61.87 | 4 | 4 | 15 | 2 | 1.54 | 3.04 | 6.82 | 14.53 | −13.58 |
| 11 | Magnesium oxide | MgO | 0.9 | 3125 | 3.5 | 1.87 | 1 | 1 | 40.3 | 2 | 3 | 16 | 2 | 1.31 | 3.44 | 7.65 | 13.62 | −10.25 |
| 12 | Sapphire | Al2O3 | 0.78 | 2300 | 3.99 | 4.26 | 2 | 3 | 101.96 | 13 | 3 | 16 | 2 | 1.61 | 3.44 | 5.99 | 13.62 | −31.79 |
Fig. 2An ITR statistical plot of the ITR dataset. The data number of each material system is depicted in orange.
Fig. 3The ITR data distribution without an interlayer. The ITR data distribution versus the temperature and the film 1 thickness are shown in (a,b), respectively. The data include three types of material systems: metal/metal in red, metal/nonmetal in blue, and nonmetal/nonmetal in yellow.
Fig. 4The ITR data distribution with interlayers versus the temperature. The interlayer materials are categorized into seven groups: graphene (red), other 2D materials (blue), organic materials (yellow), surface plasma treatment (green), amorphous SiO2 (a-SiO2) (purple), metal (gray), and others (pink).
Overview of the archive content. A demonstration of the data is provided for each file.
| File | Sheet | Content | Unit |
|---|---|---|---|
| ITR dataset.xlsx | ITR | id | |
| interface id | |||
| interface | |||
| interlayer | |||
| Thermal boundary conductance | MW/m2K | ||
| ITR | 10−9 m2K/W | ||
| Temperature | K | ||
| Measuring method | |||
| Film | |||
| Film preparation method | |||
| Film thickness | nm | ||
| Substrate | |||
| Substrate details | |||
| Substrate pretreatment | |||
| Interfacial properties | |||
| References (id-R) | |||
| ITR References | Id-R | ||
| Title | |||
| Authors | |||
| Journal | |||
| DOI | |||
| Descriptor dataset.xlsx | Descriptor dataset | Id-M | |
| Material | |||
| formula | |||
| Specific heat capacity | J/gK | ||
| Melting point | K | ||
| Density | g/cm3 | ||
| Volume per formula unit (f.u.) | 10−29 m3/f.u. | ||
| R (atomic ratio) | |||
| mass | u | ||
| Atomic coordinate (AC) | |||
| Electronegativity (EN) | |||
| Ionic potential (IP) | |||
| Binding energy (Eb) | eV/f.u. | ||
| atom_energy_vasp.xlsx | atom_energy_vasp | atomic number | |
| symbol | |||
| PAW potential name | |||
| Total energy of an isolated atom | eV/atom | ||
| training dataset for ITR prediction.xlsx | training dataset | The arranged dataset for data training. | |
| The details can be found in README sheet. | |||
| README |
| Measurement(s) | material entity • interface • Material Description |
| Technology Type(s) | machine learning • digital curation |