| Literature DB >> 31844286 |
Chunsong Zhao1,2,3, Chaoliang Tan1,2, Der-Hsien Lien1,2, Xiaohui Song3,4, Matin Amani1,2, Mark Hettick1,2, Hnin Yin Yin Nyein1,2,3, Zhen Yuan1,2, Lu Li1,2, Mary C Scott3,4, Ali Javey5,6.
Abstract
There is an emerging need for semiconductors that can be processed at near ambient temperature with high mobility and device performance. Although multiple n-type options have been identified, the development of their p-type counterparts remains limited. Here, we report the realization of tellurium thin films through thermal evaporation at cryogenic temperatures for fabrication of high-performance wafer-scale p-type field-effect transistors. We achieve an effective hole mobility of ~35 cm2 V-1 s-1, on/off current ratio of ~104 and subthreshold swing of 108 mV dec-1 on an 8-nm-thick film. High-performance tellurium p-type field-effect transistors are fabricated on a wide range of substrates including glass and plastic, further demonstrating the broad applicability of this material. Significantly, three-dimensional circuits are demonstrated by integrating multi-layered transistors on a single chip using sequential lithography, deposition and lift-off processes. Finally, various functional logic gates and circuits are demonstrated.Entities:
Year: 2019 PMID: 31844286 DOI: 10.1038/s41565-019-0585-9
Source DB: PubMed Journal: Nat Nanotechnol ISSN: 1748-3387 Impact factor: 39.213