| Literature DB >> 31775000 |
Youngwook Kim1,2, Patrick Herlinger1, Takashi Taniguchi3, Kenji Watanabe3, Jurgen H Smet1.
Abstract
The successful assembly of heterostructures consisting of several layers of different 2D materials in arbitrary order by exploiting van der Waals forces has truly been a game changer in the field of low-dimensional physics. For instance, the encapsulation of graphene or MoS2 between atomically flat hexagonal boron nitride (hBN) layers with strong affinity and graphitic gates that screen charge impurity disorder provided access to a plethora of interesting physical phenomena by drastically boosting the device quality. The encapsulation is accompanied by a self-cleansing effect at the interfaces. The otherwise predominant charged impurity disorder is minimized, and random strain fluctuations ultimately constitute the main source of residual disorder. Despite these advances, the fabricated heterostructures still vary notably in their performance. Although some achieve record mobilities, others only possess mediocre quality. Here, we report a reliable method to improve fully completed van der Waals heterostructure devices with a straightforward postprocessing surface treatment based on thermal annealing and contact mode atomic force microscopy (AFM). The impact is demonstrated by comparing magnetotransport measurements before and after the AFM treatment on one and the same device as well as on a larger set of treated and untreated devices to collect device statistics. Both the low-temperature properties and the room temperature electrical characteristics, as relevant for applications, improve on average substantially. We surmise that the main beneficial effect arises from reducing nanometer scale corrugations at the interfaces, that is, the detrimental impact of random strain fluctuations.Entities:
Keywords: Hall sensor; graphene; molybdenum disulfide; quantum Hall effect; van der Waals heterostructure
Year: 2019 PMID: 31775000 DOI: 10.1021/acsnano.9b06992
Source DB: PubMed Journal: ACS Nano ISSN: 1936-0851 Impact factor: 15.881