| Literature DB >> 31547440 |
Alenka Vesel1, Rok Zaplotnik2, Gregor Primc3, Miran Mozetič4.
Abstract
The paper presents a review on the current methods for deposition of vertically oriented multilayer graphene sheets (often called carbon nanowalls-CNWs) on solid substrates. Thin films of CNWs are among the most promising materials for future applications in capacitors, batteries, electrochemical devices, and photovoltaics, but their application is currently limited by slow deposition rates and difficulties in providing materials of a desired structure and morphology. The review paper analyzes results obtained by various groups and draws correlations between the reported experimental conditions and obtained results. Challenges in this scientific field are presented and technological problems stressed. The key scientific challenge is providing the growth rate as well as morphological and structural properties of CNWs thin films versus plasma parameters, in particular versus the fluxes of reactive plasma species onto the substrate surface. The technological challenge is upgrading of deposition techniques to large surfaces and fast deposition rates, and development of a system for deposition of CNWs in the continuous mode.Entities:
Keywords: carbon nanowalls; deposition parameters; deposition speed; deposition temperature; growth mechanism; plasma synthesis
Year: 2019 PMID: 31547440 PMCID: PMC6766222 DOI: 10.3390/ma12182968
Source DB: PubMed Journal: Materials (Basel) ISSN: 1996-1944 Impact factor: 3.623
Figure 1Number of publications per year regarding carbon nanotube (CNT) synthesis (a) and carbon nanowall (CNW) synthesis (b). Source: Web of Science.
Figure 2An example of carbon nanowalls grown on the surface of a titanium foil.
Figure 3Schematic presentation of CNWs growth mechanism as suggested by Hiramatsu [9].
Methods and conditions for CNWs deposition.
| Ref. | Gas | Temperature (°C) | Growth Rate or Time | Method | Substrate Material | Important Findings |
|---|---|---|---|---|---|---|
| [ | CH4/H2 | 650–700 | - | MW PECVD with catalyst and DC bias | Cu, GaAs, Si, SiO2, sapphire | - |
| [ | CH4/H2 | 600–900 | ~several m/h | ICP PECVD | Si, SiO2, Al2O3, Mo, Zr, Ti, Hf, Nb, W, Ta, Cu, stainless steel 304 | The growth rate was increasing with increasing temperature and CH4 concentration. CNWs on all substrates showed the same general morphology. |
| [ | C2F6, CH4, CF4, CHF3, or C4F8 with H2 | 500 | ~180 nm/h | CCP PECVD | Si | The growth rate depended on the type of gas and it was the highest for C2F6/H2 and the lowest for CF4/H2: |
| [ | CH4/H2 | - | ~8 m/h | MW PECVD with DC bias | SiO2 | The height of CNWs as a function of time obeyed the square root law. |
| [ | CH4/He | 1000 | ~7 nm/min | DC PECVD | Si | The average size and film thickness were increasing with increasing total plasma current. |
| [ | Ar/N2/CH4 | min. 650 | 1 µm/min | ASTex MW PECVD | Si or silica | Addition of Ar gas reduced the deposition temperature and increased the production of C2 dimers. |
| [ | CO/H2 | 700 | 1 µm/min | ASTex MW PECVD | Si | High growth rate was obtained at a relatively low MW power of 60 W. |
| [ | CH4/H2 | ~400 | up to | ECR-MW PECVD | SiO2, glass, Cu | Deposition temperature depended on the substrate material. |
| [ | CH4/Ar | 625–800 | ~10 nm/min | ECR PECVD | SiO2/Si | The growth rate and quality of CNWs could be enhanced by increasing the substrate temperature, decreasing the distance between the MW source and the substrate, and increasing the MW power. |
| [ | C2F6/H2 w/o O2 | 580 | ~25 nm/min | Radical injection CCP PECVD | Si | O2 gas addition reduced the amorphicity and disorder of CNWs and assisted in nucleation of CNWs. |
| [ | CH4/H2 | 680 | 1 µm/20 min | RF PECVD | Cu, Si, and Si with a film of Ni or Au | Morphology of CNWs depended on the type of a substrate |
| [ | CH4/H2 | - | 1.5 | MW PECVD | Cu | The size of graphene sheets depended on a flow rate. A maximum was observed at 10–30 sccm. |
| [ | Ar/H2/C2H2 | 700 | 1 µm/30 min | RF plasma beam PECVD | SiO2/Si, Ti, stainless steel, Quartz, MgO, carbon paper (all substrates covered with clustered Ni catalyst) | Type of the substrate material was not critical for CNWs growth. |
| [ | Ar/H2/CH4 | - | ~10 µm/min | Mesoplasma | Si | Growth rate was increasing with increasing RF power (12–18 kW) and increasing CH4 flow rate (10–80 sccm). Various CNWs morphologies were observed. |
| [ | Ar/CH4 | 750–900 | up to 10 min | CCP PECVD | Cu | The density of CNWs increased with substrate temperature, plasma power, and deposition time. |
| [ | Ar/H2/CH4 | 475–550 | ~10 nm/min | ICP PECVD | glass | The size and density of CNWs increased with increasing temperature. |
| [ | Ar/H2/C2H2 | 550, 650, 750 | - | RF PECVD | Si, Ni/Si, Al2O3, carbon fiber | CNWs did not grow at 550 °C. Morphology of CNWs depended on temperature, pressure, and gas flow. |
| [ | Ar/CH4 | 700 | ~300 nm/min in lateral size | Atmospheric DC PECVD | Polished stainless steel | Growth rate is much higher compared to low-pressure synthesis. |
| [ | Ar/H2/ethanol or hexane vapor | 800 | 100 nm/min | Atmospheric DC PECVD | Ni | Growth rate is much higher compared to low-pressure synthesis. |
| [ | Ar/H2/ethanol vapor | 700 | >15 min | Atmospheric DC PECVD | Si, Cu, stainless steel | - |
| [ | Ar/CH4 or Ar/C2H2 | - | Several min | Low-pressure PECVD | SiO2/Si with Au pattern | CNWs were grown on a substrate with a designed pattern. |
| [ | H2/CH4 | ~1000 | ~50–55 nm/min | DC PECVD | Glassy carbon, Si | Substrate temperature depended on the film thickness. An increase in temperature of the substrate surface resulted in an increase in the nanowall average linear size. |
| [ | p-xylene | 450 | 20 min | ICP PECVD | Si coated with TiN | Three types of carbon nanostructured were formed depending on the flow rate: fibers, free standing nanowalls, or interconnected nanowalls. |
| [ | Ar/H2/C2H2 | 200–700 | 60 min | RF plasma beam PECVD | Si | Strong dependence of morphology on temperature: CNTs were observed at 200 °C, amorphous carbon nanoparticles in the range of 300–400 °C and CNWs at 500–700 °C. |
| [ | aluminum acetyl-acetonate + Ar | 350, 425, 500 | 50 min | ICP PECVD | Stainless steel, Ni, Al, Si | Strong influence of the bias voltage, substrate temperature, |
| [ | H2/CH4 | 600 | 40 min | RF PECVD | Ni foam, copper, glass | - |
| [ | Ar/H2/CH4 | 520–550 | 12 nm/min | ICP PECVD | SiO2 | Quality of CNWs increased with plasma power and temperature. |
Figure 4The growth rate versus the temperature as reported in literature shown in Table 1. The dots represent results in the cases when the authors performed experiments at a constant temperature. Some authors reported a range of temperatures during deposition—these results are represented with longitudinal bars.
Figure 5The growth rate for different types of discharges as reported in literature shown in Table 1. The height of the bars indicates the range of growth rates found in the literature.
Figure 6The growth rate for different gases as reported in literature shown in Table 1. The height of the bars indicates the range of growth rates found in the literature.