| Literature DB >> 31071939 |
Nguyen Tam Nguyen Truong1, Hai Ha Thi Hoang2, Chinho Park3.
Abstract
Well-Entities:
Keywords: inclination angle; nanorods; nanorods orientation; well aligned
Year: 2019 PMID: 31071939 PMCID: PMC6539724 DOI: 10.3390/ma12091490
Source DB: PubMed Journal: Materials (Basel) ISSN: 1996-1944 Impact factor: 3.623
Figure 1(a) The schematic diagram of the device structure, (b) WA-ZnO Nrods and ZnO seed layer morphology, and (c) WA-ZnO Nrod with hexagonal structure.
Figure 2The X-ray diffraction pattern of WA-ZnO Nrods grown on the ITO substrate with various reaction time of 1 to 4 h.
Figure 3The scanning emission microscope of (top view (inset) and cross-section view) images of WA-ZnO Nrods grown on the ITO substrate with various reaction time of 1 to 4 h. (a) 1 h of growth time; (b) 2 h of growth time; (c) 3 h of growth time, (d) 4 h of growth time.
Figure 4The SEM images of the (a–d) (WA-ZnO/P3HT:PCBM) active layer on ZnO seed layer/ITO/glass, 3D-AFM images of the (e–h) (WA-ZnO/P3HT:PCBM)- and 2D-AFM images of the (i–l) (WA-ZnO/P3HT:PCBM)-active layer on ZnO seed layer/ITO/glass with various reaction time of 1 to 4 h
Figure 5J–V curve characteristics of the device with structure of glass/ITO/ZnO seed layer/WA-ZnONrod/(P3HT:PCBM)/WO3/EGaIn with various reaction time of 1 to 4 h.
Device parameters without- and with VA-ZnO Nrod (varied of length) such as short-circuit current density (JSC), open-circuit voltage (VOC), fill factor (FF), and power conversion efficiency (PCE) were compared.
| Sample | Voc | Jsc | FF | PCE |
|---|---|---|---|---|
| Cell-without WA-ZnO Nrods | 0.725 | 4.42 | 67.1 | 2.1 |
| Cell-with WA-ZnO Nrods (~160 nm) | 0.750 | 6.60 | 63.7 | 3.3 |
| Cell-with WA-ZnO Nrods (~250 nm) | 0.750 | 6.78 | 71.0 | 3.8 |
| Cell-with WA-ZnO Nrods (~320 nm) | 0.780 | 6.30 | 65.7 | 3.1 |
| Cell-with WA-ZnO Nrods (~510 nm) | 0.725 | 3.41 | 61.8 | 1.5 |
Figure 6J–V curve characteristics of the device with structure of glass/ITO/WA-ZnONrod (250 nm)/(P3HT:PCBM)/WO3/EGaIn dependent on the thickness and morphology of WO3 buffer layer.
Device parameters such as short-circuit current density (JSC), open-circuit voltage (VOC), fill factor (FF), and power conversion efficiency (PCE) of device dependent on the thickness and morphology of WO3 buffer layer.
| Sample | Voc | Jsc | FF | PCE |
|---|---|---|---|---|
| Cell-without WO3 | 0.725 | 4.4 | 67.1 | 2.1 |
| Cell-with WO3 (~60 nm, RMS~4.04 nm) | 0.750 | 6.78 | 71.0 | 3.8 |
| Cell-with WO3 (~40 nm, RMS~3.32 nm) | 0.750 | 7.17 | 71.0 | 3.9 |
| Cell-with WO3 (~20 nm, RMS~2.19 nm) | 0.770 | 9.40 | 62.6 | 4.5 |
| Cell-with WO3 (~15 nm, RMS~2.93 nm) | 0.750 | 6.69 | 63.0 | 3.2 |
Figure 7The AFM phase images of the (a–d) glass/ITO/WA-ZnONrod/(P3HT:PCBM)/WO3, (inset) AFM 3-Dimention images, and video contact angle images of the (e–h) glass/ITO/WA-ZnONrod/(P3HT:PCBM)/WO3 dependent on the thickness and morphology of WO3 buffer layer.