| Literature DB >> 30060476 |
Kristina A Malsagova1, Tatyana O Pleshakova2, Andrey F Kozlov3, Ivan D Shumov4, Mikhail A Ilnitskii5, Andrew V Miakonkikh6, Vladimir P Popov7, Konstantin V Rudenko8, Alexander V Glukhov9, Igor N Kupriyanov10, Nina D Ivanova11, Alexander E Rogozhin12, Alexander I Archakov13, Yuri D Ivanov14.
Abstract
Application of micro-Raman spectroscopy for the monitoring of quality of high-k (h-k) dielectric protective layer deposition onto the surface of a nanowire (NW) chip has been demonstrated. A NW chip based on silicon-on-insulator (SOI) structures, protected with a layer of high-k dielectric ((h-k)-SOI-NW chip), has been employed for highly sensitive detection of microRNA (miRNA) associated with oncological diseases. The protective dielectric included a 2-nm-thick Al₂O₃ surface layer and a 8-nm-thick HfO₂ layer, deposited onto a silicon SOI-NW chip. Such a chip had increased time stability upon operation in solution, as compared with an unprotected SOI-NW chip with native oxide. The (h-k)-SOI-NW biosensor has been employed for the detection of DNA oligonucleotide (oDNA), which is a synthetic analogue of miRNA-21 associated with oncological diseases. To provide biospecificity of the detection, the surface of (h-k)-SOI-NW chip was modified with oligonucleotide probe molecules (oDVA probes) complementary to the sequence of the target biomolecule. Concentration sensitivity of the (h-k)-SOI-NW biosensor at the level of DL~10-16 M has been demonstrated.Entities:
Keywords: high-k dielectric; miRNA; micro-Raman spectroscopy; nanowire biosensor; silicon-on-insulator
Mesh:
Substances:
Year: 2018 PMID: 30060476 PMCID: PMC6164057 DOI: 10.3390/bios8030072
Source DB: PubMed Journal: Biosensors (Basel) ISSN: 2079-6374
Figure 1Schematic illustrating the detection of miRNA with the silicon-on-insulator nanowire ((h-k)-SOI-NW) biosensor.
Figure 2Typical micro-Raman spectra excited by laser radiation in ultraviolet (UV) (325 nm) (a) and visible (532 nm) (b) ranges on silicon wafers and SOI-NW chips. Experiment conditions: annealing temperature 450 °C (black and blue lines) and 1000 °C (red lines), HfO2 layer thickness 20 nm (red and blue lines) and <10 nm (black lines). Arrows indicate spectrum lines corresponding to monoclinic (m) and orthorhombic (OI) phase phonons of HfO2 (a) and acoustic phonons of Si (b) according to [35,36,37]).
Figure 3Micro-Raman spectra of single-phonon scattering peak on HfO2-coated silicon excited by laser radiation in UV (325 nm) (a) and visible (532 nm) (b) ranges wafers and SOI-NW chips. Experiment conditions: annealing temperature 450 °C (black and blue lines) and 1000 °C (red lines), HfO2 layer thickness 20 nm (red and blue lines) and <10 nm (black lines).
Figure 4Comparison of typical I(t) dependencies obtained for (h-k)-SOI-NW chip (a) and for SOI-NW chip with native oxide (b). Numbers indicate curves obtained for different sensors. Experiment conditions: 1 mM potassium phosphate buffer (pH 7.4), V = −50 V, V = −0.2 V.
Figure 5Typical ΔI(t) dependencies obtained upon detection of oDVA in buffer using (h-k)-SOI-NW sensors with immobilized oDNA probes. Experimental conditions: 1 mM potassium phosphate buffer (pH 7.4), V = −50 V, V = −0.2) V, total volume of solution in the cell 450 μL. Final concentrations of target oDVA in the measuring cell were 3.3 × 10−17 M (curve 1), 3.3 × 10−16 M (curve 2), 3.3 × 10−15 M (curve 3), 3.3 × 10−14 M (curve 4). Arrows indicate the addition of target oDNA solution (CS) and wash with buffer.