| Literature DB >> 29630636 |
Fereshteh Shafiei1, Pourya Mohammadparast2, Zahra Jowkar2.
Abstract
PURPOSE: Universal adhesives are new systems that can be used in etch-and-rinse (ER) and self-etch (SE) modes. This in vitro study evaluated the bonding performance of a universal adhesive in ER mode and SE mode with two irrigants for luting fiber posts in the root canal.Entities:
Mesh:
Substances:
Year: 2018 PMID: 29630636 PMCID: PMC5891019 DOI: 10.1371/journal.pone.0195367
Source DB: PubMed Journal: PLoS One ISSN: 1932-6203 Impact factor: 3.240
Description of the study groups.
| Groups | Code | Adhesive category | Irrigant + adhesive steps |
|---|---|---|---|
| 1 | OS/H | Etch-and-rinse | NaOCl + acid etching + One-Step Plus |
| 2 | CSE/H | Self-etch | NaOCl + Clearfil SE Bond |
| 3 | CSE/ED | Self-etch | EDTA + Clearfil SE Bond |
| 4 | AB-Er/H | Multi-mode | NaOCl + acid etching + All-Bond Universal |
| 5 | AB-Se/H | Multi-mode | NaOCl + All-Bond Universal |
| 6 | AB-Se/ED | Multi-mode | EDTA + All-Bond Universal |
| 7 | AB-Se/W | Multi-mode | Water + All-Bond Universal |
Composition and application mode of the used adhesives system.
| Adhesive system/Manufacturer (Lot No.) | Adhesive type | Application procedure | Composition |
|---|---|---|---|
| Clearfil SE Bond/ Kuraray, Osaka Japan | Self-Etch (SE) | Apply primer to root canal and leave in place for 20 s. Dry with the air stream to evaporate volatile ingredients. Apply Bond to the root canal and then create a uniform film using air stream. Light polymerize for 20 s. | Primer: water, MDP, HEMA, camphorquinone, hydrophilic dimethacrylate |
| One-StepPlus/Bisco, | Etch-and-Rinse (ER) | Apply etchant for 15 s. Rinse thoroughly. Remove excess water with paper points. Apply adhesive in 2 coats with agitating movements for 10 s. Blot the canal dry with paper points until the paper returns dry from the canal. Air-dry after 10 s. light cure for 20s. | Biphenyl dimethacrylate 2-hydroxyethyl methacrylate. Acetone amine, photoinitiator, dented glass |
| All-Bond Universal/Bisco | Self-Etch (SE) | Apply two, separate coats of adhesive, scrubbing with the micro-brush for 10–15 s per coat. Blot the canal dry with paper points until the paper returns dry from the canal. Evaporate excess solvent by thoroughly air-drying with an air syringe for at least 10 s. Light polymerize for 20 s.Apply etchant for 15 s. Rinse thoroughly. Remove excess water with paper points. Apply adhesive as for the self-etch mode. | 10-MDP phosphate monomer, bis-GMA, HEMA, ethanol, water, initiators |
Fig 1Schematic representation of the two coronal slices, two middle slices and two apical slices obtained from fiber post cemented in root canal space.
Push-out bond strength values (mean ± standard deviation in MPa) of the tested groups.
| Groups | Root region | |||
|---|---|---|---|---|
| Coronal | Middle | Apical | Total | |
| OS/H | 13.26 (2.9) | 11.70 (2.7) | 10.99 (2.4) | 11.98 (2.7) |
| CSE/H | 14.52 (3.3) | 11.09 (3.5) | 8.11 (1.9) | 11.25 (3.9) |
| CSE/ED | 16.98 (1.5) | 13.64 (2) | 11.36 (1.8) | 13.99 (2.9) |
| AB-Er/H | 14.16 (2.4) | 12.8 (2.4) | 11.98 (2.7) | 12.99 (2.5) |
| AB-Se/H | 11.64 (3.8) | 10.0 (3.3) | 8.84 (3) | 10.07 (3.5) |
| AB-Se/ED | 17.52 (3.6) | 15.19 (4.6) | 13.42 (2.5) | 15.38 (3.9) |
| AB-Se/W | 13.0 (2.1) | 11.5 (2.6) | 9.1 (1.8) | 11.22 (2.7) |
| Total | 14.44 (3.4)A | 12.28 (3.4)B | 10.55 (2.8)C | 12.42 (3.6) |
Means with different letters show statistically significant differences between root regions (p<0.05).
Results of multiple comparisons by Tukey test.
| Groups | 2 | 3 | 4 | 5 | 6 | 7 |
|---|---|---|---|---|---|---|
| 1 | 0.950 | 0.087 | 0.809 | 0,170 | 0.943 | |
| 2 | - | 0.203 | 0.762 | 1.00 | ||
| 3 | - | 0.809 | 0.477 | |||
| 4 | - | 0.193 | ||||
| 5 | - | 0.777 | ||||
| 6 | - |
1, OS/H; 2, CSE/H; 3, CSE/ED; 4, ABEr/H; 5, ABSe/H; 6, ABSe/ED; 7, ABSe/W
*P<0.05 indicates a statistically significant difference.
Fig 2Representative SEM images of the adhesive interface in the seven study groups at low and high magnifications.
a and A: OS/H, intimate adaptation with resin tag formation was observed; b and B: CSE/H, no gap was seen with few short and some fractured resin tags; c and C: CSE/ED, a well-adapted interface was found with homogenous compact resin tags; d and D: AB-Er/H, a well-formed interface was detected with numerous long resin tags; e, E: AB-Se/H, gap formation was revealed with no resin tags; f and F: AB-Se/ED, an adapted interface was detected with uneven resin tag formation; g and G: AB-Se/W, good adaptation was seen with resin tag formation.
The length of resin tags (in μm) formed at the adhesive interface for the tested groups.
| Groups | The length of resin tags |
|---|---|
| OS/H | 10–25 |
| CSE/H | 5–10 |
| CSE/ED | 34–72 |
| AB-Er/H | 70–149 |
| AB-Se/H | 0 |
| AB-Se/ED | 8–29 |
| AB-Se/W | 8–16 |
Fig 3Schematic representation showing the adhesion mechanism at the adhesive interface.