| Literature DB >> 29152571 |
Shengyi Dong1, Jing Leng2, Yexin Feng3, Ming Liu4, Chloe J Stackhouse4, Andreas Schönhals2, Leonardo Chiappisi5,6, Lingyan Gao7, Wei Chen8, Jie Shang9, Lin Jin9, Zhenhui Qi9, Christoph A Schalley7,9.
Abstract
Although the concept of structural water that is bound inside hydrophobic pockets and helps to stabilize protein structures is well established, water has rarely found a similar role in supramolecular polymers. Water is often used as a solvent for supramolecular polymerization, however without taking the role of a comonomer for the supramolecular polymer structure. We report a low-molecular weight monomer whose supramolecular polymerization is triggered by the incorporation of water. The presence of water molecules as comonomers is essential to the polymerization process. The supramolecular polymeric material exhibits strong adhesion to surfaces, such as glass and paper. It can be used as a water-activated glue, which can be released at higher temperatures and reused many times without losing its performance.Entities:
Year: 2017 PMID: 29152571 PMCID: PMC5687854 DOI: 10.1126/sciadv.aao0900
Source DB: PubMed Journal: Sci Adv ISSN: 2375-2548 Impact factor: 14.136
Fig. 1Water-activated supramolecular polymerization.
Chemical structures of (A) TC7 and (B) the control compounds TC6 and DC7. (C) Images of the TC7 samples with different water content [TC7-H1 is used to abbreviate samples with TC7: water (H) ratio of n: 1 (w/w)]. (D) Fibers drawn from TC710-H1 (i and ii); fiber of TC73-H1 injected to hexane (rhodamine B was added to the glue to make it clearly visible) (iii); fiber generated by coating glass slides with TC75-H1 and then pulling them apart (at 80°C) (iv).
Fig. 2The nature of water molecules in TC7-H materials.
(A) ATR-IR spectra of TC7 samples prepared with H2O and D2O (TC710-H1 and TC710-D1). (B) H/D exchange experiments conducted on TC710-D1 adhesive (for details, see the Supplementary Materials). (C) The dependence of DC conductivity σdc versus 1/T for TC7-H materials with different water content. (D) Dielectric loss versus frequency for TC7-H materials with different water content at a temperature of −100°C: Frequency dependence of loss peaks due to hydrogen bonding between TC7 and water (maxima labeled in pink) and between two adjacent TC7 molecules (red labels). (E) Averaged hydrogen-bond strengths (EHB) of crown ether–water systems with different number of water molecules (Nwater) as obtained from the density functional theory (DFT) calculations: Some representative molecular structures are shown here (inserted chemical structures) and in fig. S26. The gray, red, and white spheres are carbon, oxygen, and hydrogen atoms, respectively. Hydrogen-bonds are indicated by short black-dashed lines. Blue horizontal–dashed and dot-dashed lines represent the theoretical and experimental EHB’s of bulk ice Ih, respectively.
Fig. 3Application of TC710-H1 materials as adhesive materials.
(A) A cartoon representation of the adhesion procedure. (B to D) Macroscopic adhesive behavior of TC710-H1 materials on hydrophilic surface. The adhesion areas are 9.0 × 8.0 cm2 (B), 4.5 × 1.0 cm2 (C), and 4.0 × 2.5 cm2 (D), respectively.
Fig. 4Measurements of pull-off adhesion strength.
(A) Illustration of the pull-off adhesion test. (B) Comparison of the adhesion effect of TC710-H1 and commercially available adhesive poly(vinyl acetate) (PVA) glue at 25°C. (C) Adhesion strength of TC710-H1 at different temperatures. (D) Recycling tests of TC710-H1 at 25°C.