| Literature DB >> 29114427 |
Ozgur Irmak1, Ozge Celiksoz1, Begum Yilmaz1, Batu Can Yaman1.
Abstract
PURPOSE: This study evaluated the effects of different adhesive systems on repair bond strength of aged resin composites.Entities:
Keywords: Resin composite; adhesive; bond strength; repair; shear
Year: 2017 PMID: 29114427 PMCID: PMC5624142 DOI: 10.17096/jiufd.31921
Source DB: PubMed Journal: J Istanb Univ Fac Dent ISSN: 2149-2352
Experimental groups (2SE, two-step self-etch adhesive; 2TE, two-step total-etch adhesive; 1SE, one-step self-etch adhesive; TA, thermal aging).
| Groups | Composite | Thermal Aging | Adhesive System | Repair Composite |
|---|---|---|---|---|
| 2SE-control | Clearfil Majesty Esthetic | - | Clearfil SE Bond | Clearfil Majesty Esthetic |
| 2SE-TA | Clearfil Majesty Esthetic | + | Clearfil SE Bond | Clearfil Majesty Esthetic |
| 2TE-control | Clearfil Majesty Esthetic | - | XP Bond | Clearfil Majesty Esthetic |
| 2TE-TA | Clearfil Majesty Esthetic | + | XP Bond | Clearfil Majesty Esthetic |
| 1SE-control | Clearfil Majesty Esthetic | - | I Bond | Clearfil Majesty Esthetic |
| 1SE-TA | Clearfil Majesty Esthetic | + | I Bond | Clearfil Majesty Esthetic |
Materials used in the study (4-META, 4-methacryloyloxyethyl trimellitate anhydride;10-MDP, 10-methacryloyloxydecyl dihydrogenphosphate; Bis-GMA, bisphenol A diglycidyl methacrylate; HEMA, 2-hydroxyethyl methacrylate; PENTA, dipentaerythritol pentaacrylate monophosphate; TCB, butan- 1,2,3,4-tetracarboxylic acid di-2-hydroxyethylmethacrylate ester; TEGDMA, triethylene glycol dimethacrylate; UDMA, urethane dimethacrylate.
| Brand | Type | Ingredients | Manufacturer |
|---|---|---|---|
| Clearfil Majesty Esthetic | Resin composite | Silanated barium glass filler (40%vol, 0.37-1.5 µm particle size), pre-polymerized organic filler, Bis-GMA, hydrophobic aromatic dimethacrylate, dl-camphorquinone | Kuraray Co., Ltd, Osaka, Japan |
| Clearfil SE Bond | 2-step self-etch adhesive | Primer: MDP, HEMA, hydrophilic dimethacrylate, photo-initiator, water Bond: MDP, HEMA, Bis-GMA, hydrophobic dimethacrylate, photo-initiator, silanated colloidal silica | Kuraray Co., Ltd, Osaka, Japan |
| XP Bond | 2-step total-etch adhesive | PENTA, TCB resin, UDMA, TEGDMA, HEMA, nanofiller, camphorquinone, butilated benzenediol ,tertiary butanol | Dentsply Caulk, Milford, CT, USA |
| I Bond | 1-step self-etch adhesive | UDMA, 4-META, glutaraldehyde, acetone, water, photo-initiator, stabilizer | Heraeus Kulzer GmbH, Hanau, Germany |
Application protocols of the adhesive systems.
| Adhesive | Application Protocol |
|---|---|
| Clearfil SE Bond | Apply the primer to the surface with a brush, wait for 20s, air dry. |
| Apply the bond to the surface with a brush, air dry. | |
| Light cure for 10s. | |
| XP Bond | Apply the phosphoric acid gel for 15s, rinse with water for 15s, air dry lightly. |
| Apply the adhesive to the surface, wait for 20s, air dry. | |
| Light cure for 20s. | |
| I Bond Self-Etch | Apply with a brush by light rubbing for 20s. |
| Air dry for 5s. | |
| Light cure for 20s. |
Figure 1.Images of the composite sample prepared for the shear bond strength test.
Shear bond strengths (MPa) and their standard deviations (Means sharing a letter are not significantly different , uppercase letters compare means in the same row, Lowercase letters compare means in the same column).
| 2SE (SE Bond) | 2TE (XP Bond) | 1SE (I Bond) | |
|---|---|---|---|
| Control | 18.19 ± 3.20 Aa | 19.15 ± 5.10 Aa | 8.93 ± 1.90 Ba |
| Thermal Aging (TA) | 13.66 ± 3.55 Ab | 12.78 ± 3.46 Ab | 5.63 ± 1.56 Ba |