| Literature DB >> 28503474 |
Hyun-Young Lee1, Geum-Jun Han2, Juhea Chang3, Ho-Hyun Son1.
Abstract
OBJECTIVES: This study evaluated the influence of a multi-mode universal adhesive (MUA) containing silane (Single Bond Universal, 3M EPSE) on the bonding of resin cement to lithium disilicate.Entities:
Keywords: Lithium disilicate; Microshear bond strength; Resin cement; Silane; Universal adhesive
Year: 2017 PMID: 28503474 PMCID: PMC5426215 DOI: 10.5395/rde.2017.42.2.95
Source DB: PubMed Journal: Restor Dent Endod ISSN: 2234-7658
Materials used in the study
| Product | Manufacturer | Main components* |
|---|---|---|
| IPS e.max CAD | Ivoclar Vivadent | Lithium disilicate |
| Ceramic etching gel | Ivoclar Vivadent | 5% hydrofluoric acid |
| Bis-Silane | Bisco | Ethanol, silane |
| Porcelain Bonding Resin | Bisco | Bis-GMA, UDMA, TEGDMA |
| Single Bond Universal | 3M ESPE | Organophosphate monomer (MDP), Bis-GMA, HEMA, Vitrebond copolymer, filler, ethanol, water, initiators, silane |
| NX3 | Kerr | 7,7,9-trimethyl-4,13-dioxo-3,14-dioxa-5,12-diazahexadecane-1,16-diyl bismethacrylate, TEGDMA, HEMA |
| Filtek Z250 | 3M EPSE | Bis-GMA, UDMA, Bis-EMA, PEGDMA, TEGDMA, silane-treated ceramic |
Bis-GMA, bisphenol A diglycidyl ether dimethacrylate; UDMA, urethane dimethacrylate; TEGDMA, triethylene glycol dimethacrylate; MDP, 10-methacryloyloxydecyl dihydrogen phosphate; HEMA, 2-hydroxyethyl methacrylate; Bis-EMA, bisphenol A ethoxylated dimethacrylate; PEGDMA, polyethylene glycol dimethacrylate.
*As provided by the manufacturers.
Figure 1Experimental design of the study. HF, Hydrofluoric acid; ANS, adhesive that does not contain silane (Porcelain Bonding Resin, Bisco); MUA, Multi-mode universal adhesive (Single Bond Universal, 3M EPSE).
Microshear bond strength after different surface treatments on lithium disilicate
| Group | Treatment | Bond strength (MPa) | Reduction rate of bond strength (%) | |
|---|---|---|---|---|
| 24 hr | Thermocycling | |||
| A | ANS | 1.35 ± 1.12aA | 0.00 ± 0.00aB | 100.0 |
| B | S + ANS | 8.66 ± 2.83bA | 2.68 ± 1.43bB | 69.1 |
| C | HF + S + ANS | 27.14 ± 6.85cA | 13.08 ± 3.80cB | 51.8 |
| D | MUA | 1.53 ± 0.61aA | 0.00 ± 0.00aB | 100.0 |
| E | HF + MUA | 21.37 ± 5.08dA | 3.13 ± 1.82bB | 85.4 |
Different superscript lowercase letters in the same column indicate significant differences; different superscript capitalized letters in the same row indicate a significant difference.
Reduction rate of bond strength (%) = ([bond strength after water storage for 24 hours − bond strength after thermocycling]/bond strength after water storage for 24 hours) × 100
ANS, adhesive that did not contain silane; S, silane; HF, hydrofluoric acid; MUA, Multi-mode universal adhesive.
Figure 2Failure mode distribution after microshear bond strength testing. TC, thermocycling.
Figure 3Representative SEM photomicrographs of fractured ceramic surfaces after microshear bond strength testing showing (a) adhesive failure; (b) mixed failure; (c) cohesive failure at ×100 magnification. The arrow shows the fracture origin and the direction of the arrow represents that of shear force. In Figure (c), the resin cement remained on the loading point side. C, ceramic; A, adhesive; R, resin cement.
Figure 4SEM micrographs of the fractured surfaces comparing the adaptation between the adhesive and the ceramic surfaces treated with different procedures: (a) Group B (silane, adhesive that did not contain silane [ANS], and resin cement) before thermocycling. The surface of the lithium disilicate ceramic was flat, and there was no micro-undercut, because hydrofluoric acid (HF) had not been applied. The adhesive and resin cement layers can be discriminated. There were some filler particles in the adhesive layer; (b) Group C (HF, silane, ANS, and resin cement) before thermocycling. The borders of each material were not easily distinguishable because the adhesive had infiltrated the micro-undercut and the fillers were distributed throughout the full thickness of the adhesive; (c) Group E (HF, multi-mode universal adhesive [MUA], and resin cement) before thermocycling. The etched ceramic surface had micro-undercuts and MUA had infiltrated the undercuts. However, there was a gap between the adhesive and the ceramic surface; (d) Group C (HF, silane, ANS, and resin cement) after thermocycling. This had a similar morphology to Figure 4b. Dashed arrow, the interface of the ceramic and adhesive; hollow arrow, the interface of the adhesive and resin cement. C, ceramic; A, adhesive; R, resin cement.
Composition of adhesives according to the material safety data sheets provided by the manufacturers
| Porcelain Bonding Resin (wt%) | Single Bond Universal (wt%) | All-Bond Universal (%) | Clearfil Universal Bond (%) | Adhese Universal (%) | |
|---|---|---|---|---|---|
| Bis-GMA | < 40 | 15 - 20 | 20 - 50 | 15 - 35 | 20 - < 25† |
| Urethane dimethacrylate | < 40 | ||||
| TEGDMA | < 30 | ||||
| HEMA | 15 - 20 | 5 - 25 | 10 - 35 | 20 - < 25† | |
| DGDMA | 5 -15 | ||||
| Ethanol | 10 - 15 | 30 - 50 | < 20 | 10 - 13 | |
| Water | 10 - 15 | * | |||
| MDP | * | 5 - 25 | * | ||
| Silane-treated silica | 5 - 15 | ||||
| 2-propenoic acid, 2-methyl-, reaction products with 1,10-decanediol and phosphorous oxide | 1 - 10 | ||||
| Copolymer of acrylic and itaconic acid | 1 - 5 | ||||
| Dimethylaminobenzoate | < 2 | ||||
| (Dimethylamino) ethyl methacrylate | < 2 | ||||
| Methyl ethyl ketone | < 0.5 | ||||
| Colloidal silica, silane etc. |
Bis-GMA, bisphenol A glycidyl methacrylate; TEGDMA, triethylene glycol dimethacrylate; HEMA, 2-hydroxyethyl methacrylate; DGDMA, decamethylene glycol demethacrylate; MDP, 10-methacryloyloxydecyl dihydrogen phosphate.
*present, but composition information was not provided.
†from 20 or more to less than 25.